Composite magnetic sealing material and electronic circuit package using the same

Patent metadata

Field	Value
Publication number	US-9972579-B1
Application number	US-201715478419-A
Country	US
Kind code	B1
Filing date	Apr 4, 2017
Priority date	Nov 16, 2016
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.

First claim

What is claimed is:

1. A composite magnetic sealing material comprising:
a resin material; and
a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less,
wherein the filler includes:
a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution; and
a second magnetic filler having a second grain size distribution different from the first grain size distribution.

2. The composite magnetic sealing material as claimed in claim 1 , wherein the filler further includes a non-magnetic filler.

3. The composite magnetic sealing material as claimed in claim 2 , wherein a ratio of an amount of the non-magnetic filler relative to a sum of an amounts of the first and second magnetic fillers and the non-magnetic filler is 1 vol. % or more and 30 vol. % or less.

4. The composite magnetic sealing material as claimed in claim 3 , wherein the non-magnetic filler contains at least one material selected from a group consisting of SiO 2 , a low thermal expansion crystallized glass (lithium aluminosilicate based crystallized glass), ZrW 2 O 8 , (ZrO) 2 P 2 O 7 , KZr 2 (PO 4 ) 3 , or Zr 2 (WO 4 )(PO 4 ) 2 .

5. The composite magnetic sealing material as claimed in claim 1 , wherein a median diameter (D50) of the first magnetic filler is larger than a median diameter (D50) of the second magnetic filler.

6. The composite magnetic sealing material as claimed in claim 5 , wherein the second magnetic filler contains at least one selected from a group consisting of Fe, an Fe—Co based alloy, an Fe—Ni based alloy, an Fe—Al based alloy, an Fe—Si based alloy, an Ni—Zn based spinel ferrite, an Mn—Zn based spinel ferrite, an Ni—Cu—Zn based spinel ferrite, an Mg based spinel ferrite, and an yttrium-iron based garnet ferrite.

7. The composite magnetic sealing material as claimed in claim 5 , wherein the second magnetic filler has substantially a same composition as that of the first magnetic filler.

8. The composite magnetic sealing material as claimed in claim 1 , wherein the first and second magnetic fillers are coated with an insulating material.

9. The composite magnetic sealing material as claimed in claim 8 , wherein a film thickness of the insulating material is 10 nm or more.

10. The composite magnetic sealing material as claimed in claim 1 , wherein the resin material comprises a thermosetting resin material.

11. The composite magnetic sealing material as claimed in claim 10 , wherein the thermosetting resin material contains at least one material selected from a group consisting of an epoxy resin, a phenol resin, a urethane resin, a silicone resin, or an imide resin.

12. The composite magnetic sealing material as claimed in claim 1 , wherein the metal material further contains 0.1 wt. % or more and 5 wt. % or less of Co relative to a total weight of the first magnetic filler.

13. The composite magnetic sealing material as claimed in claim 1 , wherein the first and second magnetic fillers have a substantially spherical shape.

14. The composite magnetic sealing material as claimed in claim 1 , wherein a volume resistivity of the composite magnetic sealing material is 10 10 Ωcm or more.

15. An electronic circuit package comprising:
a substrate;
an electronic component mounted on a surface of the substrate; and
a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component,
wherein the magnetic mold resin comprising:
a resin material; and
a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less, and

wherein the filler includes:
a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution; and
a second magnetic filler having a second grain size distribution different from the first grain size distribution.

16. The electronic circuit package as claimed in claim 15 , further comprising a metal film covering the magnetic mold resin,
wherein the metal film is connected to a power supply pattern provided in the substrate.

17. The electronic circuit package as claimed in claim 16 , wherein the metal film is mainly composed of at least one metal selected from a group consisting of Au, Ag, Cu, and Al.

18. The electronic circuit package as claimed in claim 16 , wherein a surface of the metal film is covered with an antioxidant film.

19. The electronic circuit package as claimed in claim 16 , further comprising a soft magnetic metal film that covers the magnetic mold resin.

20. The electronic circuit package as claimed in claim 15 , further comprising a soft magnetic metal film that covers the magnetic mold resin,
wherein the soft magnetic metal film is connected to a power supply pattern provided in the substrate.

21. The electronic circuit package as claimed in claim 20 , wherein the soft magnetic metal film comprises Fe or Fe—Ni based alloy.

22. The electronic circuit package as claimed in claim 20 , wherein a surface of the soft magnetic metal film is covered with an antioxidant film.

23. The electronic circuit package as claimed in claim 15 , wherein a surface resistance value of the magnetic mold resin is 10 6 Ω or more.

Assignees

• Tdk Corp

Inventors

• Kawabata Kenichi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/473 Primary

  containing a filler · CPC title