Optical semiconductor element, optical module, and method for manufacturing optical semiconductor element
US-2024388064-A1 · Nov 21, 2024 · US
US9979159B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9979159-B2 |
| Application number | US-201514873659-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 2, 2015 |
| Priority date | Oct 31, 2014 |
| Publication date | May 22, 2018 |
| Grant date | May 22, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
In a semiconductor laser, a block layer is provided on both sides of a mesa-type semiconductor part having an n-type cladding layer, an active layer, and a p-type cladding layer. The block layer has: a p-type block layer formed on the side surface of the mesa-type semiconductor part and over a p-type semiconductor substrate; a high-resistance layer formed over the p-type block layer; and an n-type block layer formed over the high-resistance layer, which has a higher resistance than that of the p-type block layer. By providing the high-resistance layer between the p-type block layer and the n-type block layer, the thickness of the p-type block layer can be controlled and a leakage current (flow of a hole) can be reduced. Further, the distance between the n-type cladding layer and the n-type block layer can be secured, and hence a leakage current (flow of an electron) can be prevented.
Opening claim text (preview).
What is claimed is: 1. A semiconductor laser comprising: a p-type semiconductor substrate; a convex part provided over the semiconductor substrate; a block layer provided on both sides of the convex part; wherein the convex part has: a p-type compound semiconductor layer formed over the semiconductor substrate; an active layer formed over the p-type compound semiconductor layer; and an n-type compound semiconductor layer formed over the active layer, and wherein the block layer includes: a p-type block layer including a p-type compound semiconductor formed over a side surface of the convex part and over the semiconductor substrate; a first resistive layer formed over the p-type block layer; an n-type block layer including an n-type compound semiconductor formed over the first resistive layer; and a second resistive layer formed over the n-type block layer that contacts and covers a portion of the n-type compound semiconductor layer, wherein the first resistive layer has a resistance larger than that of the p-type block layer, and wherein the n-type compound semiconductor layer covers entire side surfaces of the active layer and a portion of side surfaces of the p-type compound semiconductor layer formed over the substrate. 2. The semiconductor laser according to claim 1 , wherein the first resistive layer is a compound semiconductor into which Fe (iron) has been introduced. 3. The semiconductor laser according to claim 1 , wherein the second resistive layer is a compound semiconductor into which Fe (iron) has been introduced. 4. The semiconductor laser according to claim 1 , wherein a thickness of the p-type block layer is 0.2 μm or less. 5. The semiconductor laser according to claim 1 , wherein a thickness of the p-type block layer is 0.1 μm or less. 6. The semiconductor laser according to claim 1 , wherein each of the p-type compound semiconductor layer and the p-type block layer is InP including a p-type impurity, and wherein each of the n-type compound semiconductor layer and the n-type block layer is InP including an n-type impurity, and wherein the first resistive layer is InP into which Fe (iron) has been introduced. 7. The semiconductor laser according to claim 1 comprising: a layer including an n-type compound semiconductor formed over the convex part and the block layer, wherein a first electrode is formed above the layer, and wherein a second electrode is formed in a rear surface of the semiconductor substrate. 8. The semiconductor laser according to claim 1 , wherein the block layer includes a semiconductor layer selectively grown over the semiconductor substrate.
semi-insulating semiconductors · CPC title
MOCVD or MOVPE · CPC title
Modulation at ultra-high frequencies · CPC title
mesa created by etching · CPC title
having a refractive index lower than that of the cladding layers or outer guiding layers · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.