Thermal radiation microsensor comprising thermoelectric micro pillars

Patent metadata

Field	Value
Publication number	US-9978926-B2
Application number	US-201615136220-A
Country	US
Kind code	B2
Filing date	Apr 22, 2016
Priority date	May 14, 2015
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A thermal radiation microsensor can comprise thermoelectric micro pillars, in which multiple vertically standing thermoelectric micro pillars can act as thermoelectric pairs and mechanical support of an absorption layer. Radiation absorbed by the absorption layer can produce a temperature difference, which drives the thermocouple comprising p-type and n-type micro pillars to output a voltage. Multiple thermocouples can be connected in series to improve the signal output.

First claim

What is claimed is:

1. A thermal radiation sensor apparatus, comprising:
an insulating layer disposed on a substrate;
a thermoelectric layer on the insulating layer, wherein the thermoelectric layer comprises:
vertical free-standing n-type pillars formed from an n-type region, and
vertical free-standing p-type pillars formed from a p-type region, wherein each pillar is monolithically integrated with a flat base, and wherein the vertical free-standing n-type pillars are not in contact with the vertical free-standing p-type pillars;

a first metal layer connecting first tops of the vertical free-standing n-type pillars to second tops of the vertical free-standing p-type pillars;
a second metal layer connecting first bottom bases of the vertical free-standing n-type pillars to second bottom bases of the vertical free-standing p-type pillars, wherein the first bottom bases are wider than the vertical free-standing n-type pillars and the second bottom bases are wider than the vertical free-standing p-type pillars;
a support layer, wherein the support layer stabilizes the first metal layer and the first tops and the second tops, and wherein the support layer is not in contact with the first bottom bases or the second bottom bases; and
a heat generating layer, wherein the heat generating layer generates heat when being exposed to thermal radiation.

2. The thermal radiation sensor apparatus of claim 1 , wherein the vertical free-standing n-type pillars and the vertically standing p-types pillars are formed by an etching process.

3. The thermal radiation sensor apparatus of claim 1 , wherein the second metal layer is deposited on top of the first bottom bases and the second bottom bases.

4. The thermal radiation sensor apparatus of claim 1 , wherein the vertical free-standing n-type pillars and the vertical free-standing p-type pillars are electrically connected alternatively in series.

5. The thermal radiation sensor apparatus of claim 1 , wherein the heat generating layer is on top of the support layer.

6. The thermal radiation sensor apparatus of claim 1 , wherein the heat generating layer and the support layer comprise a same material.

7. A thermal radiation sensor apparatus, comprising:
an insulating layer disposed on a substrate;
a sensor array comprising sensor units, wherein the sensor units comprise:
a thermoelectric layer on the insulating layer, wherein the thermoelectric layer comprises:
n-type pillars formed from an n-type region, wherein the n-type pillars are vertical free-standing n-type pillars, and
p-type pillars formed from a p-type region, wherein the p-type pillars are vertical free-standing p-type pillars, and wherein the n-type pillars and the p-type pillars are monolithically integrated with a flat base;

a first metal layer enclosing first top tips of the n-type pillars and second top tips of p-type pillars;
a second metal layer connecting the first bottom bases of n-type pillars to second bottom bases of p-type pillars, wherein the first bottom bases are larger than the vertical free-standing n-type pillars and the second bottom bases are larger than the vertical free-standing p-type pillars;
a support layer, wherein the support layer stabilizes the first metal layer, and wherein the support layer is not in contact with the first bottom bases or the second bottom bases;
a heat generating layer, wherein the heat generating layer generates heat when exposed to thermal radiation; and
signal output electrodes for outputting pixel data.

8. The thermal radiation sensor apparatus of claim 7 , wherein the vertical free-standing n-type pillars and the vertical free-standing p-type pillars are electrically connected in series.

9. The thermal radiation sensor apparatus of claim 7 , wherein the first metal layer electrically connects the first top tips of the n-type pillars to the second top tips of the p-type pillars.

10. The thermal radiation sensor apparatus of claim 7 , wherein the heat generating layer is on top of the support layer.

11. The thermal radiation sensor apparatus of claim 7 , wherein the heat generating layer and the support layer comprise a same material.

12. The thermal radiation sensor apparatus of claim 7 , wherein the support layer stabilizes the heat generating layer.

13. A thermal radiation sensor apparatus, comprising:
an insulating layer disposed on a substrate;
a sensor array comprising sensor units, wherein the sensor units comprise:
a thermoelectric layer on the insulating layer, wherein the thermoelectric layer comprises:
vertical free-standing n-type pillars formed from an n-type region, and
vertical free-standing p-type pillars formed from a p-type region, wherein the vertical free-standing n-type pillars and the vertical free-standing p-type pillars are monolithically integrated with a flat base;

a first metal layer connecting first top tips of the vertical free-standing n-type pillars to second top tips of the vertical free-standing p-type pillars;
a second metal layer connecting the first bottom bases of vertical free-standing n-type pillars to second bottom bases of the vertical free-standing p-type pillars, wherein the first bottom bases are wider than the vertical free-standing n-type pillars and the second bottom bases are wider than the vertical free-standing p-type pillars;
a heat generating layer, wherein the heat generating layer absorbs thermal radiation, and wherein the heat generating layer converts the thermal radiation to heat; and
a support layer, wherein the support layer stabilizes the first metal layer and the heat generating layer, and wherein the support layer is not in contact with the first bottom bases or the second bottom bases.

14. The thermal radiation sensor apparatus of claim 13 , wherein the n-type region is a patterned region.

15. The thermal radiation sensor apparatus of claim 13 , wherein the p-type region is a patterned region.

16. The thermal radiation sensor apparatus of claim 13 , wherein a first base of a first bottom end of the vertical free-standing n-type pillars is integrated with a second base of a second bottom end of the vertical free-standing p-type pillars.

17. The thermal radiation sensor apparatus of claim 13 , wherein the first metal layer and the second metal layer are patterned metal layers.

18. The thermal radiation sensor apparatus of claim 13 , wherein the sensor array further comprises a sacrificial layer comprising silicon dioxide.

19. The thermal radiation sensor apparatus of claim 13 , wherein the sensor array further comprises a sacrificial layer comprising a polymer.

20. The thermal radiation sensor apparatus of claim 13 , wherein the support layer is below the heat generating layer.

21. The thermal radiation sensor apparatus of claim 13 , wherein the sensor array comprises a signal output electrode for outputting pixel data.

22. The thermal radiation sensor apparatus of claim 13 , wherein the vertical free-standing n-type pillars and the vertical free-standing p-type pillars are formed by a partial etching process.

23. The thermal radiation sensor apparatus of claim 13 , wherein the second metal layer is on top of the first bottom bases.

Assignees

• Univ Hong Kong Sci & Tech

Inventors

• Huang Baoling
• Zhang Peng
• Li Dezhao

Classifications

• G01J5/0853

  having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid · CPC title

• G01J5/12

  using thermoelectric elements, e.g. thermocouples · CPC title

• H01L35/325 Primary

  Electricity · mapped topic

• G01J5/024 Primary

  Special manufacturing steps or sacrificial layers or layer structures · CPC title

• H10N19/101 Primary

  Multiple thermocouples connected in a cascade arrangement · CPC title