Polyamide molding material and moldings manufactured from same

Patent metadata

Field	Value
Publication number	US-9963591-B2
Application number	US-201313971376-A
Country	US
Kind code	B2
Filing date	Aug 20, 2013
Priority date	Dec 18, 2012
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

First claim

The invention claimed is:

1. A polyamide molding material having the following composition:
(A) 27 to 84.99% by weight of a polyamide mixture comprising
(A1) at least one partially aromatic, partially crystalline polyamide differing from copolyamide 6.T/6 and having a melting point in the range from 255 to 330° C.; and
(A2) at least one copolyamide 6.T/6 having a content of caprolactam of at least 50% by weight,

wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide (A2), amounts to 3 to 18% by weight with reference to the polyamide mixture;
(B) 15 to 65% by weight of at least one filling and strengthening agent;
(C) 0.01 to 3.0% by weight of at least one heat stabilizer;
(D) 0 to 5.0% by weight of at least one additive,
wherein the sum of components (A) to (D) amounts to 100% by weight, and wherein no metal salts and/or metal oxides of a transition metal of the group VB, VIB, VIIB or VIIIB of the periodic system are present in the polyamide molding material.

2. The polyamide molding material in accordance with claim 1 , wherein the polyamide molding material contains 30 to 79.9% by weight of the polyamide mixture (A).

3. The polyamide molding material in accordance with claim 1 , wherein the polyamide molding material has a storage modulus of >1000 MPa at temperatures of at least 93° C.

4. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) has a melting point in the range from 270 to 325° C., and/or a glass transition temperature in the range from 90 to 140° C.

5. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) has a solution viscosity η rel of at most 2.6.

6. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) is manufactured from
a) dicarboxylic acids which contain at least 50 mol % terephthalic acid with respect to the total quantity of the dicarboxylic acids;
b) diamines which contain at least 80 mol % aliphatic diamines having 4 to 18 carbon atoms with respect to the total quantity of the diamines, as well as optionally
c) lactams and/or aminocarboxylic acids,
wherein the copolyamide 6.T/6 is precluded.

7. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) is manufactured from
a) 50 to 100 mol % terephthalic acid and/or naphthalene dicarboxylic acid as well as 0 to 50 mol % of at least one aliphatic dicarboxylic acid having 6 to 12 carbon atoms and/or 0 to 50 mol % of at least one cycloaliphatic dicarboxylic acid having 8 to 20 carbon atoms, and/or 0 to 50 mol % isophthalic acid, with respect to the total quantity of the dicarboxylic acids,
b) 80 to 100 mol % of at least one aliphatic diamine having 4 to 18 carbon atoms, as well as 0 to 20 mol % of at least one cycloaliphatic diamine, and/or 0 to 20 mol % of at least one araliphatic diamine, with respect to the total quantity of the diamines, as well as, optionally,
c) aminocarboxylic acids and/or lactams each having 6 to 12 carbon atoms.

8. The polyamide molding material in accordance with claim 1 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) is selected from PA 4T/4I, PA 4T/6I, PA 5T/5I, PA 6T/6I, PA 6T/6I/6, PA 6T/66, PA 6T/610, PA 10T/106, PA 6T/612, PA 6T/10T, PA 6T/10I, PA 9T, PA 10T, PA 12T, PA 10T/10I, PA10T/12, PA10T/11, PA 6T/9T, PA 6T/12T, PA 6T/10T/6I, PA 6T/6I/6, PA 6T/6I/12 and mixtures thereof.

9. The polyamide molding material in accordance with claim 1 , wherein the at least one copolyamide 6.T/6 containing caprolactam (A2) has a solution viscosity η rel in the range from 1.6 to 3.0.

10. The polyamide molding material in accordance with claim 1 , wherein the at least one filling and strengthening agent (B) is selected from the group comprising
a) glass fibers and/or carbon fibers;
b) particle-like fillers, and
c) mixtures thereof.

11. The polyamide molding material in accordance with claim 1 , wherein the at least one heat stabilizer (C) is selected from the group comprising
a) compounds of monovalent or divalent copper;
b) stabilizers based on secondary aromatic amines;
c) stabilizers based on sterically hindered phenols;
d) phosphites and phosphonites as well as
e) mixtures thereof.

12. A polyamide molding material having the following composition:
(A) 27 to 79.9% by weight of a polyamide mixture comprising
(A1) PA 6T/6I/6, and
(A2) at least one copolyamide 6.T/6 having a content of caprolactam of at least 50% by weight,

wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide (A2), amounts to 8 to 18% by weight with reference to the polyamide mixture;
(B) 20 to 65% by weight glass fibers as well as phyllosilicates;
(C) 0.1 to 3.0% by weight of a heat stabilizer containing at least one compound of the monovalent or divalent copper;
(D) 0 to 5.0% by weight of at least one additive,
wherein the sum of components (A)-(D) amounts to 100% by weight.

13. A molding manufactured from a polyamide molding material in accordance with claim 1 .

14. The polyamide molding material in accordance with claim 1 , wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide 6.T/6 (A2) amounts to 5 to 18% by weight with respect to the polyamide mixture.

15. The polyamide molding material in accordance with claim 14 , wherein the sum of the caprolactam contained in polyamide (A1) and copolyamide 6.T/6 (A2) amounts to 7 to 18% by weight with respect to the polyamide mixture.

16. The polyamide molding material in accordance with claim 2 , wherein the polyamide molding material contains 35 to 70% by weight of the polyamide mixture (A).

17. The polyamide molding material in accordance with claim 3 , wherein the polyamide molding material has a storage modulus of >1000 MPa at temperatures of at least 98° C.

18. The polyamide molding material in accordance with claim 4 , wherein the at least one partially aromatic, partially crystalline polyamide (A1) has a melting point in the range from 280 to 320° C., and/or a glass transition temperature in the range from 110 to 140° C.

Assignees

• Ems Patent Ag

Inventors

• Bayer Andreas
• Lamberts Nikolai
• Hoffmann Botho
• Hewel Manfred
• Thomas Oliver

Classifications

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title

• C08L2205/02

  containing two or more polymers of the same C08L -group · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

• C08K7/14

  Glass · CPC title

• C08L77/06 Primary

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title