Method of wrapping mica paper on an electrical conductor and mica paper tape suitable for same

US9972419B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9972419-B2
Application numberUS-201615146077-A
CountryUS
Kind codeB2
Filing dateMay 4, 2016
Priority dateJun 12, 2015
Publication dateMay 15, 2018
Grant dateMay 15, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method is disclosed of applying a mica paper around an electrical conductor, the process including attaching the tape comprising the mica paper to the conductor at an attachment point on the conductor; winding the tape around the conductor surface until the tape has been wound to a point that is at least 25 percent of the conductor circumference from the attachment point and then initiating a continuous removal of the support layer from the tape, starting at the attachment point; the mica paper remaining in contact with the surface of the conductor; and continuing to wind the tape around the conductor while simultaneously removing the support layer at a removal point until a desired amount of conductor surface is completely covered with at least one layer of the mica paper, with the proviso that the removal point is maintained at least 25 percent of the conductor circumference behind the winding point until the desired amount of conductor surface is completely covered. A tape is also disclosed of mica paper and a support layer, wherein the mica paper; wherein the initial elongation of the support layer is equal to or less than the initial elongation of the mica paper; and wherein the support layer is demountably attached to the mica paper such that when a delamination force of 10 N/10 mm or less is imposed on the support layer it can be separated from the mica paper.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of applying a mica paper around an electrical conductor, the process including i) a tape, the tape having a face comprising a continuous surface of the mica paper and a face comprising a support layer, the support layer being demountably attached to the mica paper; and ii) an electrical conductor, the conductor having a surface having a length and a circumference perpendicular to that length; the method comprising the steps, in order, of: a. attaching the face of the tape comprising the continuous surface of mica paper to the conductor at an attachment point on the surface of the conductor; b. winding the tape around the conductor, the mica paper being in contact with the conductor surface, until the tape has been wound to a point of winding that at least 25 percent of the conductor circumference from the attachment point on the surface of the conductor; and then c. initiating a continuous removal of the support layer from the tape, starting at the attachment point, the mica paper remaining in contact with the surface of the conductor; and d. continuing to wind the tape around the conductor, the mica paper being in at least partial contact with the conductor surface and continuously contacting the surface at a winding point, while simultaneously removing the support layer at a removal point until a desired amount of conductor surface is completely covered with at least one layer of the mica paper, with the proviso that the removal point is maintained at least 25 percent of the conductor circumference behind the winding point until the desired amount of conductor surface is completely covered. 2. The method of claim 1 , wherein in step b.) the tape is wound until the point of winding is at least 50 percent of the conductor circumference from the attachment point on the surface of the conductor; and in step d.) the tape is wound around the conductor with the proviso that the removal point is maintained at least 50 percent of the conductor circumference behind the winding point until the desired amount of conductor surface is completely covered. 3. The method of claim 1 or 2 , wherein the tape is helically or spirally wound around the conductor. 4. The method of claim 3 wherein at least a portion of the tape is wound with one layer of mica paper at least partially overlapping a prior-wrapped mica paper layer. 5. The method of claim 3 , wherein the mica paper contains at least 70% by weight mica.

Assignees

Inventors

Classifications

  • H01B3/485Primary

    Other fibrous materials fabric · CPC title

  • Electrical equipment · CPC title

  • of paper or cardboard · CPC title

  • Mixture of at least two fibres made of different materials · CPC title

  • Insulating · CPC title

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Frequently asked questions

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What does patent US9972419B2 cover?
A method is disclosed of applying a mica paper around an electrical conductor, the process including attaching the tape comprising the mica paper to the conductor at an attachment point on the conductor; winding the tape around the conductor surface until the tape has been wound to a point that is at least 25 percent of the conductor circumference from the attachment point and then initiating a…
Who is the assignee on this patent?
Du Pont
What technology area does this patent fall under?
Primary CPC classification H01B3/485. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 15 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).