MEMS sensor device package housing with an embedded controllable device

Patent metadata

Field	Value
Publication number	US-9975760-B2
Application number	US-201615195061-A
Country	US
Kind code	B2
Filing date	Jun 28, 2016
Priority date	Jun 28, 2016
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A microelectromechanical system (MEMS) sensor device includes a package housing having a top member, bottom member, and a spacer coupled the top member to the bottom member, defining a cavity. At least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing. A first opening formed on the package housing a control device embedded within the package housing is electrically coupled to the sensor circuit and is controlled to tune the MEMS sensor from a directional mode to an omni-directional mode.

First claim

What is claimed is:

1. A microelectromechanical system (MEMS) sensor device comprising:
a package housing having a top member, a bottom member, and a spacer coupled to the top member and to the bottom member, the package housing defining a cavity;
at least one sensor circuit and a MEMS sensor disposed within the cavity of the package housing;
a first opening formed on the package housing;
a second opening formed on the package housing;
a first control device embedded within the package housing; and
a second control device disposed within the second opening for damping acoustic signals fluidly coupled to the MEMS sensor,
wherein the first control device is configured to tune the MEMS sensor from a directional mode to an omni-directional mode.

2. The MEMS sensor device of claim 1 further comprising the first control device embedded within at least one of the top member, the bottom member, or the spacer.

3. The MEMS sensor device of claim 1 wherein the first and second control devices are electrically coupled to the sensor circuit.

4. The MEMS sensor device of claim 3 wherein the first and second control devices are selected from a group consisting of piezoelectric moving device, rotating device, a flap, and movable membrane.

5. The MEMS sensor device of claim 1 further comprising a processor, a user input interface, and a computer implemented device, wherein at least one of the processor, the user input interface, and the computer implemented device is electrically coupled to at least one of the first and second control devices.

6. A method of manufacturing a package housing for a MEMS sensor device comprising:
providing a top member, a bottom member, and a spacer;
providing a first opening within at least one of the top member, the bottom member, and the spacer;
providing a second opening within at least one of the top member, the bottom member, and the spacer;
mounting a sensor circuit and a MEMS sensor to at least one of the top member, the bottom member, and the spacer;
securing the spacer to the top and bottom members;
providing a first control device within at least one of the top member, the bottom member, or the spacer;
and providing a second control device within the second opening for damping acoustic signals fluidly coupled to the MEMS sensor.

7. The method of claim 6 wherein the first and second control devices are electrically coupled to the sensor circuit.

8. The method of claim 6 wherein:
the MEMS sensor device includes a processor, a user input interface, and a computer implemented device, and
at least one of the processor, the user input interface, and the computer implemented device is electrically coupled to at least one of the first and second control devices.

9. The method of claim 8 wherein the first and second control devices are selected from a group consisting of piezoelectric moving device, rotating device, a flap, and movable membrane.

10. A microelectromechanical system (MEMS) sensor device comprising:
a package housing having a top member, a bottom member, and a spacer coupled to the top member and to the bottom member, the package housing defining a cavity;
at least one MEMS sensor disposed within the cavity of the package housing;
a first opening formed on the package housing;
a second opening formed on the package housing; and
a first and a second control device embedded within the second opening,
wherein the second control device is configured for damping acoustic signals fluidly coupled to the MEMS sensor, and
wherein one of the first and second control devices is configured to tune the MEMS sensor from a directional mode to an omni-directional mode.

11. The MEMS sensor device of claim 10 wherein the first control device is located directly below the MEMS sensor and the second control device is proximal to the first control device, is located outside, and is not covered by the MEMS sensor.

12. The method of claim 11 wherein the first and second control devices are selected from a group consisting of piezoelectric moving device, rotating device, a flap, and movable membrane.

13. The MEMS sensor device of claim 12 further comprising a circuit communicatively coupled to the first and second control devices to tune the MEMS sensor from directional mode to omni-directional mode.

14. The MEMS sensor device of claim 13 wherein the circuit is selected from a group consisting of a processor, a user input interface, and a computer implemented device.

15. The MEMS sensor device of claim 14 wherein the circuit is disposed in the cavity of the package housing.

16. The MEMS sensor device of claim 14 wherein the circuit is located outside the package housing.

Assignees

• Bosch Gmbh Robert

Inventors

• Suvanto Mikko Va

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• B81B2201/0214

  Biosensors; Chemical sensors · CPC title

• B81B2201/0278

  Temperature sensors · CPC title