Dia and automotive dia projection system
US-2024377044-A1 · Nov 14, 2024 · US
US9970622B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9970622-B2 |
| Application number | US-201615001307-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 20, 2016 |
| Priority date | Jan 23, 2015 |
| Publication date | May 15, 2018 |
| Grant date | May 15, 2018 |
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A lighting device may include a semiconductor light source arrangement, a heat sink for cooling the semiconductor light source arrangement, electrical connections for supplying power to the semiconductor light source arrangement, and a holding means. The holding means is in the form of a plastic part, at least the electrical connections and the heat sink each being embedded in the plastic material of said plastic part at least in sections.
Opening claim text (preview).
What is claimed is: 1. A lighting device, comprising: a semiconductor light source arrangement; a heat sink for cooling the semiconductor light source arrangement; electrical connections for supplying power to the semiconductor light source arrangement; and a holding means; wherein the semiconductor light source arrangement is arranged on a support in the form of a mounting board; wherein the holding means is in the form of a plastic part, at least the electrical connections and the heat sink each being embedded in the plastic material of said plastic part at least in sections; wherein the holding means comprise a cylindrical holding section and a holding section which is in the form of a socket; wherein said cylindrical holding section has an end face with an end surface which is of planar design and in the shape of an annular disk, and wherein three locking elements project radially from an outer casing surface of the cylindrical holding section and are arranged along an outer circumference of said end surface and form a bayonet fitting; wherein the heat sink has a hollow cylindrical heat sink section being embedded in the plastic material of said plastic part in the region of the cylindrical holding section and forming a planar surface for the mounting board; wherein the heat sink has a heat sink section in the shape of an annular disk that is integrally formed on said hollow-cylindrical heat sink section; wherein cooling ribs are arranged along a circumference of the heat sink section in the shape of an annular disk and are each angled away from said heat sink section in the shape of an annular disk through an angle of 90 degrees such that each extend parallel to a ring axis of the heat sink section in the form of an annular disk, and wherein the mounting board is fixed on the planar surface of said hollow-cylindrical heat sink section and is arranged within the cylindrical holding section perpendicular to a cylinder axis of the cylindrical holding section and is embedded in the plastic material of the holding means at least in sections. 2. The lighting device of claim 1 , wherein, in addition to the semiconductor light source arrangement, an electronics system for operating the semiconductor light source arrangement is arranged on the support. 3. A lighting device, comprising: at least one semiconductor light source, wherein the at least one semiconductor light source is arranged on a support in the form of a mounting board; a heat sink configured to cool the semiconductor light source; electrical connections configured to supply power to the at least one semiconductor light source; and a holding structure; wherein the holding structure comprises a plastic part; wherein at least the electrical connections and the heat sink each are at least partially embedded in the plastic material of the plastic part; wherein the holding structure comprises a cylindrical holding section and a holding section which is in the form of a socket; wherein said cylindrical holding section has an end face with an end surface which is of planar design and in the shape of an annular disk, and wherein three locking elements project radially from an outer casing surface of the cylindrical holding section and are arranged along an outer circumference of said end surface and forming a bayonet fitting; wherein the heat sink has a hollow cylindrical heat sink section being embedded in the plastic material of said plastic part in the region of the cylindrical holding section and forming a planar surface for the mounting board; wherein the heat sink has a heat sink section in the shape of an annular disk and is integrally formed on said hollow-cylindrical heat sink section; wherein cooling ribs are arranged along the circumference of the heat sink section in the shape of an annular disk and are each angled away from said heat sink section in the shape of an annular disk through an angle 90 of degrees such that each extend parallel to a ring axis of the heat sink section in the form of an annular disk, wherein the mounting board is fixed on the planar surface of said hollow-cylindrical heat sink and is arranged within the cylindrical holding section perpendicular to a cylinder axis of the cylindrical holding section and is embedded in the plastic material of the holding structure at least in sections. 4. The lighting device of claim 3 , wherein, in addition to the at least one semiconductor light source, an electronics system for operating the at least one semiconductor light source is arranged on the support. 5. The lighting device of claim 3 , wherein the cooling ribs form a cutout through which the holding section which is in the form of a socket extends. 6. The lighting device of claim 1 , wherein the cooling ribs form a cutout through which the holding section which is in the form of a socket extends.
Light emitting diodes [LED] · CPC title
Details of lamp holders, terminals or connectors · CPC title
the fastening being onto or by the lampholder · CPC title
characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title
with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device · CPC title
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