Circuit card cartridge for an electronic system

Patent metadata

Field	Value
Publication number	US-9974157-B2
Application number	US-201615237054-A
Country	US
Kind code	B2
Filing date	Aug 15, 2016
Priority date	Aug 15, 2016
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.

First claim

What is claimed is:

1. An electronics system comprising:
a chassis comprising a first endwall, a second endwall, and a sidewall; and
at least one circuit card cartridge coupled to said chassis, said at least one circuit card cartridge positioned between said first endwall and said second endwall, said at least one circuit card cartridge comprising:
a printed circuit board comprising a first surface and at least one electronic component, said at least one electronic component coupled to said first surface; and
at least one heat transfer assembly coupled to said printed circuit board, said at least one heat transfer assembly comprising a heat transfer component defining a heat transfer surface directly coupled to said at least one electronic component, wherein said at least one heat transfer component extends adjacent said printed circuit board across said first surface;
wherein said at least one heat transfer assembly comprises a first heat transfer assembly and said at least one electronic component is a first electronic component, said printed circuit board further comprising a second surface opposite said first surface and a second electronic component coupled to said second surface, said electronics system further comprising a second heat transfer assembly contacting said second electronic component and extending adjacent said printed circuit board across said second surface;
wherein said chassis defines an interior space and said chassis is further configured to receive said at least one circuit card cartridge in said interior space, said heat transfer assembly further configured to contact said sidewall and said first endwall.

2. The electronics system in accordance with claim 1 , wherein said heat transfer assembly includes a solid conducting element.

3. The electronics system in accordance with claim 1 , wherein said at least one circuit card cartridge is a rectangular cuboid shape.

4. The electronics system in accordance with claim 1 , wherein said printed circuit board defines a plurality of first openings and said heat transfer assembly defines a plurality of second openings, said at least one circuit cartridge further comprising at least one fastener that extends through said plurality of first openings and said plurality of second openings.

5. The electronics system in accordance with claim 1 , wherein said chassis further comprises a handle.

6. The electronics system in accordance with claim 1 , wherein said chassis further includes a tongue and said sidewall defines a groove, said tongue configured to extend into said groove when said first endwall and said second endwall are coupled together.

7. The electronics system in accordance with claim 1 , wherein said at least one circuit card cartridge comprises a first circuit card cartridge and a second circuit card cartridge, said electronics system further comprising a divider coupled between said first circuit card cartridge and said second circuit card cartridge.

8. The electronics system in accordance with claim 1 , wherein said printed circuit board is coupled between said first heat transfer assembly and said second heat transfer assembly.

9. The electronics system in accordance with claim 1 , wherein said heat transfer assembly defines a vapor chamber.

10. The electronics system in accordance with claim 1 , wherein said at least one heat transfer assembly comprises:
a casing coupled to said heat transfer component and said printed circuit board such that said casing induces contact between said heat transfer surface and said at least one electronic component.

11. The electronics system in accordance with claim 10 , wherein said at least one circuit card cartridge further comprises a fastener extending through said casing and said printed circuit board.

12. The electronics system in accordance with claim 1 , wherein said printed circuit board is a first printed circuit board, said at least one circuit card cartridge further comprising a second printed circuit board coupled to said first printed circuit board.

13. A circuit card cartridge comprising:( 106 )
a printed circuit board ( 138 ) comprising a surface and at least one electronic component ( 140 ), said at least one electronic component ( 140 ) coupled to said surface; and
at least one heat transfer assembly ( 134 ) coupled to said printed circuit board, said heat transfer assembly comprising:
a heat transfer component defining a heat transfer surface directly coupled to said at least one electronic component, wherein said at least one heat transfer component extends adjacent said printed circuit board across said surface; and
a casing 21 coupled to said heat transfer component and coupled to said printed circuit board such that said casing induces contact between said heat transfer component and said at least one electronic component;
wherein said at least one heat transfer assembly comprises a first heat transfer assembly and said at least one electronic component is a first electronic component, said printed circuit board further comprising a second surface opposite said first surface and a second electronic component coupled to said second surface, said electronics system further comprising a second heat transfer assembly contacting said second electronic component and extending adjacent said printed circuit board across said second surface;
wherein said heat transfer component comprises a projection configured to contact said at least one electronic component.

14. The circuit card cartridge in accordance with claim 13 , wherein said printed circuit board defines a plurality of first openings and said heat transfer assembly defines a plurality of second openings, said circuit cartridge further comprising at least one fastener that extends through said plurality of first openings and said plurality of second openings.

15. The circuit card cartridge in accordance with claim 13 , wherein said casing and said heat transfer component define a vapor chamber configured to contain a heat transfer fluid.

16. A method of manufacturing an electronic system, said method comprising:
coupling a casing to a heat transfer component, the casing and the heat transfer component forming a first heat transfer assembly;
coupling the first heat transfer assembly to a printed circuit board such that the heat transfer component defining a heat transfer surface is directly coupled to at least one electronic component of the printed circuit board and extends across a mounting surface of the printed circuit board, the first heat transfer assembly and the printed circuit board at least partially forming a first circuit card cartridge;
coupling a first chassis portion to a second chassis portion; and
positioning the first circuit card cartridge between the first chassis portion and the second chassis portion.

17. The method in accordance with claim 16 further comprising coupling a third chassis portion to the second chassis portion and positioning a second circuit card cartridge between the second chassis portion and the third chassis portion.

Assignees

• Gen Electric

Inventors

• De Bock Hendrik Pieter Jacobus
• Rush Brian Magann
• Lassini Stefano Angelo Mario

Classifications

• H05K7/20309

  Evaporators · CPC title

• H05K7/20672 Primary

  within sub-racks for removing heat from electronic boards · CPC title

• H05K1/0201 Primary

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title