Light emitting device
US-9024343-B2 · May 5, 2015 · US
Light emitting apparatus and lighting apparatus
US9966509B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9966509-B2 |
| Application number | US-201514832098-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 21, 2015 |
| Priority date | Sep 12, 2014 |
| Publication date | May 8, 2018 |
| Grant date | May 8, 2018 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
Light emitting apparatus including: substrate; LED chips on substrate; sealing member sealing LED chips; buffer layer on substrate; and dam material on the top surface of buffer layer, for holding back sealing member, wherein the adhesive strength of buffer layer to substrate and the adhesive strength of dam material to buffer layer are higher than the adhesive strength of dam material to substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A light emitting apparatus comprising: a substrate on which a line is provided; a light emitting element on the substrate; a seal for sealing the light emitting element; a glass layer provided directly on the substrate, the glass layer having a ring shape and covering at least a portion of the line; and a ring-shaped dam material on a top surface of the glass layer and laterally surrounding the seal, wherein the top surface of the glass layer has a surface roughness higher than a surface roughness of a surface of the substrate. 2. The light emitting apparatus according to claim 1 , wherein the glass layer comprises an inorganic compound. 3. The light emitting apparatus according to claim 1 , wherein an adhesive strength of the glass layer to an interconnect region of the substrate and the adhesive strength of the dam material to the glass layer are higher than an adhesive strength of the dam material to the interconnect region, when the dam material is directly formed on the interconnect region, the interconnect region being a region in which the line is provided. 4. The light emitting apparatus according to claim 3 , wherein the glass layer is formed on the substrate, across the interconnect region and a region other than the interconnect region, and an adhesive strength of the glass layer to the region other than the interconnect region and the adhesive strength of the dam material to the glass layer are higher than an adhesive strength of the dam material to the region other than the interconnect region when the dam material is directly formed on the region other than the interconnect region. 5. The light emitting apparatus according to claim 1 , wherein the glass layer and the dam material are formed in ring shapes enclosing around the light emitting element when viewed from above. 6. The light emitting apparatus according to claim 1 wherein the glass layer includes a light reflector. 7. A lighting apparatus comprising the light emitting apparatus according to claim 1 ; and an illumination source which supplies power to the light emitting apparatus. 8. The light emitting apparatus according to claim 1 , wherein the surface of the substrate is a top surface of the substrate. 9. The light emitting apparatus according to claim 1 , wherein the top surface of the glass layer is flat. 10. A light emitting apparatus comprising: a substrate; a light emitting element on the substrate; a seal for sealing the light emitting element; a glass layer provided directly on the substrate and having a ring shape; and a ring-shaped dam material on a top surface of the glass layer and laterally surrounding the seal, wherein the top surface of the glass layer has a surface roughness higher than a surface roughness of a surface of the substrate, increasing an adhesive strength of the dam material.
Assignees
Inventors
Classifications
Package configurations · CPC title
Encapsulations, e.g. protective coatings · CPC title
Electricity · mapped topic
- H01L33/54Primary
Electricity · mapped topic
Electricity · mapped topic
Patent family
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9966509B2 cover?
- Light emitting apparatus including: substrate; LED chips on substrate; sealing member sealing LED chips; buffer layer on substrate; and dam material on the top surface of buffer layer, for holding back sealing member, wherein the adhesive strength of buffer layer to substrate and the adhesive strength of dam material to buffer layer are higher than the adhesive strength of dam material to subst…
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01L33/54. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 08 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).