Electrode arrangement with 3D structure and fabrication method thereof

Patent metadata

Field	Value
Publication number	US-9967973-B2
Application number	US-201414584291-A
Country	US
Kind code	B2
Filing date	Dec 29, 2014
Priority date	May 27, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

An electrode arrangement which is based on elastomer and has elasticity and flexibility may include: an elastomer substrate; first and second pads arranged over the substrate; and a conductive wire connecting the first and second pads. One or more regions of the conductive wire may be bent in a vertical or horizontal direction with respect to the substrate.

First claim

What is claimed is:

1. An electrode arrangement which is based on elastomer and has elasticity and flexibility, the electrode arrangement comprising:
an elastomer substrate;
a plurality of first pads arranged in a first row over the substrate and a plurality of second pads arranged in a second row over the substrate; and
a plurality of conductive wires respectively connecting one of the first pads and one of the second pads,
wherein each of the conductive wires includes regions which are bent in a horizontal direction with respect to the substrate,
wherein each of the conductive wires further includes regions which are bent in a vertical direction with respect to the substrate and are not in contact with the substrate,
wherein each of the conductive wires further includes at least one fixation region that affixes the conductive wire having the at least one fixation region to the substrate, the at least one fixation region of each conductive wire being an integral part of a corresponding conductive wire that protrudes away from a middle lane of the corresponding conductive wire, and
wherein at least one of the conductive wires passes under two other conductive wires in each of the regions the two other conductive wires are bent in the vertical direction with respect to the substrate.

2. The electrode arrangement of claim 1 , wherein only parts of entire regions of the first and second pads are in contact with the substrate.

3. The electrode arrangement of claim 1 , wherein the at least one fixation region has a round-shape.

4. The electrode arrangement of claim 1 , wherein the elastomer substrate comprises PDMS (polydimethylsiloxane).

5. The electrode arrangement of claim 1 , wherein the conductive wire is curved.

6. The electrode arrangement of claim 1 , further comprising:
a first insulating layer on the substrate facing a first surface of the substrate; and
a second insulating layer on a wafer facing a second surface of the substrate opposite to the first surface.

7. The electrode arrangement of claim 1 , wherein at least one of the two other conductive wires passes over the at least one conductive wire and at least one additional conductive wire such that at least one of the at least one conductive wire or the at least one additional conductive wire is under each of the regions the at least one of the two other conductive wires is bent in the vertical direction with respect to the substrate.

8. The electrode arrangement of claim 1 , wherein the at least one fixation region comprises a pair of fixation regions.

9. The electrode arrangement of claim 8 , wherein the pair of fixation regions is positioned along the corresponding conductive wire between each of the first pad and the second pad.

10. The electrode arrangement of claim 9 , wherein a first fixation region of the pair of fixation regions and a second fixation region of the pair of fixation regions are on opposite sides of the middle lane of the corresponding conductive wire.

11. The electrode arrangement of claim 10 , wherein the first fixation region and the second fixation region are symmetrically disposed with respect to the middle lane of the corresponding conductive wire.

Assignees

• Gwangju Inst Science & Tech

Inventors

• Kim Sohee
• Chou Namsun

Classifications

• H05K2201/0162

  Silicon containing polymer, e.g. silicone · CPC title

• H05K2201/09263

  Meander · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title

• H05K2201/0133

  Elastomeric or compliant polymer · CPC title

• H05K3/38

  Improvement of the adhesion between the insulating substrate and the metal · CPC title