Illumination device for preventing a removal of a module substrate and suppressing generation of a crack in the module substrate

US9964257B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9964257-B2
Application numberUS-201414510173-A
CountryUS
Kind codeB2
Filing dateOct 9, 2014
Priority dateOct 9, 2013
Publication dateMay 8, 2018
Grant dateMay 8, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface which is bonded to the mounting surface of the base through an adhesive layer. The base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate. The cover portion is provided on the protrusion.

First claim

Opening claim text (preview).

What is claimed is: 1. An illumination device, comprising: a light emitting module including a module substrate and a semiconductor light emitting element mounted to the module substrate; a base including a mounting surface on which the light emitting module is mounted; and a cover portion configured to cover an edge portion of the module substrate with a clearance between the cover portion and the edge portion and without pressing the edge portion, wherein the module substrate includes a surface which is directly bonded to the mounting surface of the base through an adhesive layer, and wherein the base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate and the cover portion is provided on the protrusion. 2. The illumination device of claim 1 , wherein a through-hole is formed in a region of the module substrate excluding a region where the semiconductor light emitting element exists, the protrusion passing through the through-hole; and the edge portion of the module substrate includes an edge of the through-hole. 3. The illumination device of claim 1 , wherein the cover portion is larger in diameter than the protrusion and is fixed to a top portion of the protrusion. 4. The illumination device of claim 2 , wherein the cover portion is larger in diameter than the protrusion and is fixed to a top portion of the protrusion. 5. The illumination device of claim 1 , wherein the cover portion is fixed to the protrusion by a shaft having a head portion and mounted to the base. 6. The illumination device of claim 2 , wherein the cover portion is fixed to the protrusion by a shaft having a head portion and mounted to the base. 7. The illumination device of claim 1 , wherein the base further includes a rib provided on the mounting surface thereof, the rib serving to position the module substrate on the mounting surface. 8. The illumination device of claim 2 , wherein the base further includes a rib provided on the mounting surface thereof, the rib serving to position the module substrate on the mounting surface. 9. The illumination device of claim 1 , wherein the module substrate is made of a ceramic material. 10. The illumination device of claim 2 , wherein the module substrate is made of a ceramic material. 11. The illumination device of claim 1 , wherein the adhesive layer is made of a thermally conductive material. 12. The illumination device of claim 2 , wherein the adhesive layer is made of a thermally conductive material. 13. The illumination device of claim 1 , wherein the adhesive layer covers only a portion of the surface of the module substrate. 14. The illumination device of claim 2 , wherein the adhesive layer covers only a portion of the surface of the module substrate. 15. The illumination device of claim 1 , further comprising: a circuit unit configured to drive the light emitting module and a circuit case accommodating and holding the circuit unit in an internal space of the circuit case, the circuit unit and the circuit case being provided at the side of a rear surface of the base opposite to the mounting surface, wherein the circuit case includes a tubular portion having an opening disposed so as to face toward the rear surface and an insulation portion interposed between the rear surface of the base and the circuit unit so as to cover the opening of the tubular portion, and the insulation portion includes a window through which the internal space of the circuit case leads to the rear surface of the base. 16. The illumination device of claim 1 , wherein the clearance is directly between the cover portion and the edge portion and comprises an empty space. 17. The illumination device of claim 16 , wherein the cover portion is above the edge portion in a vertical direction perpendicular to the surface of the module substrate, the clearance being directly between the cover portion and the edge portion in the vertical direction.

Assignees

Inventors

Classifications

  • Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm · CPC title

  • Light-emitting diodes [LED] · CPC title

  • Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings · CPC title

  • F21K9/238Primary

    Arrangement or mounting of circuit elements integrated in the light source · CPC title

  • by screwing · CPC title

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Frequently asked questions

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What does patent US9964257B2 cover?
An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface whic…
Who is the assignee on this patent?
Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification F21K9/238. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue May 08 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).