Miniature high density opto-electronic package

Patent metadata

Field	Value
Publication number	US-9974163-B2
Application number	US-201213729518-A
Country	US
Kind code	B2
Filing date	Dec 28, 2012
Priority date	Dec 28, 2012
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.

First claim

What is claimed is:

1. An apparatus comprising:
an opto-electronic package comprising a plurality of first electrodes and a plurality of optical components, wherein the package is configured for transmission of optical and electrical signals;
a circuit comprising a plurality of second electrodes;
an anisotropic conductive film (ACF) compressed between at least a portion of the opto-electronic package and at least a portion of the circuit, wherein at least one of the first electrodes is mechanically coupled to at least one of the second electrodes via the ACF;
a plurality of conductive traces are configured to connect the optical components and the first electrodes, wherein a first plurality of the conductive traces fan out in parallel in a first direction, a second plurality of the conductive traces fan out in parallel in a second direction, a third plurality of the conductive traces fan out in parallel in a third direction, a fourth plurality of the conductive traces fan out in parallel in a fourth direction, wherein the first direction, second direction, third direction and fourth direction are each different and the conductive traces comprise substantially similar lengths.

2. The apparatus of claim 1 , wherein the ACF comprises a dielectric material and a plurality of conductive elements disposed in the dielectric material, and wherein the conductive elements each comprise a substantially spherical shape.

3. The apparatus of claim 2 , wherein the conductive elements each have a diameter of about 10 microns.

4. The apparatus of claim 3 , wherein the conductive elements each comprise gold.

5. The apparatus of claim 4 , wherein the ACF comprises a conductive element density of about 800 conductive elements per square millimeter.

6. The apparatus of claim 5 , wherein the conductive elements are substantially evenly distributed throughout the ACF.

7. The apparatus of claim 1 , wherein the opto-electronic package is configured to communicate direct current electrical signals via the coupling.

8. An apparatus comprising:
an opto-electronic package comprising a plurality of first electrodes and a receiver optical sub-assembly (ROSA) or a transmitter optical sub-assembly (TOSA);
a circuit comprising a plurality of second electrodes;
an anisotropic conductive film (ACF) compressed between at least a portion of the opto-electronic package and at least a portion of the circuit, wherein at least one of the first electrodes is mechanically coupled to at least one of the second electrodes via the ACF;
a plurality of conductive traces are configured to connect the first electrodes and the ROSA or the TOSA, wherein a first plurality of the conductive traces fan out in parallel in a first direction, a second plurality of the conductive traces fan out in parallel in a second direction, a third plurality of the conductive traces fan out in parallel in a third direction, a fourth plurality of the conductive traces fan out in parallel in a fourth direction, wherein the first direction, second direction, third direction and fourth direction are each different and the conductive traces comprise substantially similar lengths.

9. The apparatus of claim 8 , wherein the opto-electronic package comprises a pin pitch of about 10 micrometers (microns) to about 700 microns.

Assignees

• Futurewei Technologies Inc

Inventors

• Chen Morgan
• Miao Rongsheng
• Zheng Xueyan
• Li Bo
• Shen Xiao
• Bai Yu Sheng

Classifications

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title