Electronic inverter assembly

Patent metadata

Field	Value
Publication number	US-9979320-B2
Application number	US-201615248241-A
Country	US
Kind code	B2
Filing date	Aug 26, 2016
Priority date	Aug 26, 2016
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

First claim

The following is claimed:

1. An electronic inverter assembly, the assembly comprising:
an inverter power module comprising one or more pairs of semiconductor switches mounted on a substrate, each pair of semiconductors comprising a low-side semiconductor switch and a high-side semiconductor switch, each of the semiconductor switches comprising a control terminal and switched terminals;
a first circuit board having an outer side adjacent to or facing the inverter power module and a first inner side opposite the outer side;
a first driver portion comprising a set of first components mounted on or associated with the first circuit board;
a second circuit board spaced apart from the first circuit board, the second circuit board having a second inner side facing the first inner side;
a second driver portion comprising a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch;
a first edge connector mounted on the first inner side of the first circuit board;
a second edge connector mounted on the second inner side of the second circuit board; and
an interface board with mating edges that mate with the first edge connector and the second edge connector; wherein a current sensor comprises:
a magnetic field sensor overlying at least a portion of a plurality of conductive traces of a coil; and
one or more flux concentrators on opposite sides of the magnetic field sensor.

2. The assembly according to claim 1 wherein the first components comprises components with higher temperature operating ranges than the second components.

3. The assembly according to claim 1 wherein the first components have a first temperature operating range of greater than or approximately equal to 150 degrees Celsius.

4. The assembly according to claim 3 wherein the second components have a second temperature operating range of between approximately 125 degrees Celsius and approximately 150 degrees Celsius.

5. The assembly according to claim 1 wherein the interface board comprises a current sensor board with an opening for an output phase terminal of one output phase of a pair of semiconductor switches.

6. The assembly according to claim 1 wherein a current sensor board comprises a plurality of conductive traces that form an inductor or a current-sensing coil for inductively coupling a current sensor on the current sensor board to the output phase terminal.

7. The assembly according to claim 6 wherein the output phase terminal has a cross section that can pass through the opening or a corresponding slit in the inductor or current-sensing coil.

8. The assembly according to claim 1 wherein the current sensor further comprises a plurality of conductive traces that form an inductor or a current-sensing coil for inductively coupling a current sensor on the current sensor board to the output phase terminal.

9. The assembly according to claim 8 wherein a first sensed current from the magnetic field sensor is fused or combined with a second sensed current from the coil, wherein the coil comprises a time-varying flux sensing coil.

10. The assembly according to claim 1 wherein a secondary current sensor is associated with the output phase terminal, the secondary current sensor comprising:
a magnetic field sensor mounted on or near the output phase terminal;
one or more flux concentrators disposed laterally with respect to the magnetic field sensor; and
a multiconductor connector for connecting to the magnetic field sensor.

11. The assembly according to claim 1 wherein the interface board supports low inductance connections for the input signals to the control terminals of the semiconductor switches, where the input signals are generated by the first components and the second components collectively.

12. The assembly according to claim 1 wherein the semiconductor switches comprise silicon carbide or gallium nitride.

13. The assembly according to claim 1 wherein the inverter power module comprises a dual inverter having a primary inverter and a secondary inverter, the primary inverter mounted on a primary substrate that faces a secondary inverter mounted on a secondary substrate.

14. An electronic inverter assembly, the assembly comprising:
an inverter power module comprising one or more pairs of semiconductor switches mounted on a substrate, each pair of semiconductors comprising a low-side semiconductor switch and a high-side semiconductor switch, each of the semiconductor switches comprising a control terminal and switched terminals;
a first circuit board having an outer side adjacent to or facing the inverter power module and a first inner side opposite the outer side;
a first driver portion comprising a set of first components mounted on or associated with the first circuit board;
a second circuit board spaced apart from the first circuit board, the second circuit board having a second inner side facing the first inner side;
a second driver portion comprising a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch;
a first edge connector mounted on the first inner side of the first circuit board;
a second edge connector mounted on the second inner side of the second circuit board; and
an interface board with mating edges that mate with the first edge connector and the second edge connector, wherein the first circuit board has first plurality of first edge connectors on the first inner side, the second circuit board has a second plurality of second edge connectors on the second inner side, and further comprising a plurality of interface boards for interconnecting the first driver portion and the second driver portion.

15. The assembly according to claim 14 wherein the interface board supports low inductance connections for the input signals to the control terminals of the semiconductor switches, where the input signals are generated by the first components and the second components collectively.

Assignees

• Deere & Co

Inventors

• Singh Brij N
• Schmit Christopher J

Classifications

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H05K2201/10166

  Transistor · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title