Display apparatus and fabricating method thereof

Patent metadata

Field	Value
Publication number	US-9978728-B2
Application number	US-201715603482-A
Country	US
Kind code	B2
Filing date	May 24, 2017
Priority date	May 25, 2016
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.

First claim

What is claimed is:

1. A display apparatus, comprising:
a substrate;
a light emitting diode having a first surface and a second surface opposite each other, wherein the first surface faces the substrate;
a first bump, wherein the light emitting diode is electrically connected to the substrate through the first bump;
a first insulating layer disposed on a periphery of the first bump and the light emitting diode, and contacting the first bump and the first surface; and
a second insulating layer disposed on the substrate and surrounding at least a portion of the first insulating layer.

2. The display apparatus according to claim 1 , wherein the substrate further comprises at least one first electrode, and the light emitting diode is electrically connected to the corresponding first electrode through the first bump.

3. The display apparatus according to claim 2 , wherein the substrate further comprises at least one second electrode, and the first electrode and the second electrode are electrically connected to the same side of the light emitting diode.

4. The display apparatus according to claim 3 , further comprising a second bump, wherein the light emitting diode is electrically connected to the first electrode through the first bump and electrically connected to the second electrode through the second bump, and the first insulating layer is disposed between the first bump and the second bump that are adjacent to each other.

5. The display apparatus according to claim 4 , wherein the first insulating layer fills a space formed between the light emitting diode, the first bump and the second bump.

6. The display apparatus according to claim 5 , wherein the first insulating layer fills a gap between the first electrode and the second electrode.

7. The display apparatus according to claim 3 , wherein the first insulating layer contacts at least a portion of the substrate.

8. The display apparatus according to claim 2 , wherein at least one of the first insulating layer and the second insulating layer covers the at least one first electrode.

9. The display apparatus according to claim 2 , wherein the substrate further comprises at least one second electrode, and the first electrode and the second electrode are located on two opposite sides of the light emitting diode.

10. The display apparatus according to claim 9 , wherein the second insulating layer exposes the second electrode.

11. The display apparatus according to claim 1 , wherein the first insulating layer surrounds at least a portion of a sidewall of the light emitting diode.

12. The display apparatus according to claim 1 , wherein the second insulating layer surrounds at least a portion of the first insulating layer.

13. The display apparatus according to claim 1 , wherein a material of the first insulating layer and the second insulating layer comprises a gel or a resin, and a material of the second insulating layer comprises a transparent material, a black material or a white material.

14. The display apparatus according to claim 1 , wherein the light emitting diode exhibit a maximum elevation with respect to the substrate; and a top surface of the second insulating layer is not higher than the maximum elevation.

15. The display apparatus according to claim 1 , wherein the light emitting diode exhibit a maximum elevation with respect to the substrate; and a top surface of the second insulating layer is higher than the maximum elevation.

16. A fabricating method of a display apparatus, comprising:
forming at least one first bump on a light emitting diode and the first bump electrically connected to the light emitting diode;
forming a first insulating layer, wherein the first insulating layer is disposed on at least a periphery of the first bump and contacts the first bump, and surrounds at least a portion of the light emitting diode;
bonding the first bump of the light emitting diode to a first electrode of a substrate, so as to bond the light emitting diode to the substrate; and
forming a second insulating layer on the substrate, wherein the second insulating layer surrounds at least a portion of the light emitting diode.

17. The fabricating method of a display apparatus according to claim 16 , wherein the light emitting diode, the first bump and the first insulating layer are formed on an epitaxial substrate, and the fabricating method further comprises, before the bonding step, separating the light emitting diode, the first bump and the first insulating layer from the epitaxial substrate.

18. The fabricating method of a display apparatus according to claim 16 , further comprising performing a heating process on the first bump and the first electrode during the bonding step.

19. The fabricating method of a display apparatus according to claim 16 , wherein a portion of the first insulating layer is formed around a sidewall of the light emitting diode.

20. The fabricating method of a display apparatus according to claim 16 , further comprising forming on the second insulating layer a second electrode of the substrate, wherein the second electrode is electrically connected to the light emitting diode.

Assignees

• Innolux Corp
• Advanced Optoelectronic Tech
• Advanced Optoelectronics Tech Inc

Inventors

• Lin Chun-Hsien
• Hsieh Tsau-Hua
• Tu Po-Min
• Hung Tzu-Chien
• Peng Chien-Chung
• Huang Shih-Cheng

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H01L33/54

  Electricity · mapped topic

• H01L25/0753 Primary

  Electricity · mapped topic

• H01L25/167

  Electricity · mapped topic

• H01L25/0756

  Electricity · mapped topic