Monolithic ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9966189-B2
Application number	US-201514640299-A
Country	US
Kind code	B2
Filing date	Mar 6, 2015
Priority date	Oct 30, 2013
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A method for manufacturing a monolithic ceramic electronic component includes the steps of preparing a first ceramic outer layer, stacking a plurality of inner electrodes and a plurality of ceramic green sheets on the first ceramic outer layer, forming an inner portion, applying first pressing in the stacking direction, forming an outer portion on the inner portion to form a second ceramic outer layer, applying second pressing in the stacking direction to form a multilayer body, cutting the mother multilayer body to obtain individual multilayer bodies, sintering the individual multilayer bodies to obtain ceramic bodies, and forming first and second outer electrodes on the outer surface of each of ceramic bodies.

First claim

What is claimed is:

1. A method for manufacturing a monolithic ceramic electronic component including a ceramic body, in which a plurality of ceramic layers are stacked and which includes first and second principal surfaces and first and second end surfaces, and first and second outer electrodes disposed on the first and second end surfaces, respectively, of the ceramic body, the method comprising the steps of:
forming a first mother ceramic outer layer;
stacking a plurality of inner electrodes and a plurality of mother ceramic green sheets on the first mother ceramic outer layer to form a mother inner layer block;
forming a mother ceramic inner portion on the mother inner layer block;
performing a first pressing by placing the mother inner layer block and the mother ceramic inner portion formed thereon directly on a rigid plate, placing an elastic sheet on the mother ceramic inner portion, and pressing the mother inner layer block from above the mother ceramic inner portion in the stacking direction;
forming a mother ceramic outer portion on the mother ceramic inner portion to form a second mother ceramic outer layer defined by the mother ceramic inner portion and the mother ceramic outer portion; and
performing a second pressing by placing a rigid body on the second mother ceramic outer layer and pressing the second mother ceramic outer layer from above the rigid body in the stacking direction to form a mother multilayer body; wherein
the plurality of inner electrodes and the plurality of mother ceramic green sheets are stacked such that one of the plurality of mother ceramic green sheets is disposed on a surface of the first mother ceramic outer layer.

2. The method for manufacturing a monolithic ceramic electronic component according to claim 1 , wherein the elastic sheet is a rubber sheet.

3. The method for manufacturing a monolithic ceramic electronic component according to claim 1 , wherein an elasticity of a pressing member placed on the mother ceramic inner portion in the step of performing a first pressing is lower than an elasticity of a pressing member placed on the second mother ceramic outer layer in the step of performing a second pressing.

4. The method for manufacturing a monolithic ceramic electronic component according to claim 1 , wherein the step of forming a mother ceramic outer portion includes placing a mother ceramic green sheet on the mother ceramic inner portion.

5. The method for manufacturing a monolithic ceramic electronic component according to claim 1 , wherein the step of forming a mother ceramic outer portion is performed by applying a slurry on the mother ceramic inner portion.

6. The method for manufacturing a monolithic ceramic electronic component according to claim 1 , wherein the second mother ceramic outer layer is thicker than the first mother ceramic outer layer.

7. The method for manufacturing a monolithic ceramic electronic component according to claim 6 , wherein the mother ceramic inner portion is thicker than the first mother ceramic outer layer.

8. The method for manufacturing a monolithic ceramic electronic component according to claim 1 , wherein a Si content of the mother ceramic outer portion is larger than a Si content of the mother ceramic inner portion.

9. The method for manufacturing a monolithic ceramic electronic component according to claim 8 , further comprising a step of forming a boundary layer between the mother ceramic inner portion and the mother ceramic outer portion, wherein Si is concentrated in the boundary layer.

10. The method for manufacturing a monolithic ceramic electronic component according to claim 8 , wherein a Mn content of the mother ceramic outer portion is smaller than Mn contents of the first mother ceramic outer layer and the mother ceramic inner portion.

11. The method for manufacturing a monolithic ceramic electronic component according to claim 10 , wherein the second mother ceramic outer layer is thicker than the first mother ceramic outer layer.

12. The method for manufacturing a monolithic ceramic electronic component according to claim 11 , wherein the mother ceramic inner portion is thicker than the first mother ceramic outer layer.

13. A method for manufacturing a monolithic ceramic electronic component including a ceramic body, in which a plurality of ceramic layers are stacked and which includes first and second principal surfaces and first and second end surfaces, and first and second outer electrodes disposed on the outer surface of the ceramic body and disposed on the first and second end surfaces, respectively, of the ceramic body, the method comprising the steps of:
forming a first mother ceramic outer layer;
stacking a plurality of inner electrodes and a plurality of mother ceramic green sheets on the first mother ceramic outer layer to form a mother inner layer block;
forming a mother ceramic inner portion on the mother inner layer block;
placing the mother inner layer block and the mother ceramic inner portion formed thereon directly on a rigid plate;
placing an elastic sheet on the mother ceramic inner portion;
pressing the mother inner layer block from above the mother ceramic inner portion in the stacking direction; and
forming a mother ceramic outer portion on the mother ceramic inner portion by applying a slurry to form a second mother ceramic outer layer defined by the mother ceramic inner portion and the mother ceramic outer portion; wherein
the plurality of inner electrodes and the plurality of mother ceramic green sheets are stacked such that one of the plurality of mother ceramic green sheets is disposed on a surface of the first mother ceramic outer layer.

14. The method for manufacturing a monolithic ceramic electronic component according to claim 13 , wherein the elastic sheet is a rubber sheet.

15. The method for manufacturing a monolithic ceramic electronic component according to claim 13 , wherein the mother ceramic inner portion is thicker than the first mother ceramic outer layer.

16. The method for manufacturing a monolithic ceramic electronic component according to claim 13 , wherein a Si content of the mother ceramic outer portion is larger than a Si content of the mother ceramic inner portion.

17. The method for manufacturing a monolithic ceramic electronic component according to claim 16 , further comprising a step of forming a boundary layer between the mother ceramic inner portion and the mother ceramic outer portion, wherein Si is concentrated in the boundary layer.

Assignees

• Murata Manufacturing Co

Inventors

• Tsutsumi Hironori

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/1209 Primary

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• B32B2457/16

  Capacitors · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title