Cooling device and electronic device

Patent metadata

Field	Value
Publication number	US-9968003-B2
Application number	US-201515110888-A
Country	US
Kind code	B2
Filing date	Jan 15, 2015
Priority date	Jan 16, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A cooling device 100 includes a first heat receiving unit 400 , a second heat receiving unit 410 , a first heat dissipating unit 700 , and a second heat dissipating unit 710 . The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.

First claim

The invention claimed is:

1. A cooling device comprising
a first heat receiving unit and a second heat receiving unit that receive heat generated by heat generating elements,
a first heat dissipating unit that has a first principal surface and dissipates the heat received by the first heat receiving unit, and
a second heat dissipating unit that has a second principal surface and dissipates the heat received by the second heat receiving unit, wherein
the first principal surface and the second principal surface are arranged so as to face to each other,
air passes through the first heat dissipating unit and the second heat dissipating unit in a direction approximately perpendicular to the first principal surface and the second principal surface from the first heat dissipating unit toward the second heat dissipating unit, and
the area of the second principal surface is larger than the area of the first principal surface, and
the first principal surface and second principal surface are each formed in a rectangular shape, and
a distance in a surface direction between both end sides of the first principal surface and a distance in a surface direction between both end sides of the second principal surface are slightly smaller than a distance between inner walls of a chassis which accommodates the first heat receiving unit and the second heat receiving unit, the first dissipating unit, and the second heat dissipating unit.

2. The cooling device according to claim 1 further comprising:
a fan unit that blows air into a facing area in which the first principal surface and the second principal surface face each other, the facing area being part of the first principal surface and second principal surface.

3. The cooling device according to claim 1 further comprising:
a cover portion that connects an outer peripheral edge of the first principal surface and an outer peripheral edge of the second principal surface.

4. The cooling device according to claim 1 , in which the first and second heat receiving units and the first and second heat dissipating units are disposed along a direction approximately perpendicular to the first and second principal surfaces.

5. The cooling device according to claim 1 further comprising:
a first pipe unit that connects the first heat receiving unit and the first heat dissipating unit for circulating refrigerant between the first heat receiving unit and the first heat dissipating unit, and
a second pipe unit that connects the second heat receiving unit and the second heat dissipating unit for circulating refrigerant between the second heat receiving unit and the second heat dissipating unit, wherein
a lead-out direction in which the first pipe unit is led out from the first heat receiving unit is opposite to a lead-out direction in which the second pipe unit is led out from the second heat receiving unit.

6. The cooling device according to claim 1 further comprising:
a first pipe unit that connects the first heat receiving unit and the first heat dissipating unit for circulating refrigerant between the first heat receiving unit and the first heat dissipating unit, and
a second pipe unit that connects the second heat receiving unit and the second heat dissipating unit for circulating refrigerant between the second heat receiving unit and the second heat dissipating unit, wherein
the first pipe unit includes a first vapor pipe and a first liquid pipe, the first vapor pipe connecting the first heat receiving unit and the first heat dissipating unit and conveying refrigerant from the first heat receiving unit to the first heat dissipating unit, the first liquid pipe connecting the first heat receiving unit and the first heat dissipating unit and conveying refrigerant from the first heat dissipating unit to the first heat receiving unit,
the second pipe unit includes a second vapor pipe and a second liquid pipe, the second vapor pipe connecting the second heat receiving unit and the second heat dissipating unit and conveying refrigerant from the second heat receiving unit to the second heat dissipating unit, the second liquid pipe connecting the second heat receiving unit and the second heat dissipating unit and conveying refrigerant from the second heat dissipating unit to the second heat receiving unit, and
the first liquid pipe is connected to a vertically lower side surface of the first heat dissipating unit or the second liquid pipe is connected to a vertically lower side surface of the second heat dissipating unit.

7. The cooling device according to claim 1 in which
at least one of the first heat receiving unit and the second heat receiving unit receives heat generated by a plurality of heat generating elements.

8. An electronic device comprising:
the cooling device according to claim 1 and
a chassis that accommodates the cooling device.

Assignees

• Nec Corp

Inventors

• Sakamoto Hitoshi
• Yoshikawa Minoru
• Hachiya Mahiro

Classifications

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title