Pressure sensor die over pressure protection for high over pressure to operating span ratios

Patent metadata

Field	Value
Publication number	US-9963340-B2
Application number	US-201514958372-A
Country	US
Kind code	B2
Filing date	Dec 3, 2015
Priority date	Dec 3, 2015
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

A pressure sensor die assembly comprises a base substrate having a first surface, a stop structure on the first surface, and a diaphragm structure coupled to the first surface. The diaphragm structure comprises a first side with a cavity section including a first cavity and a second cavity surrounding the first cavity; a pressure sensing diaphragm portion having a first thickness and defined by the first cavity; and an over pressure diaphragm portion having a second thickness and defined by the second cavity, the second thickness greater than the first thickness. When an over pressure is applied, at least some area of the pressure sensing diaphragm portion is deflected and supported by the stop structure. As over pressure is increased, the over pressure diaphragm portion deflects and engages with the first surface such that additional area of the pressure sensing diaphragm portion is deflected and supported by the stop structure.

First claim

What is claimed is:

1. A pressure sensor die assembly, comprising:
a base substrate having a first surface;
a stop structure on the first surface of the base substrate; and
a diaphragm structure coupled to the first surface of the base substrate, the diaphragm structure comprising:
a first side with a stepped cavity section that includes a first cavity and a second cavity surrounding the first cavity, wherein the first cavity is defined by a first horizontal surface having a first elevation, and the second cavity is defined by a second horizontal surface having a second elevation that is different than the first elevation;
a pressure sensing diaphragm portion comprising the first horizontal surface and having a first thickness, the pressure sensing diaphragm portion located over and spaced apart from the stop structure, wherein the stop structure protrudes into the first cavity so as to vertically overlap with the first cavity; and
an over pressure diaphragm portion comprising the second horizontal surface and having a second thickness, the second thickness greater than the first thickness of the pressure sensing diaphragm portion;

wherein when an over pressure is applied to the diaphragm structure, at least some area of the pressure sensing diaphragm portion is deflected and supported by the stop structure, and as the over pressure is increased, the over pressure diaphragm portion deflects and engages with the first surface of the base substrate such that additional area of the pressure sensing diaphragm portion is deflected and supported by the stop structure.

2. The pressure sensor die assembly of claim 1 , wherein the base substrate, the stop structure, and the diaphragm structure each include a material comprising silicon, germanium, sapphire, a metal, or a ceramic.

3. The pressure sensor die assembly of claim 1 , wherein the over pressure diaphragm portion has a stiffness that is greater than a stiffness of the pressure sensing diaphragm portion.

4. The pressure sensor die assembly of claim 1 , wherein the first cavity has a first depth, and the second cavity has second depth that is less than the first depth.

5. The pressure sensor die assembly of claim 4 , wherein the first cavity and the second cavity are concentric circular cavities, such that the over pressure diaphragm portion has an outer circumference that is greater than an outer circumference of the pressure sensing diaphragm portion.

6. The pressure sensor die assembly of claim 4 , wherein the first cavity and the second cavity are rectangular cavities.

7. The pressure sensor die assembly of claim 1 , wherein the stop structure protrudes into a portion of the first cavity such that a gap is maintained between the stop structure and the pressure sensing diaphragm portion when no pressure is applied to the diaphragm structure.

8. The pressure sensor die assembly of claim 1 , wherein the pressure sensing diaphragm portion has a pressure sensing surface on a second side of the diaphragm structure opposite from the first side.

9. The pressure sensor die assembly of claim 8 , further comprising a plurality of piezoelectric bridge resistors coupled to the pressure sensing surface, the piezoelectric bridge resistors electrically connected to a plurality of bond pads on the diaphragm structure.

10. The pressure sensor die assembly of claim 1 , wherein the pressure sensor die assembly is configured for exposure to an over pressure of up to about twenty times full scale.

11. A pressure sensor die assembly, comprising:
a base substrate having a first surface;
a stop structure on the first surface of the base substrate; and
a diaphragm structure coupled to the first surface of the base substrate, the diaphragm structure comprising:
a first side with a cavity section that includes a first cavity and a second cavity surrounding the first cavity;
a pressure sensing diaphragm portion having a first thickness that overlaps exactly with the first cavity such that the first thickness is vertically greater in dimension than the first cavity, the pressure sensing diaphragm portion located over and spaced apart from the stop structure, wherein the stop structure protrudes into the first cavity so as to vertically overlap with the first cavity; and
an over pressure diaphragm portion having a second thickness and defined by the second cavity, the second thickness greater than the first thickness of the pressure sensing diaphragm portion.

12. The pressure sensor die assembly of claim 11 , wherein the over pressure diaphragm portion has a stiffness that is greater than a stiffness of the pressure sensing diaphragm portion.

13. The pressure sensor die assembly of claim 11 , wherein the first cavity has a first depth, and the second cavity has second depth that is less than the first depth.

14. The pressure sensor die assembly of claim 13 , wherein the first cavity and the second cavity are concentric circular cavities, such that the over pressure diaphragm portion has an outer circumference that is greater than an outer circumference of the pressure sensing diaphragm portion.

15. The pressure sensor die assembly of claim 11 , wherein the stop structure protrudes into a portion of the first cavity such that a gap is maintained between the stop structure and the pressure sensing diaphragm portion when no pressure is applied to the diaphragm structure.

16. The pressure sensor die assembly of claim 11 , wherein the pressure sensing diaphragm portion has a pressure sensing surface on a second side of the diaphragm structure opposite from the first side.

17. The pressure sensor die assembly of claim 16 , further comprising a plurality of piezoelectric bridge resistors coupled to the pressure sensing surface, the piezoelectric bridge resistors electrically connected to a plurality of bond pads on the diaphragm structure.

Assignees

• Honeywell Int Inc

Inventors

• Brown Gregory C

Classifications

• B81B3/0051 Primary

  For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H3/60) · CPC title

• B81B2203/0315

  Cavities · CPC title

• B81C1/00158

  Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039) · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• B81C2201/0143

  Focussed beam, i.e. laser, ion or e-beam · CPC title