Printed board, electronic device, and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-9974184-B2
Application number	US-201615355559-A
Country	US
Kind code	B2
Filing date	Nov 18, 2016
Priority date	Feb 29, 2016
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A printed board includes: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole.

First claim

What is claimed is:

1. A printed board comprising: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a first conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole wherein a first area of the depression at the one surface of the board is larger than a second area of the depression at the bottom portion in such a manner that the depression has a tapered shape, wherein the first conductor is formed on an inner surface of the depression in a vicinity of the bottom portion on an open hole side and is not formed on the inner surface of the depression in the vicinity of an opening portion of the depression on a one surface side of the board.

2. The printed board according to claim 1 , wherein an insulator is exposed at a portion of the open hole other than the edge of the opening portion.

3. The printed board according to claim 1 , wherein in a state in which a terminal of an electronic component is inserted into the open hole from a side opposite the depression, the depression has a depth in which a tip of the terminal is present inside the depression.

4. The printed board according to claim 1 , wherein the board includes a plate-shaped base containing an insulator, second conductors provided on respective surfaces of the plate-shaped base and resist layers which covers the respective second conductors.

5. The printed board according to claim 4 , wherein one of the second conductors provided on a side of the one surface of the board is covered by one of the resist layers and the first conductor.

6. An electronic device comprising: a printed board including a depression formed in at least one surface of the printed board, an open hole formed in the printed board so as to penetrate the printed board from a bottom portion of the depression, and a first conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole; an electronic component including a terminal which is inserted into the open hole from a side opposite the depression; and solder that fills a gap between the terminal and the first conductor, wherein a first area of the depression at the one surface of the printed board is larger than a second area of the depression at the bottom portion in such a manner that the depression has a tapered shape, wherein the first conductor is formed on an inner surface of the depression in a vicinity of the bottom portion on an open hole side and is not formed on the inner surface of the depression in the vicinity of an opening portion of the depression on a one surface side of the printed board.

7. The electronic device according to claim 6 , wherein an insulator is exposed at a portion of the open hole other than the edge of the opening portion.

8. The electronic device according to claim 6 , wherein in a state in which a terminal of the electronic component is inserted into the open hole from a side opposite the depression, the depression has a depth in which a tip of the terminal is present inside the depression.

9. The electronic device according to claim 6 , wherein the printed board includes a plate-shaped base containing an insulator, second conductors provided on respective surfaces of the plate-shaped base and resist layers which covers the respective second conductors.

10. The electronic device according to claim 9 , wherein one of the second conductors provided on a side of the one surface of the printed board is covered by one of the resist layers and the first conductor.

Assignees

• Fujitsu Ltd

Inventors

• Hayashi Mitsuaki
• Saito Osamu
• Okada Akira
• Hayama Junichi

Classifications

• H05K3/0044

  Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence) · CPC title

• H05K1/183 Primary

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K3/34

  by soldering · CPC title

• H05K1/184 Primary

  associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title