Method for laying parquet flooring with improved dimensional stability

US9976313B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9976313-B2
Application numberUS-201113996032-A
CountryUS
Kind codeB2
Filing dateNov 25, 2011
Priority dateDec 22, 2010
Publication dateMay 22, 2018
Grant dateMay 22, 2018

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

1) Moisture-crosslinkable adhesive composition comprising: from 25% to 50% of a composition (a) formed of a crosslinkable epoxy resin and of a polymer having a polyoxyalkylene or polyurethane main chain connected to a hydrolyzable terminal alkoxysilyl group; from 0.5% to 6% of a ketimine (b); and from 40% to 65% of an inert inorganic or organic filler (c). 2) Method for laying a wood-based covering, in particular a wide-block parquet flooring, on a flat rigid support comprising the distribution of an effective amount of said adhesive composition in the form of a substantially homogeneous layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A moisture-crosslinkable adhesive composition comprising: from 25% to 50% of a composition (a): of 5% to 37% weight/weight of a crosslinkable epoxy resin (a1) of bisphenol A type, and of 63% to 95% weight/weight of a polymer (a2) comprising a main chain of (i) a polyoxyalkylene or (ii) a polyurethane, which is connected to two hydrolyzable terminal alkoxysilyl groups, said groups being bonded, in the case of a main chain (i), to a methylene radical which is itself bonded to the ends of the chain (i) by a divalent group A having one of the following formulae: —O—CO—NH—  (Ia); —NR 1 —CO—NH—  (Ib), in which R 1 represents a hydrogen atom or a C 1 -C 3 alkyl radical; and —S—CO—NH—  (Ic); from 0.5% to 6% of a ketimine (b) as precursor of a crosslinking agent for the epoxy resin (a1); and from 40% to 65% of an inert inorganic or organic filler (c); the contents of ingredients (a), (b) and (c) being expressed as weight/weight percentages with respect to the total weight of said adhesive composition, wherein the hydrolysable terminal alkoxysilyl groups have the formula: —Si(R 2 ) p (OR 3 ) 3−p   (II) in which: each R 2 and R 3 independently represents a linear or branched alkyl radical of 1 to 4 carbon atoms; and P=1. 2. The adhesive composition as claimed in claim 1 , wherein crosslinkable epoxy resin (a1), is bisphenol A diglycidyl ether of formula: 3. The adhesive composition as claimed in claim 1 , wherein the polymer (a2) has a polypropylene glycol main chain (i) and the divalent group A is of formula (Ia). 4. The adhesive composition as claimed in claim 1 , wherein the polymer (a2) has a polyurethane (ii) for main chain. 5. The adhesive composition as claimed in claim 1 , wherein the content of crosslinkable epoxy resin (a1) included in the composition (a) is 10% to 33% and the content of polymer (a2) in this same composition is 67% to 90%. 6. The adhesive composition as claimed in claim 1 , wherein the ketimine (b) has the formula: (R 6 R 7 C═N) q R 5   (IV) in which: R 5 is an organic radical having from 1 to 3 free valences; R 6 and R 7 , which are identical or different, represent a hydrogen atom, a phenyl group or an alkyl group having 1 to 6 carbon atoms, which is optionally substituted; q is an integer equal to 1, 2 or 3. 7. The adhesive composition as claimed in claim 6 , wherein the ketimine (b) has formula (IV) in which q is equal to 2, R 5 is a divalent radical derived from isophorone, R 6 is methyl and R 7 is isobutyl. 8. The adhesive composition as claimed in claim 6 , wherein R 5 is optionally substituted C 1-12 -alkyl or C 6-24 -aryl. 9. The adhesive composition as claimed in claim 1 , wherein the inorganic filler (c) is calcium carbonate or a fumed silica. 10. The adhesive composition as claimed in claim 1 , comprising: a content of the composition (a) of 30% to 40%; a content of ketimine (b) of 1% to 5%; and a content of the inorganic filler (c) of 50% to 60%. 11. The adhesive composition as claimed in claim 1 , wherein the polymer (a2) has a polyoxyalkylene (i) for main chain and divalent group A is of formula (Ia). 12. The adhesive composition as claimed in claim 1 , wherein polymer (a2) has the formula (R 3 O) 2 (R 2 )Si—CH 2 —NH—C(O)—O-polyoxyalkylene-C(O)NH—CH 2 —Si(R 2 )(OR 3 ) 2 wherein each R 2 and R 3 independently represents a linear or branched alkyl radical comprising 1 to 4 carbon atoms; and wherein the polyoxyalkylene corresponds to a repeat unit of —R 4 —O—, in which R 4 represents a linear or branched alkylene comprising from 1 to 5 carbon atoms. 13. A method for laying a wood-based covering on a flat rigid support, comprising distributing, over the surface of said support, an effective amount of the adhesive composition as defined in claim 1 . 14. The laying method as claimed in claim 13 , wherein the wood-based covering is a parquet flooring. 15. The laying method as claimed in claim 13 , wherein the adhesive composition is distributed over the support in the form of a substantially homogeneous layer. 16. An assemblage comprising a flat rigid support covered with a wood-based covering via a substantially homogeneous layer of the adhesive composition, as defined in claim 1 , which is crosslinked and forms an adhesive joint. 17. The assemblage as claimed in claim 16 , wherein the covering is a parquet flooring that can be used as a floor.

Assignees

Inventors

Classifications

  • C08G59/245Primary

    aromatic · CPC title

  • containing silicon · CPC title

  • Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • Polyurethanes · CPC title

  • Polyalkylene oxides · CPC title

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What does patent US9976313B2 cover?
1) Moisture-crosslinkable adhesive composition comprising: from 25% to 50% of a composition (a) formed of a crosslinkable epoxy resin and of a polymer having a polyoxyalkylene or polyurethane main chain connected to a hydrolyzable terminal alkoxysilyl group; from 0.5% to 6% of a ketimine (b); and from 40% to 65% of an inert inorganic or organic filler (c). 2) Method fo…
Who is the assignee on this patent?
Verscheure Eric, Nery Laurent, Bostik Sa
What technology area does this patent fall under?
Primary CPC classification C08G59/245. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 22 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).