Polycrystalline diamond compact cutting elements and earth-boring tools including polycrystalline diamond cutting elements

Patent metadata

Field	Value
Publication number	US-9976355-B2
Application number	US-201514867368-A
Country	US
Kind code	B2
Filing date	Sep 28, 2015
Priority date	Sep 16, 2011
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

Methods of attaching a polycrystalline diamond compact (PDC) element to a substrate include maintaining a gap between the PDC element and an adjacent substrate, and at least substantially filling the gap with a deposition process. Methods of forming a cutting element for an earth-boring tool include forming a PDC element by pressing diamond crystals together, forming a substrate including a particulate carbide material and a matrix material, leaving a gap between at least portions of the PDC element and the substrate, masking surfaces of the PDC element and of the substrate that do not face the gap, and forming an adhesion material on surfaces of the PDC element and of the substrate that face the gap. Cutting elements for earth-boring tools include a PDC element attached to a substrate with at least one of diamond, diamond-like carbon, a carbide material, a nitride material, and a cubic boron nitride material.

First claim

What is claimed is:

1. A cutting element for an earth-boring tool, the cutting element comprising:
a substrate;
a polycrystalline diamond compact element attached to the substrate; and
an adhesion material between the polycrystalline diamond compact element and the substrate, the adhesion material separate and distinct from the polycrystalline diamond compact element and the substrate, the adhesion material formed between the polycrystalline diamond compact element and the substrate by a deposition process and consisting essentially of at least one of diamond, diamond-like carbon, a carbide material, a nitride material, and a cubic boron nitride material, wherein a laterally central portion of the polycrystalline diamond compact element contacts the substrate, the adhesion material disposed between the polycrystalline diamond compact element and the substrate at other portions thereof.

2. The cutting element of claim 1 , further comprising another polycrystalline diamond compact element and another adhesion material, the another polycrystalline diamond compact element attached to the polycrystalline diamond compact element with the another adhesion material.

3. The cutting element of claim 1 , wherein the polycrystalline diamond compact element comprises a silicon material in interstitial spaces between grains of diamond of the polycrystalline diamond compact element.

4. The cutting element of claim 1 , wherein the polycrystalline diamond compact element is formed by forming inter-granular diamond bonds in the presence of a catalyst material and removing at least a portion of the catalyst material from interstitial spaces between grains of the polycrystalline diamond compact.

5. The cutting element of claim 1 , wherein the polycrystalline diamond compact element is separated by a distance from the substrate, wherein the distance varies substantially linearly across opposing surfaces of the polycrystalline diamond compact element and the substrate.

6. The cutting element of claim 5 , wherein the distance is greater at outer regions of the polycrystalline diamond compact element and the substrate than at inner regions thereof.

7. The cutting element of claim 1 , wherein the polycrystalline diamond compact element is separated by a distance from the substrate, wherein the distance is substantially uniform across opposing surfaces of the polycrystalline diamond compact element and the substrate.

8. The cutting element of claim 1 , wherein the polycrystalline diamond compact element is separated by a distance of between about 1 μm and about 160 μm from the substrate.

9. The cutting element of claim 1 , wherein a portion of an interface between the polycrystalline diamond compact element and the adhesion material is parallel to an interface between the substrate and the adhesion material and at least another portion of the interface between the polycrystalline diamond compact element and the adhesion material is tapered relative to the interface between the substrate and the adhesion material.

10. The cutting element of claim 1 , wherein the adhesion material consists essentially of a metal carbide or a silicon carbide.

11. The cutting element of claim 1 , wherein the adhesion material consists essentially of tungsten carbide.

12. The cutting element of claim 1 , wherein each of the polycrystalline diamond compact element and the substrate comprises through holes filled with the adhesion material.

13. The cutting element of claim 1 , wherein opposing surfaces of the polycrystalline diamond compact element and the substrate are etched or scratched.

14. An earth-boring tool for drilling subterranean formations, the earth-boring tool comprising:
a bit body; and
a cutting element comprising:
a substrate attached to the bit body;
a polycrystalline diamond compact element attached to the substrate, the polycrystalline diamond compact element separated by a distance from the substrate, wherein the distance varies substantially linearly across opposing surfaces of the polycrystalline compact element and the substrate, wherein the distance is greater at outer regions of the polycrystalline diamond compact element and the substrate than at inner regions thereof; and
an adhesion material between the polycrystalline diamond compact element and the substrate, the adhesion material separate and distinct from the polycrystalline diamond compact element and the substrate, the adhesion material formed between the polycrystalline diamond compact element and the substrate by a deposition process and consisting essentially of at least one of diamond, diamond-like carbon, a carbide material, a nitride material, and a cubic boron nitride material, the adhesion material disposed between and in contact with the polycrystalline diamond compact element and the bit body.

15. The earth-boring tool of claim 14 , wherein the polycrystalline diamond compact element comprises silicon carbide.

16. The earth-boring tool of claim 14 , wherein the polycrystalline diamond compact element comprises a textured surface.

17. A cutting element for an earth-boring tool, the cutting element comprising:
a substrate;
a polycrystalline diamond compact element attached to the substrate; and
an adhesion material between the polycrystalline diamond compact element and the substrate, the adhesion material separate and distinct from the polycrystalline diamond compact element and the substrate, the adhesion material formed between the polycrystalline diamond compact element and the substrate by a deposition process and consisting essentially of at least one of diamond, diamond-like carbon, a carbide material, a nitride material, and a cubic boron nitride material, wherein each of the polycrystalline diamond compact element and the substrate comprises through holes filled with the adhesion material.

Assignees

• Baker Hughes Inc
• Baker Hughes A Ge Co Llc

Inventors

• Vempati Chaitanya K
• Patel Suresh G

Classifications

• C23C16/56

  After-treatment · CPC title

• C22C2204/00

  End product comprising different layers, coatings or parts of cermet · CPC title

• C23C16/50

  using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)} · CPC title

• C23C16/342

  Boron nitride · CPC title

• E21B10/5735 Primary

  Interface between the substrate and the cutting element · CPC title