Flexible packaging for microelectronic devices

Patent metadata

Field	Value
Publication number	US-9978895-B2
Application number	US-201314068189-A
Country	US
Kind code	B2
Filing date	Oct 31, 2013
Priority date	Oct 31, 2013
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

First claim

What is claimed is:

1. A flexible microsystems enabled microelectronic device package comprising:
a substrate comprising polyimide, polyethersulfone, or polyether ether ketone;
a microelectronic device disposed on the substrate and electrically connected to circuitry disposed on the substrate;
an encapsulation layer encapsulating the microelectronic device and the substrate, wherein the encapsulation layer comprises silicone, polydimethylsiloxane, ethylene vinyl acetate, polyurethane, polyolefin, polyester, nylon, or acrylic;
a front protective layer positioned over the encapsulating layer on a side of the encapsulating layer opposite to the substrate, a rear protective layer positioned beneath the substrate on a side of the substrate opposite to the encapsulation layer, and a perimeter protective layer positioned around the encapsulating layer; and
a reinforcing layer coupled to the rear protective layer,
wherein:
the front protective layer, the rear protective layer, and the perimeter protective layer are all made up of substantially the same material and are joined together such that they collectively define an all-around barrier;
the all-around barrier includes a plastic weld joint that seals the front protective layer to the perimeter protective layer and a plastic weld joint that seals the rear protective layer to the perimeter protective layer;
the perimeter protective layer surrounds and abuts the substrate; and
the reinforcing layer is coupled to a side of the rear protective layer opposite to the substrate.

2. The device package of claim 1 wherein the microelectronic device is a first photovoltaic solar cell, the device package further comprising a second photovoltaic solar cell.

3. The device package of claim 1 wherein the encapsulating layer is an optically transparent encapsulating layer capable of transmitting light waves to the microelectronic device.

4. The device package of claim 1 wherein the encapsulation layer comprises a silicone material.

5. The device package of claim 1 wherein the all-around barrier comprises a moisture resistant material that protects the microelectronic device from moisture.

6. The device package of claim 1 wherein the all-around barrier comprises a thermoplastic material.

7. The advice package of claim 1 wherein the reinforcing layer comprises a fiber reinforced material that is substantially abrasion and penetration resistant.

8. The device package of claim 1 wherein a thickness of the package is less than 3 millimeters.

9. The device package of claim 1 wherein the all-around barrier has a composition selected from the group consisting of polychorotrifluoroethylene, polytetrafluoroethylene, ethylene chorotrifluoroethylene, ethylene tetrafluoroethylene and polyvinylidene difluoride.

10. The device package of claim 1 wherein the reinforcing layer comprises a material selected from one of Vectran, polyester, aramid, twaron, Kevlar, Spectra, polyethylene, carbon fiber, polyesters, nylon, acrylic Marko, Marlan and Nomex.

11. The device package of claim 1 wherein the perimeter protective layer is separate and distinct from the encapsulation layer.

12. The device package of claim 1 wherein the perimeter protective layer is made up of only one type of material.

13. The device package of claim 1 wherein the perimeter protective layer is deposited separately from the encapsulation layer.

14. The device package of claim 1 wherein the perimeter protective layer includes no portion deposited as the encapsulation layer.

15. The device package of claim 1 wherein the perimeter protective layer includes no portion deposited substantially contemporaneously with the encapsulation layer.

16. The device package of claim 1 wherein the perimeter protective layer is formed around a perimeter of the encapsulation layer which remains exposed after application of the front protective layer.

17. The device package of claim 1 wherein the perimeter protective layer is formed from a film which has a cut out center.

18. The device package of claim 17 wherein the perimeter protective layer is sealed against the front protective layer by one of ultrasonic welding and thermal welding.

19. The device package of claim 1 wherein the perimeter protective layer is one of at least a sealant tape and a sealant bead applied around that is sealed to the front protective layer.

20. The device package of claim 1 wherein the front protective layer, the rear protective layer, and the perimeter protective layer are all made up of one of the group consisting of polychlorotrifluoroethylene (PCTFE), polytetrafluoroethylene (PTFE), ethylene chlorotrifluoroethylene (ECTFE), ethylene tetrafluoroethylene (ETFE), and polyvinylidene difluoride (PVDF).

Assignees

• Nat Tech & Eng Solutions Sandia Llc

Inventors

• Anderson Benjamin John
• Nielson Gregory N
• Cruz-Campa Jose Luis
• Okandan Murat
• Lentine Anthony L
• Resnick Paul J

Classifications

• H01L31/1892

  Electricity · mapped topic

• H01L31/048 Primary

  Electricity · mapped topic

• Y02E10/50

  Photovoltaic [PV] energy · CPC title

• H01L31/049

  Electricity · mapped topic

• H10F71/139

  using temporary substrates · CPC title