Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates
US-11902696-B2 · Feb 13, 2024 · US
US9964446B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9964446-B2 |
| Application number | US-201415035182-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 4, 2014 |
| Priority date | Nov 6, 2013 |
| Publication date | May 8, 2018 |
| Grant date | May 8, 2018 |
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A bolometer is described. A bolometer includes a superconductor-insulator-semiconductor-superconductor structure or a superconductor-insulator-semiconductor-insulator-superconductor structure. The semiconductor comprises an electron gas in a layer of silicon, germanium or silicon-germanium alloy in which valley degeneracy is at least partially lifted. The insulator or a one or both of the insulators may comprise a layer of dielectric material. The insulator or a one or both of the insulators may comprise a layer of non-degenerately doped semiconductor.
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The invention claimed is: 1. A bolometer comprising a superconductor-insulator-semiconductor-superconductor structure or a superconductor-insulator-semiconductor-insulator-superconductor structure, wherein the semiconductor comprises an electron gas in a layer of silicon, germanium or silicon-germanium alloy in which valley degeneracy is at least partially lifted. 2. A bolometer according to claim 1 , wherein the layer of silicon, germanium or silicon-germanium is strained. 3. A bolometer according to claim 1 , wherein the silicon, germanium or silicon-germanium layer comprises a layer of n-type silicon, germanium or silicon-germanium. 4. A bolometer according to claim 3 , wherein the silicon, germanium or silicon-germanium layer is doped to a concentration of at least 1×10 19 cm −3 . 5. A bolometer according to claim 1 , wherein the silicon, germanium or silicon-germanium layer has a thickness of no more than 100 nm. 6. A bolometer according to claim 1 , wherein the silicon, germanium or silicon-germanium layer includes a delta-doped layer. 7. A bolometer according to claim 1 , wherein the silicon, germanium or silicon-germanium layer includes a quantum well. 8. A bolometer according to claim 1 , wherein the insulator or a one of or both insulators comprises a layer of dielectric material. 9. A bolometer according to claim 8 , wherein the dielectric material comprises an oxide. 10. A bolometer according to claim 8 , wherein the dielectric material comprises silicon dioxide. 11. A bolometer according to claim 8 , wherein the dielectric material comprises an oxide of the superconductor. 12. A bolometer according to claim 8 , wherein the layer of dielectric material has a thickness less than 5 nm. 13. A bolometer according to claim 1 , wherein the insulator or a one of or both insulators comprises a layer of non-degenerately-doped semiconductor. 14. A bolometer according to claim 1 , wherein the superconductor comprises aluminium. 15. Apparatus comprising: a bolometer according to claim 1 ; circuitry arranged to measure the bolometer comprising: a voltage and/or current bias source; and a sensor for measuring for current through the bolometer and/or for measuring a voltage across the bolometer. 16. Apparatus according to claim 15 , further comprising: a cryogenic system configured to cool the bolometer to a temperature no more than 4.2 K. 17. Apparatus according to claim 16 , wherein the circuitry is arranged for single photon measurement. 18. Apparatus according to claim 15 , wherein the circuitry is arranged for integrating measurement. 19. Apparatus comprising: an array of bolometers according to claim 1 supported on a common substrate. 20. An astronomical detection and imaging system comprising a bolometer according to claim 1 . 21. A biomedical detection and imaging system comprising a bolometer according to claim 1 . 22. A security screening system comprising a bolometer according to claim 1 . 23. A remote sensing system comprising a bolometer according to claim 1 . 24. A quantum information processing system comprising a bolometer according to claim 1 .
Materials; Selection of thermal materials · CPC title
using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title
Special manufacturing steps or sacrificial layers or layer structures · CPC title
Arrays · CPC title
superconductive · CPC title
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