Partial spray refurbishment of sputtering targets

Patent metadata

Field	Value
Publication number	US-9976212-B2
Application number	US-201414908396-A
Country	US
Kind code	B2
Filing date	Jul 31, 2014
Priority date	Aug 1, 2013
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

In various embodiments, eroded sputtering targets are partially refurbished by spray-depositing particles of target material to at least partially fill certain regions (e.g., regions of deepest erosion) without spray-deposition within other eroded regions (e.g., regions of less erosion). The partially refurbished sputtering targets may be sputtered after the partial refurbishment without substantive changes in sputtering properties (e.g., sputtering rate) and/or properties of the sputtered films.

First claim

What is claimed is:

1. A method of refurbishing an eroded sputtering target while minimizing material consumption, the eroded sputtering target (a) having a surface contour defining (i) an upper surface level, (ii) a first eroded region having a surface depth recessed below the upper surface level, and (iii) a second eroded region having a surface depth deeper than the surface depth of the first eroded region, and (b) comprising a target material, the method comprising:
identifying one or more characteristics of the second eroded region;
spray-depositing particles of the target material to at least partially fill the second eroded region; and
during spray deposition of particles of the target material, preventing deposition of particles of the target material in the first eroded region, whereby the surface depth of the first eroded region remains recessed below the upper surface level thereafter.

2. The method of claim 1 , wherein the one or more characteristics of the second eroded region comprise at least one of a difference between the surface depth of the second eroded region and the upper surface level, a shape of the surface contour of the eroded sputtering target in the second eroded region, or a difference between the surface depth of the second eroded region and the surface depth of the first eroded region.

3. The method of claim 1 , wherein preventing deposition of particles of the target material in the first eroded region comprises disposing a mask over at least a portion of the eroded sputtering target, the mask defining one or more openings that reveal the second eroded region.

4. The method of claim 3 , wherein (i) during spray deposition, particles of the target material are deposited over the mask, and (ii) after spray deposition, the particles of the target material deposited over the mask are recovered for future use.

5. The method of claim 1 , wherein preventing deposition of particles of the target material in the first eroded region comprises programming an automated spraying apparatus to spray particles of the target material from a spray gun only when the spray gun is disposed over the second eroded region.

6. The method of claim 1 , wherein preventing deposition of particles of the target material in the first eroded region comprises translating a hand-held spray gun over only the second eroded region when the spray gun is spraying particles of the target material.

7. The method of claim 1 , further comprising sputtering the sputtering target after spray deposition without deposition of target material in the first eroded region therebetween.

8. The method of claim 7 , wherein no surface grinding or polishing is performed on the sputtering target between the spray deposition and the sputtering.

9. The method of claim 1 , wherein spray-depositing particles of the target material comprises cold spraying.

10. The method of claim 1 , wherein the target material comprises at least one of Mo, Ti, Mo/Ti, Nb, Ta, W, Zr, a mixture of two or more thereof or one or more thereof with one or more other metals, or an alloy of two or more thereof or one or more thereof with one or more other metals.

11. The method of claim 1 , wherein the target material comprises at least one of Al, Cu, Ag, Au, Ni, a mixture of two or more thereof or one or more thereof with one or more other metals, or an alloy of two or more thereof or one or more thereof with one or more other metals.

12. The method of claim 1 , wherein, before spray deposition, a volume of the second eroded region is less than a volume of the first eroded region.

13. The method of claim 1 , further comprising annealing at least the spray-deposited particles that are at least partially filling the second eroded region.

14. The method of claim 1 , wherein:
the eroded sputtering target comprises a target plate of the target material and, affixed to the target plate, a backing plate comprising a backing-plate material different from the target material, and
the particles of the target material are spray deposited on the target plate while the target plate is affixed to the backing plate.

15. The method of claim 14 , wherein the target plate is affixed to the backing plate with a bonding agent.

16. The method of claim 15 , wherein a melting point of the bonding agent is less than approximately 200° C.

17. The method of claim 15 , wherein the bonding agent comprises indium solder.

18. The method of claim 14 , wherein the backing-plate material comprises at least one of copper, aluminum, or steel.

19. The method of claim 1 , wherein the particles of the target material are spray deposited with a spraying apparatus comprising a hand-held spray gun.

20. The method of claim 1 , wherein:
the eroded sputtering target comprises a rectangular target plate of the target material having first and second opposing ends;
the first eroded region defines an annulus, the surface contour of at least a portion of a center of the annulus corresponding to the upper surface level; and
the second eroded region comprises (i) a first end portion of the annulus defined by the first eroded region proximate the first end of the target plate and (ii) a second end portion of the annulus defined by the first eroded region proximate the second end of the target plate.

21. The method of claim 1 , wherein the particles of the target material are spray-deposited via a jet of sprayed particles, an obliquity angle between the jet and the surface contour within the second eroded region being between approximately 45° and approximately 90°.

22. The method of claim 21 , wherein the obliquity angle is between approximately 60° and approximately 90°.

23. The method of claim 1 , wherein the second eroded region is filled with the particles of the target material at least to the surface depth of the first eroded region.

24. The method of claim 1 , wherein the second eroded region is filled with the particles of the target material at least to the upper surface level.

Assignees

• Starck H C Inc

Inventors

• Miller Steven A

Classifications

• H01J37/3417

  Arrangements · CPC title

• C23C24/04

  Impact or kinetic deposition of particles · CPC title

• C23C14/3414 Primary

  Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

• H01J37/3426

  Material · CPC title

• H01J2237/081

  Sputtering sources · CPC title