Semiconductor laser and manufacturing method thereof

US9979159B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9979159-B2
Application numberUS-201514873659-A
CountryUS
Kind codeB2
Filing dateOct 2, 2015
Priority dateOct 31, 2014
Publication dateMay 22, 2018
Grant dateMay 22, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In a semiconductor laser, a block layer is provided on both sides of a mesa-type semiconductor part having an n-type cladding layer, an active layer, and a p-type cladding layer. The block layer has: a p-type block layer formed on the side surface of the mesa-type semiconductor part and over a p-type semiconductor substrate; a high-resistance layer formed over the p-type block layer; and an n-type block layer formed over the high-resistance layer, which has a higher resistance than that of the p-type block layer. By providing the high-resistance layer between the p-type block layer and the n-type block layer, the thickness of the p-type block layer can be controlled and a leakage current (flow of a hole) can be reduced. Further, the distance between the n-type cladding layer and the n-type block layer can be secured, and hence a leakage current (flow of an electron) can be prevented.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor laser comprising: a p-type semiconductor substrate; a convex part provided over the semiconductor substrate; a block layer provided on both sides of the convex part; wherein the convex part has: a p-type compound semiconductor layer formed over the semiconductor substrate; an active layer formed over the p-type compound semiconductor layer; and an n-type compound semiconductor layer formed over the active layer, and wherein the block layer includes: a p-type block layer including a p-type compound semiconductor formed over a side surface of the convex part and over the semiconductor substrate; a first resistive layer formed over the p-type block layer; an n-type block layer including an n-type compound semiconductor formed over the first resistive layer; and a second resistive layer formed over the n-type block layer that contacts and covers a portion of the n-type compound semiconductor layer, wherein the first resistive layer has a resistance larger than that of the p-type block layer, and wherein the n-type compound semiconductor layer covers entire side surfaces of the active layer and a portion of side surfaces of the p-type compound semiconductor layer formed over the substrate. 2. The semiconductor laser according to claim 1 , wherein the first resistive layer is a compound semiconductor into which Fe (iron) has been introduced. 3. The semiconductor laser according to claim 1 , wherein the second resistive layer is a compound semiconductor into which Fe (iron) has been introduced. 4. The semiconductor laser according to claim 1 , wherein a thickness of the p-type block layer is 0.2 μm or less. 5. The semiconductor laser according to claim 1 , wherein a thickness of the p-type block layer is 0.1 μm or less. 6. The semiconductor laser according to claim 1 , wherein each of the p-type compound semiconductor layer and the p-type block layer is InP including a p-type impurity, and wherein each of the n-type compound semiconductor layer and the n-type block layer is InP including an n-type impurity, and wherein the first resistive layer is InP into which Fe (iron) has been introduced. 7. The semiconductor laser according to claim 1 comprising: a layer including an n-type compound semiconductor formed over the convex part and the block layer, wherein a first electrode is formed above the layer, and wherein a second electrode is formed in a rear surface of the semiconductor substrate. 8. The semiconductor laser according to claim 1 , wherein the block layer includes a semiconductor layer selectively grown over the semiconductor substrate.

Assignees

Inventors

Classifications

  • semi-insulating semiconductors · CPC title

  • MOCVD or MOVPE · CPC title

  • Modulation at ultra-high frequencies · CPC title

  • H01S5/2275Primary

    mesa created by etching · CPC title

  • having a refractive index lower than that of the cladding layers or outer guiding layers · CPC title

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Frequently asked questions

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What does patent US9979159B2 cover?
In a semiconductor laser, a block layer is provided on both sides of a mesa-type semiconductor part having an n-type cladding layer, an active layer, and a p-type cladding layer. The block layer has: a p-type block layer formed on the side surface of the mesa-type semiconductor part and over a p-type semiconductor substrate; a high-resistance layer formed over the p-type block layer; and an n-t…
Who is the assignee on this patent?
Renesas Electronics Corp
What technology area does this patent fall under?
Primary CPC classification H01S5/2275. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 22 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).