Printed circuit board consisting of at least two printed circuit board regions

Patent metadata

Field	Value
Publication number	US-9980380-B2
Application number	US-201615331987-A
Country	US
Kind code	B2
Filing date	Oct 24, 2016
Priority date	Jul 10, 2009
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.

First claim

What is claimed:

1. A printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein the printed circuit board regions to be connected to one another, in a region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, on the printed circuit board regions connected to one another, at least one common additional conductive layer of the printed circuit board is arranged on the printed circuit board regions to be connected to one another, wherein plated-through holes are formed or provided between the common additional conductive layer and in the conductive layers or devices or components integrated in the printed circuit board regions to be connected, wherein at least one common insulating or non-conductive layer is provided between the printed circuit board regions to be connected to one another and the common additional conductive layer, wherein a printed circuit board region is received in an accordingly formed recess or depression of a printed circuit board region to be connected thereto, wherein, in addition to in each case at least one mutually adjoining lateral surface of the printed circuit board regions to be connected to one another, a sheathing of the printed circuit board region to be received is additionally provided on a peripheral surface different from the lateral surface;
wherein the printed circuit board regions to be connected to one another are substantially arranged in a common plane and connected or coupled to one another; and
wherein at least one mutually complementary coupling element is each formed on mutually adjoining lateral surfaces of the printed circuit board regions to be connected to one another, via which coupling element a coupling or connection to the respectively adjoining printed circuit board region is feasible.

2. The printed circuit board according to claim 1 , wherein the common additional conductive layer is designed to be patterned and/or mounted with additional electronic devices or components.

3. The printed circuit board according to claim 1 , wherein an electrical connection of electrically conducting or conductive regions or elements of the printed circuit board regions to be connected to one another and/or layers of additional plies or additional elements is formed by soldering, gluing, welding, riveting or pinning, by vias or passages, conductively made bores, conductive pastes, conductive foils or wires, electronic devices or components or optical connections.

4. The printed circuit board according to claim 1 , wherein the coupling or connection of the printed circuit board regions to be connected to one another is effected by gluing, press-fitting, laminating, bonding, welding, soldering, a galvanic connection and/or by arranging or fixing the components of the printed circuit board.

5. The printed circuit board according to claim 1 , wherein mutually complementary coupling elements are positively designed.

6. The printed circuit board according to claim 1 , wherein the mutually adjoining lateral surfaces of the printed circuit board regions to be connected to one another are formed with mutually complementary profilings in the form of stepped and/or through-going recesses or depressions.

7. The printed circuit board according to claim 1 , wherein recesses or depressions for receiving the printed circuit board regions extend over several layers or plies of multilayer printed circuit board regions.

8. The printed circuit board according to claim 1 , wherein the printed circuit board regions to be connected to one another are formed by flexible, rigid, rigid-flexible or semi-flexible printed circuit board regions and/or high-frequency, HDI, substrate or ceramic printed circuit board regions.

9. The printed circuit board according to claim 1 , wherein, for a rigid-flexible printed circuit board, a flexible printed circuit board region is formed with at least one adjoining transition region of rigid material, and the transition region(s) of rigid material is/are coupled or connected to (at least one) rigid printed circuit board region(s) of the rigid-flexible printed circuit board to be produced of the printed circuit board regions to be connected to one another, via which coupling element a coupling or connection to the respectively adjoining printed circuit board region is feasible.

Assignees

• Austria Tech & System Tech

Inventors

• Pludra Rainer
• Drofenik Dietmar
• Stahr Johannes
• Götzinger Siegfried
• Mareljic Ljubomir

Classifications

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H05K3/225

  Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence) · CPC title

• H05K3/4691

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K2201/0187

  with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties · CPC title

• H05K2201/09163

  Slotted edge · CPC title