Polyamide molding compounds and molded articles produced therefrom

Patent metadata

Field	Value
Publication number	US-9969882-B2
Application number	US-201414915031-A
Country	US
Kind code	B2
Filing date	Aug 8, 2014
Priority date	Aug 29, 2013
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

The present invention relates to polyamide molding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to molded articles produced from these polyamide molding compounds as components in the automobile or electrics/electronics sector.

First claim

The invention claimed is:

1. A polyamide moulding compound having the following composition:
(A) 25 to 84.99% by weight of at least one caprolactam-containing polyamide (A1) with a caprolactam content of at least 50% by weight and at least one further polyamide (A2),
(B) 15 to 70% by weight of at least one filler and reinforcing means,
(C) 0.01 to 5.0% by weight of at least one inorganic radical interceptor,
(D) 0 to 5.0% by weight of at least one heat stabiliser which differs from the inorganic radical interceptor (C), and
(E) 0 to 20.0% by weight of at least one additive,
components (A) to (E) adding up to 100% by weight;
wherein component (A) is formed from 10 to 40% by weight of at least one caprolactam-containing polyamide (A1) and 60 to 90% by weight of at least one polyamide (A2), components (A1) and (A2) adding up to 100% by weight;
wherein the inorganic radical interceptor (C) is a lanthanoid compound selected from the group consisting of fluorides, chlorides, bromides, iodides, oxyhalides, sulphates, nitrates, phosphates, chromates, perchlorates, oxalates, the monochalcogenides of sulphur, selenium and tellurium, carbonates, hydroxides, trifluoromethanesulphonates, acteylacetonates, alcoholates, and 2-ethylhexanoates of lanthanoid or lanthanoids wherein the lanthanoid or lanthanoids are selected from lanthanum, cerium, praesodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium,
hydrates of the above-mentioned salts, and
mixtures of the above-mentioned compounds;

wherein the at least one heat stabiliser (D) is selected from the group consisting of
a) compounds of mono- or bivalent copper,
b) stabilisers based on secondary aromatic amines,
c) stabilisers based on sterically hindered phenols,
d) phosphites and phosphonites, and
e) mixtures of any of a), b), c) and d);
wherein the proportion of the at least one stabiliser (D) is 0.01 to 5.0% by weight.

2. The polyamide moulding compound according to claim 1 ,
wherein polyamide (A2) concerns a partially aromatic polyamide selected from the group consisting of PA 4T/4I, PA 4T/6I, PA 5T/5I, PA 6T/6I, PA 6T/6I/6, PA 6T/6, PA 6T/6I/66, PA 6T/MPDMT, PA 6T/66, PA 6T/610, PA 10T/612, PA 10T/106, PA 6T/612, PA 6T/10T, PA 6T/10I, PA 9T, PA 10T, PA 12T, PA 10T/10I, PA 10T/12, PA 10T/11, PA 6T/9T, PA 6T/12T, PA 6T/10T/6I, PA 6T/6I/6, PA 6T/6I/12, and mixtures thereof, or an aliphatic polyamide selected from the group consisting of PA 66, PA 46, and mixtures thereof.

3. The polyamide moulding compound according to claim 1 , wherein the at least one polyamide (A2) has a melting point in the range of 250 to 340° C.

4. The polyamide moulding compound according to claim 1 , wherein the at least one further polyamide (A2) is partially aromatic and has a solvent viscosity η rel of at most 2.6, measured on a solution of 0.5 g polyamide (A2) in 100 ml m-cresol at 20° C.

5. The polyamide moulding compound according to claim 1 , wherein the at least one further polyamide (A2) is partially aromatic and produced from
a) dicarboxylic acids which, relative to the total quantity of dicarboxylic acids, comprise at least 50% by mol of terephthalic acid,
b) diamines which, relative to the total quantity of diamines, comprise at least 80% by mol of aliphatic diamines with 4 to 18 carbon atoms, and
c) optionally lactams and/or aminocarboxylic acids.

6. The polyamide moulding compound according to claim 1 , wherein the at least one further polyamide (A2) is partially aromatic and is produced from
a) 50 to 100% by mol of terephthalic acid and/or naphthalene dicarboxylic acid and 0 to 50% by mol of at least one aliphatic dicarboxylic acid with 6 to 12 carbon atoms, and/or 0 to 50% by mol of at least one cycloaliphatic dicarboxylic acid with 8 to 20 carbon atoms, and/or 0 to 50% by mol of isophthalic acid, relative to the total quantity of dicarboxylic acids,
b) 80 to 100% by mol of at least one aliphatic diamine with 4 to 18 carbon atoms, and 0 to 20% by mol of at least one cycloaliphatic diamine and/or 0 to 20% by mol of at least one araliphatic diamine relative to the total quantity of diamines, and
c) 0 to 20% by mol of aminocarboxylic acids and/or lactams respectively with 6 to 12 carbon atoms.

7. The polyamide moulding compound according to claim 2 , wherein the at least one caprolactam-containing polyamide (A1) has a content of caprolactam of 60% by weight to 100% by weight.

8. The polyamide moulding compound according to claim 1 , wherein the at least one caprolactam-containing polyamide (A1) has a solvent viscosity η rel in the range of 1.6 to 3.0, measured on a solution of 1.0 g polyamide (A1) in 100 ml 96% sulphuric acid at 20° C.

9. The polyamide moulding compound according to claim 1 , wherein the at least one filler and reinforcing means (B) are selected from the group consisting of
a) glass- and/or carbon fibres,
b) particulate fillers, and
c) mixtures thereof.

10. The polyamide moulding compound according to claim 1 , wherein the polyamide moulding compound is free of hypophosphorous acid, hypophosphates and cerium dioxide.

11. The polyamide moulding compound according to claim 1 , wherein the polyamide moulding compound is free of metal salts and/or metal oxides of a transition metal of the group VB, VIB, VIIB or VIIIB of the periodic table.

12. A component produced from a polyamide moulding compound according to claim 1 , wherein the component is a component for the automobile- or electrical/electronic field, cylinder head covers, engine covers, housings for charge coolers, charge cooler valves, suction pipes, suction manifolds, connectors, toothed wheels, ventilator wheels, cooling water tanks, housing or housing part for heat exchangers, coolant coolers, charge coolers, thermostat, water pump, heating unit, attachment parts, in the form of an electrical or electronic component, a circuit board, a part of a circuit board, a housing component, a foil, a line, in particular in the form of a switch, a distributor, a relay, a resistor, a capacitor, a coil, a lamp, a diode, an LED, a transistor, a connector, a controller, a memory or a sensor.

Assignees

• Ems Patent Ag

Inventors

• Thomas Oliver
• Lamberts Nikolai
• Hoffmann Botho
• Bayer Andreas

Classifications

• C08G69/265 Primary

  from at least two different diamines or at least two different dicarboxylic acids · CPC title

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title

• C08K2003/2213

  of cerium · CPC title

• C08L77/02 Primary

  Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) · CPC title

• C08L2205/02

  containing two or more polymers of the same C08L -group · CPC title