LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Patent metadata

Field	Value
Publication number	US-9966517-B2
Application number	US-201514965083-A
Country	US
Kind code	B2
Filing date	Dec 10, 2015
Priority date	Mar 30, 2010
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

First claim

The invention claimed is:

1. An LED resin-attached leadframe for mounting an LED element, comprising:
a main body portion having a die pad for mounting the LED element, and a lead portion disposed in a spaced relation to the die pad;
a first metal plating layer disposed on both of the die pad and the lead portion provided on the main body portion;
a second metal plating layer disposed on the first metal plating layer; and
a reflector surrounding a portion on which the LED element is mounted and filling a space between the lead portion and the die pad, wherein:
on the leadframe, a first region is provided between the reflector surrounding the portion on which the LED element is mounted and the die pad, the first region not being covered with the first and second metal plating layers,
on the leadframe, a second region is provided between the reflector surrounding the portion on which the LED element is mounted and the lead portion, the second region not being covered with the first and second metal plating layers,
first non-through trench and a second non-through trench are formed on the surface of the leadframe below a planar surface on which the LED element is to be mounted, the first non-through trench and the second non-through trench being located between the leadframe and reflector,
the first non-through trench is located adjacent to the first region and the second non-through trench is located adjacent to the second region,
an inside of the first non-through trench and an inside of the second non-through trench are not covered with the first and second metal plating layers, and
the first region is located between first lateral edges of the first and second metal plating layers and the first non-through trench, and
the second region is located between second lateral edges of the first and second metal plating layer and the second non-through trench.

2. The LED resin-attached leadframe according to claim 1 , wherein
an underlying plating layer is disposed between the body portion and the first metal plating layer.

3. The LED resin-attached leadframe according to claim 1 , wherein
the main body portion comprises a metal plate,
a first outer lead portion is formed at a bottom of the die pad, and a second outer lead portion is formed at a bottom of the lead portion, and
the first outer lead portion and the second outer lead portion are exposed to the outside of the reflector, respectively.

4. The LED resin-attached leadframe according to claim 1 , wherein
on the die pad, the second metal plating layer extends from a portion located adjacent an inner side of the first non-through trench, to an inner end of the die pad facing the lead portion, and
on the lead portion, the second metal plating layer extends from a portion located adjacent an inner side of the second non-through trench, to an inner end of the lead portion facing the die pad.

5. A semiconductor device comprising:
an LED resin-attached leadframe including a main body portion having a die pad for mounting an LED element, and a lead portion disposed in a spaced relation to the die pad;
the LED element mounted over the die pad of the main body portion of the leadframe;
an electroconductive portion electrically connecting the leadframe and the LED element;
an encapsulating resin portion for encapsulating the LED element and the electroconductive portion; and
a reflector surrounding a portion on which the LED element is mounted and filling a space between the lead portion and the die pad, wherein
a first metal plating layer is disposed on both of the die pad and the lead portion provided on the main body portion of the LED leadframe,
a second metal plating layer is disposed on the first metal plating layer,
on the leadframe, a first region is provided between the reflector surrounding the portion on which the LED element is mounted and the die pad, the first region not being covered with the first and second metal plating layers,
on the leadframe, a second region is provided between the reflector surrounding the portion on which the LED element is mounted and the lead portion, the second region not being covered with the first and second metal plating layers,
a first non-through trench and a second non-through trench are formed on the surface of the leadframe below a planar surface on which the LED element is mounted, the first non-through trench and the second non-through trench being located between the leadframe and the reflector,
the first non-through trench is located adjacent to the first region and the second non-through trench is located adjacent to the second region,
an inside of the first non-through trench and an inside of the second non-through trench are not covered with the first and second metal plating layers, and
the first region is located between lateral edges of the first and second metal plating layers and the first non-through trench, and
the second region is located between second lateral edges of the first and second metal plating layers and the second non-through trench.

6. The semiconductor device according to claim 5 , wherein
an underlying plating layer is disposed between the main body portion and the first metal plating layer.

7. The semiconductor device according to claim 5 , wherein
the encapsulating resin portion comprises a silicone resin.

8. The semiconductor device according to claim 5 , further comprising
a reflector surrounding the LED element and having a concave portion, wherein
the encapsulating resin portion is filled in the concave portion of the reflector.

9. The semiconductor device according to claim 5 , wherein
on the die pad, the second metal plating layer extends from a portion located adjacent an inner side of the first non-though trench, to an inner end of the die pad facing the lead portion, and
on the lead portion, the second metal plating layer extends from a portion located adjacent an inner side of the second non-through trench, to an inner end of the lead portion facing the die pad.

10. A semiconductor device comprising:
a leadframe including a main body portion having a die pad for mounting an LED element, and a lead portion disposed in spaced relation to the die pad;
the LED element mounted over the die pad of the main body portion of the leadframe;
an electroconductive portion electrically connecting the leadframe and the LED element; and
an encapsulating resin portion for encapsulating the LED element and the electroconductive portion; and
a reflector filling a space between the lead portion and the die pad, wherein
a first metal plating layer is disposed on both of the die pad and the lead portion provided on the main body portion of the leadframe,
a second metal plating layer is disposed on the first metal plating layer,
the leadframe comprises an upper surface and a lower surface that is opposite to the upper surface,
the leadframe comprises an exposed surface perpendicular to the upper surface and the lower surface, the exposed surface being exposed to the outside of the semiconductor device, a thickness of the exposed surface being thinner than a thickness of a metal substrate for the main body portion of the leadframe due to a recess formed on the lower-surface side of the leadframe, the recess having a curved surface and being filled with the reflector, and
the encapsulating resin portion covers substantially the whole upper surface side of the leadframe.

11. The semiconductor device according to claim 10 , wherein an underlying plating layer is disposed between the body portion and the first metal plating layer.

12. A method for manufacturing an LED leadframe, comprising:
a step of pr

Assignees

• Dainippon Printing Co Ltd

Inventors

• Oda Kazunori
• Sakamoto Akira
• Murata Yoshinori
• Kawai Kenzaburo
• Suzuki Koichi
• Oishi Megumi

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title