Lighting device and method for producing such a lighting device

Patent metadata

Field	Value
Publication number	US-9966516-B2
Application number	US-201515503028-A
Country	US
Kind code	B2
Filing date	Jul 20, 2015
Priority date	Aug 12, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A method for producing a lighting device is provided. According to the method, a plurality of semiconductor emitters arranged alongside one another are embedded in a light-transmissive filling compound apart from a side having their electrical connections, trenches are introduced into the light-transmissive filling compound at the side having the electrical connections between at least two semiconductor emitters, the side of the light-transmissive filling compound having the electrical connections, including the electrical connections, is covered with a dielectric material, electrical lines are led through the dielectric material to the electrical connections, and at least some of the trenches are severed.

First claim

The invention claimed is:

1. A method for producing a lighting device comprising:
embedding a plurality of semiconductor emitters arranged alongside one another in a light-transmissive filling compound apart from a top side having their electrical connections so that a plurality of sidewalls and a bottom side of the each of the plurality of semiconductor emitters are covered by the light-transmissive filling compound, wherein the bottom side of each semiconductor emitter is opposite to the top side,
introducing trenches into the light-transmissive filling compound at the side having the electrical connections between at least two semiconductor emitters, wherein the plurality of sidewalls and the bottom surface of each of the at least two semiconductor emitters remain covered by the light-transmissive filling compound,
covering the side of the light-transmissive filling compound having the electrical connections, including the electrical connections, with a dielectric material, comprising filling and overfilling the trenches with the dielectric material,
after covering the side of the light-transmissive filling compound, leading electrical lines through the dielectric material to the electrical connections, and
severing one or more of the trenches.

2. The method as claimed in claim 1 , wherein the semiconductor emitters are fitted alongside one another on a carrier and the carrier is removed after embedding into the light-transmissive filling compound and before introducing the trenches.

3. The method as claimed in claim 2 , wherein the carrier is an adhesive film.

4. The method as claimed in claim 1 , wherein the trenches are introduced into the light-transmissive filling compound by a mechanical material removal, by a laser ablation or by an etching process.

5. The method as claimed in claim 4 , wherein the mechanical material removal is sawing.

6. The method as claimed in claim 1 , wherein the dielectric material is an optically reflective material.

7. The method as claimed in claim 1 , wherein the dielectric material is applied by a printing method.

8. The method as claimed in claim 1 , wherein the dielectric material is applied by potting.

9. The method as claimed in claim 1 , wherein the semiconductor emitters are LED chips.

10. The method as claimed in claim 1 , wherein at least one trench has a frustoconical shape.

11. The method as claimed in claim 1 , wherein filling and overfilling the trenches with the dielectric material provides electrical insulation to the top side of each the at least two semiconductor emitters.

12. The method as claimed in claim 1 , wherein leading electrical lines through the dielectric material to the electrical connections comprises forming a plurality of openings in the dielectric material and subsequently filling the plurality of openings with electrically conductive compound.

13. The method as claimed in claim 1 , wherein the severing forms a plurality of singulated packages.

14. The method as claimed in claim 13 , wherein one or more sidewalls of the singulated packages is entirely of the dielectric material.

15. The method as claimed in claim 1 , wherein the dielectric material used in the filling and overfilling does not include electrically conductive material.

16. A lighting device comprising:
a plurality of semiconductor emitters, each of said emitters having electrical connections on a top side thereof;
a light-transmissive filling compound embedding the plurality of semiconductor emitters apart from the top side;
trenches in the light-transmissive filling compound at the side and between at least two semiconductor emitters so that a plurality of sidewalls and a bottom side of the each of the plurality of semiconductor emitters are covered by the light-transmissive filling compound, wherein the bottom side of each semiconductor emitter is opposite to the top side;
dielectric material covering the light-transmissive filling compound including the electrical connections at the side so that the trenches are at least completely filled with the dielectric material; and
electrical lines leading through the dielectric material to the electrical connections;
wherein at one or more of the trenches are severed.

17. The lighting device as claimed in claim 16 , further comprising a shell-shaped reflector composed of the dielectric material, at a the base of which at least one of the plurality of semiconductor emitters is arranged, wherein the shell-shaped reflector is filled with the light-transmissive potting compound.

18. The lighting device as claimed in claim 16 , wherein the carrier is an adhesive film.

19. The lighting device as claimed in claim 16 , wherein the dielectric material is an optically reflective material.

20. The lighting device as claimed in claim 16 , wherein the semiconductor emitters are LED chips.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Schlosser Philipp
• Waldschik Andreas

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title