Packaged electronic device having integrated antenna and locking structure

Patent metadata

Field	Value
Publication number	US-9966652-B2
Application number	US-201514931750-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Nov 3, 2015
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.

First claim

What is claimed is:

1. A packaged electronic device having an integrated antenna comprising:
a substrate comprising:
a first conductive die attach pad; and
a first conductive lead spaced apart from a first side of the first conductive die attach pad;

an electronic device electrically coupled to the first conductive lead;
a package body encapsulating the electronic device and encapsulating at least portions of the first conductive die attach pad, and at least portions of the first lead; and
an antenna structure comprising:
the first conductive die attach pad; and
an elongated conductive beam structure disposed proximate to the first side of the first conductive die attach pad, the elongated conductive beam structure electrically coupled to one or more of the first conductive die attach pad and the electronic device, wherein the package body encapsulates at least portions of the elongated conductive beam structure, and wherein:
the substrate comprises a conductive leadframe;
the leadframe further comprises a conductive ground plane structure spaced apart from the first conductive die attach pad and disposed to surround the first conductive die attach pad;
the conductive ground plane structure includes a gap in one side portion;
the package body at least partially encapsulates at least a portion of the conductive ground plane structure; and
the elongated conductive beam structure is integral with the first conductive die attach pad and comprises a transmission line extending from a first side of the first conductive die attach pad to edge of the package body proximate to the gap.

2. The device of claim 1 , wherein:
the package body completely encapsulates the first conductive die attach pad; and
the first conductive die attach pad is thinner than the first conductive lead.

3. The device of claim 1 , wherein the conductive ground plane structure is exposed in a major surface of package body and the first conductive die attach pad is exposed in an opposite major surface of the package body in a top-exposed pad configuration.

4. The device of claim 1 , wherein the conductive ground plane structure is electrically connected to the first conductive die attach pad along a second side of the first conductive die attach pad.

5. The device of claim 3 , wherein the elongated conductive beam structure comprises a down-set portion such that a portion of the elongated conductive beam portion is exposed in the major surface of the package body, and wherein the package body encapsulates the down-set portion.

6. The device of claim 3 , wherein:
the elongated conductive beam structure is exposed in the opposite major surface of the package body.

7. The device of claim 1 further in combination with a printed circuit board having a conductive ground plane layer, wherein:
the conductive ground plane layer is electrically connected to the conductive ground plane structure; and
the conductive ground plane layer laterally overlaps but is vertically spaced apart from the first conductive die attach pad.

8. The device of claim 4 , wherein the second side is directly opposite to the elongated conductive beam structure.

9. The device of claim 4 , wherein the second side is adjacent to the first side of the first conductive die attach pad.

10. The device of claim 1 , wherein:
the elongated conductive beam structure comprises a first portion integral with the first conductive die attach pad having a first thickness and a second portion distal to the first conductive die attach pad having a second thickness greater than the first thickness; and
the second portion is exposed outside of the package body.

11. The device of claim 1 , wherein:
the leadframe further comprises a tie bar attached to the first conductive die attach pad;
the first conductive die attach pad comprises an etched portion having a reduced thickness;
the packaged electronic device further comprises a locking feature disposed extending through the etched portion of the first conductive die attach pad and the tie bar; and
the locking feature comprises one or more of a non-linear edge along the first conductive die attach pad and at least a portion of the tie bar, slots and circular holes disposed in the etched portion of the first conductive die attach pad and the tie bar, and a Y-shaped slot structure disposed partially on the first conductive die attach pad and partially on the tie bar.

12. A packaged electronic device structure having an integrated antenna comprising:
a first die pad with a first major surface and a second major surface opposite to the first major surface;
a plurality of conductive leads disposed spaced apart from peripheral edge segments of the first die pad;
an electronic device electrically connected to the plurality of conductive leads;
a package body encapsulating the electronic device, at least portions of the conductive leads, and at least portions of the first die pad; and
an antenna structure at least partially embedded within the package body, wherein the antenna structure comprises a conductive structure configured to resonate responsive to an electrical signal, and wherein:
the antenna comprises a slot disposed within the first die pad between the electronic device and one edge of the first die pad.

13. The structure of claim 12 , wherein the slot completely surrounds the first die pad.

14. The structure of claim 12 , wherein the slot only partially surrounds the first die pad.

15. The structure of claim 12 , wherein:
the first die pad has a first portion having a first thickness and a second portion having a second thickness greater than the first thickness;
the slot is disposed in the first portion; and
the electronic device is attached to the second portion.

16. The structure of claim 12 , wherein the antenna further comprises a wave guide electrically coupled to the electronic device and a conductive lead, wherein:
the wave guide overlaps the slot;
the package body encapsulates the wave guide; and
portions of the slot are devoid of the package body.

17. The structure of claim 12 , wherein:
the slot is disposed extending inward from a peripheral edge segment of the first die pad;
the slot has a curved shape; and
the structure further comprises a conductive feed attached to the first die pad proximate to the slot.

18. A packaged electronic device structure having an integrated antenna comprising:
a conductive leadframe comprising:
a die pad with a first major surface and a second major surface opposite to the first major surface;
a plurality of conductive leads disposed spaced apart from peripheral edge segments of the die pad; and
a tie bar attached to the die pad;

an electronic device electrically coupled to the plurality of conductive leads;
a molded package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad, wherein the molded package body has a first package body surface and a second package body surface opposite to the first package body surface; and
an antenna structure at least partially encapsulated within the molded package body, wherein the antenna structure comprises:
a conductive pillar structure extending from the first package body surface to the second package body surface generally perpendicular to the die pad in a cross-sectional view; and
an elongated conductive beam structure disposed adjoining the first package body surface and electrically connected to the conductive pillar structure adjacent to the first package body surf

Assignees

• Amkor Technology Inc

Inventors

• Mangrum Marc Alan
• Cho Hyung Jun
• Kim Byong Jin
• Kim Gi Jeong
• Bae Jae Min
• Kim Seung Mo
• Lee Young Ju

Classifications

• H01Q9/0407

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title