Socket pin and semiconductor package test system

Patent metadata

Field	Value
Publication number	US-9979150-B2
Application number	US-201615368562-A
Country	US
Kind code	B2
Filing date	Dec 2, 2016
Priority date	Dec 4, 2015
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A socket pin for electrically connecting a semiconductor substrate to a test substrate, comprising: a pin head; a pin body configured to support the pin head; and a length adjusting part provided below the pin body; wherein: the length adjusting part comprises at least a portion protruding from the pin body and a resilient structure; and the length adjusting part is movable to change a length of the portion protruding from the pin body as the resilient structure distorts.

First claim

What is claimed is:

1. A socket pin for electrically connecting a semiconductor substrate to a test substrate, comprising:
a pin head including a first branch electrode and a second branch electrode and a first sliding guide and a second sliding guide connected to the first branch electrode and the second branch electrode in a first direction respectively;
a pin body configured to support the pin head, the pin body including a plate part connecting between a side of the first sliding guide and a side of the second sliding guide, a tail part connected to the plate part in the first direction, and probing guides connected to an end of the tail part in the first direction being separated from the first sliding guide and the second sliding guide; and
a length adjusting part provided on the pin body, the length adjusting part including an elastic hook on the tail part and the plate part, and a probing pin connected to the elastic hook in the first direction, the probing pin disposed between the probing guides,
wherein the elastic hook contacts opposite sides of the first sliding guide and the second sliding guide and slides the opposite sides of the first sliding guide and the second sliding guide to adjust a distance between a tip of probing pin and the probing guides.

2. The socket pin of claim 1 ,
wherein the elastic hook is configured to be insertable into a space between the first sliding guide and the second sliding guide.

3. The socket pin of claim 2 ,
wherein the elastic hook is a rigid body.

4. The socket pin of claim 1 ,
wherein the length adjusting part further comprises a rotation member provided in the pin body to face the probing pin.

5. The socket pin of claim 4 ,
wherein the rotation member comprises:
a rotation bar coupled to the pin body; and
a rotation axis provided at a center of the rotation bar,
wherein an end portion of the probing pin is provided to face a side of the rotation bar.

6. The socket pin of claim 1 ,
wherein the length adjusting part further comprises an elastic element provided in the pin body to face the probing pin.

7. The socket pin of claim 1 ,
wherein the probing guides are configured to support the length adjusting part.

8. The socket pin of claim 3 ,
wherein the probing guides are configured to support the probing pin.

9. A semiconductor package test system, comprising:
a test substrate having a top surface, on which a recess region is formed; and
a test socket provided on the test substrate and configured to receive a semiconductor package;
wherein the test socket comprises:
a base comprising a first through hole; and
a socket pin inserted in the first through hole to electrically connect the test substrate to the semiconductor package,
wherein the socket pin comprises;
a pin head including a first branch electrode and a second branch electrode and a first sliding guide and a second sliding guide connected to the first branch electrode and the second branch electrode in a first direction respectively;
a pin body configured to support the pin head, the pin body including a plate part connecting between a side of the first sliding guide and a side of the second sliding guide, a tail part connected to the plate part in the first direction, and probing guides connected to an end of the tail part in the first direction, the probing guides being separated from the first sliding guide and the second sliding guide; and
a length adjusting part provided on the pin body, the length adjusting part including an elastic hook on the tail part and the plate part, and a probing pin connected to the elastic hook in the first direction, the probing pin disposed between the probing guides,
wherein the elastic hook contacts opposite sides of the first sliding guide and the second sliding guide and slides the opposite sides of the first sliding guide and the second sliding guide to adjust a distance between a tip of probing pin and probing guides.

10. The semiconductor package test system of claim 9 , wherein:
the socket pin comprises:
a pin head configured to contact a first terminal of the semiconductor package; and
a pin body configured to support the pin head; and
the length adjusting part is provided in the pin body and is in contact with a second terminal of the test substrate in the recess region.

11. The semiconductor package test system of claim 10 ,
wherein
the elastic hook is configured to be insertable a space between the first sliding guide and the second sliding guide.

12. The semiconductor package test system of claim 11 ,
wherein the elastic hook includes a rigid body.

13. The semiconductor package test system of claim 10 ,
wherein the pin head is configured to contact with a side of the first terminal.

14. The semiconductor package test system of claim 10 ,
wherein the semiconductor package comprises a ball grid array (BGA) package substrate.

15. The semiconductor package test system of claim 14 , wherein:
the pin head is provided in the form of a letter ‘Y’; and
the first terminal is a ball-shaped terminal that is insertable in the pin head.

16. A socket pin for electrically connecting a semiconductor substrate to a test substrate, comprising:
a pin head;
a pin body configured to be within the pin head and support the pin head;
a length adjusting part provided below the pin body in a lengthwise direction of the pin body, wherein the length adjusting part is partially within the pin head; and
a supporting part connected to the pin body,
wherein the length adjusting part comprises a portion extending through the supporting part and is movable in the lengthwise direction within the supporting part to change a length of the socket pin.

17. The socket pin of claim 16 , wherein:
the length adjusting part further comprises a rotation member provided to face the portion.

Assignees

• Samsung Electronics Co Ltd

Inventors

• HWANG Soongeol
• Iy Hyunguen

Classifications

• H01R2201/20

  for testing or measuring purposes · CPC title

• H01R12/58 Primary

  terminals for insertion into holes · CPC title

• H01R12/526

  the printed circuits being on the same board (with plated through holes H05K3/42) · CPC title

• G01R1/0416 Primary

  Connectors, terminals (G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364) · CPC title

• H01R13/2492

  multiple contact points · CPC title