Touch panel

US9971430B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9971430-B2
Application numberUS-201514636110-A
CountryUS
Kind codeB2
Filing dateMar 2, 2015
Priority dateMar 6, 2014
Publication dateMay 15, 2018
Grant dateMay 15, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A touch panel comprises a sensing area, a periphery area, a plurality of wires and a plurality of bonding pads. The periphery area is disposed around the sensing area. The periphery area comprises a bonding area. The wires are disposed in the periphery area. The bonding pads are disposed in the bonding area and electrical connected to the wires correspondingly. Each of the bonding pads comprises at least a bending portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A touch panel, comprising: a sensing area; a peripheral area disposed around the sensing area and comprising a bonding area; a plurality of wires disposed in the peripheral area; and a plurality of bonding pads, each having a penetrating axis penetrating the bonding pad, disposed in the bonding area, wherein: each of the plurality of bonding pads is electrically connected to a corresponding wire of the plurality of wires, and the penetrating axes of the bonding pads are inclined in reference to an edge line of the sensing area adjacent to the bonding area; wherein an extension line of each of the plurality of wires and an edge line of the sensing area adjacent to the bonding area form an obtuse angle; wherein an obtuse angle formed between the penetrating axes of the plurality of bonding pads and the edge line of the sensing area and the obtuse angle formed between the extension line of each of the plurality of wires and the edge line of the sensing area are substantially equal. 2. The touch panel of claim 1 , wherein each of the plurality of bonding pads comprises at least one bending portion. 3. The touch panel of claim 1 , wherein, for each of the plurality of bonding pads, a first part of the bonding pad is substantially symmetrical with a second part of the bonding pad. 4. The touch panel of claim 1 , further comprising: a circuit board correspondingly attached to the plurality of bonding pads in the bonding area. 5. The touch panel of claim 1 , wherein at least one of the plurality of bonding pads comprises a curved portion. 6. The touch panel of claim 1 , wherein at least one of the plurality of the bonding pads comprises an inclined form. 7. A touch panel, comprising: a sensing area; a peripheral area disposed around the sensing area and comprising a bonding area; a plurality of wires disposed in the peripheral area; and a plurality of bonding pads, each having a penetrating axis penetrating the bonding pad, disposed in the bonding area, wherein: each of the plurality of bonding pads is electrically connected to a corresponding wire of the plurality of wires, and the penetrating axes of the bonding pads are inclined in reference to an edge line of the sensing area adjacent to the bonding area; wherein an extension line of each of the plurality of wires and an edge line of the sensing area adjacent to the bonding area form an obtuse angle; wherein an obtuse angle formed between the penetrating axes of the plurality of bonding pads and the edge line of the sensing area is different from the obtuse angle formed between the extension line of each of the plurality of wires and the edge line of the sensing area. 8. The touch panel of claim 7 , wherein each of the plurality of bonding pads comprises at least one bending portion. 9. The touch panel of claim 7 , wherein, for each of the plurality of bonding pads, a first part of the bonding pad is substantially symmetrical with a second part of the bonding pad. 10. The touch panel of claim 7 , further comprising: a circuit board correspondingly attached to the plurality of bonding pads in the bonding area. 11. The touch panel of claim 7 , wherein at least one of the plurality of bonding pads comprises a curved portion. 12. The touch panel of claim 7 , wherein at least one of the plurality of the bonding pads comprises an inclined form.

Assignees

Inventors

Classifications

  • G06F3/041Primary

    Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

  • Peripheral electrode pattern in resistive digitisers, i.e. electrodes at the periphery of the resistive sheet are shaped in patterns enhancing linearity of induced field · CPC title

  • Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

  • Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title

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Frequently asked questions

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What does patent US9971430B2 cover?
A touch panel comprises a sensing area, a periphery area, a plurality of wires and a plurality of bonding pads. The periphery area is disposed around the sensing area. The periphery area comprises a bonding area. The wires are disposed in the periphery area. The bonding pads are disposed in the bonding area and electrical connected to the wires correspondingly. Each of the bonding pads comprise…
Who is the assignee on this patent?
Tpk Touch Systems Xiamen Inc, Tpk Touch Solutions Xiamen Inc, Tpk Touch Systems Xiamen Inc, and 1 more
What technology area does this patent fall under?
Primary CPC classification G06F3/041. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 15 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).