High-temperature, dual rail heat pump cycle for high performance at high-temperature lift and range
US-2024142143-A1 · May 2, 2024 · US
Refrigeration cycle apparatus
US9970693B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9970693-B2 |
| Application number | US-201515120807-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2015 |
| Priority date | Mar 7, 2014 |
| Publication date | May 15, 2018 |
| Grant date | May 15, 2018 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A refrigeration cycle apparatus includes refrigerant circuits each configured to circulate a refrigerant of the same composition. The refrigerant circuit is provided with a radiator configured to condense the refrigerant to transfer heat to external fluid, and the refrigerant circuit is provided with a radiator configured to transfer heat to the external fluid while allowing the refrigerant to be maintained in a supercritical state. The radiator is arranged upstream of the radiator in a direction of a flow of the external fluid. A capacity of a refrigerant flow channel of the radiator is smaller than a capacity of a refrigerant flow channel of the radiator.
First claim
Opening claim text (preview).
The invention claimed is: 1. A refrigeration cycle apparatus comprising: a first refrigerant circuit and a second refrigerant circuit that each circulate a refrigerant of a same composition, the first refrigerant circuit being provided with a first radiator that condenses the refrigerant to transfer heat to external fluid, the second refrigerant circuit being provided with a second radiator that transfers heat to the external fluid while allowing the refrigerant to be maintained in a supercritical state, the first radiator being arranged upstream of the second radiator in a direction of a flow of the external fluid, and a capacity of a refrigerant flow channel of the second radiator being smaller than a capacity of a refrigerant flow channel of the first radiator. 2. A refrigeration cycle apparatus comprising: a refrigerant circuit that circulates refrigerant, the refrigerant circuit being provided with a first radiator that condenses the refrigerant to transfer heat to external fluid, and a second radiator that transfers heat to the external fluid while allowing the refrigerant to be maintained in a supercritical state, the first radiator being arranged upstream of the second radiator in a direction of a flow of the external fluid, and a capacity of a refrigerant flow channel of the second radiator being smaller than a capacity of a refrigerant flow channel of the first radiator. 3. The refrigeration cycle apparatus of claim 1 , wherein, as the refrigerant, a refrigerant containing R1123 is used. 4. The refrigeration cycle apparatus of claim 2 , wherein, as the refrigerant, a refrigerant containing R1123 is used. 5. The refrigeration cycle apparatus of claim 1 , wherein the refrigerant flow channel in the second radiator is narrower than the refrigerant flow channel in the first radiator. 6. The refrigeration cycle apparatus of claim 2 , wherein the refrigerant flow channel in the second radiator is narrower than the refrigerant flow channel in the first radiator.
Assignees
Inventors
Classifications
- F25B6/00Primary
Compression machines, plants or systems, with several condenser circuits · CPC title
Water-cooled condensers · CPC title
arranged in series · CPC title
of condenser fans · CPC title
Compression machines, plants or systems with non-reversible cycle (F25B3/00, F25B5/00, F25B6/00, F25B7/00, F25B9/00 take precedence) · CPC title
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Frequently asked questions
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- What does patent US9970693B2 cover?
- A refrigeration cycle apparatus includes refrigerant circuits each configured to circulate a refrigerant of the same composition. The refrigerant circuit is provided with a radiator configured to condense the refrigerant to transfer heat to external fluid, and the refrigerant circuit is provided with a radiator configured to transfer heat to the external fluid while allowing the refrigerant to …
- Who is the assignee on this patent?
- Mitsubishi Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification F25B6/00. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue May 15 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).