Systems and methods for performing chemical mechanical planarization

Patent metadata

Field	Value
Publication number	US-9962801-B2
Application number	US-201414148870-A
Country	US
Kind code	B2
Filing date	Jan 7, 2014
Priority date	Jan 7, 2014
Publication date	May 8, 2018
Grant date	May 8, 2018

Abstract

Systems and methods are provided for performing chemical-mechanical planarization. An example system includes: a polishing head, a polishing pad, a slurry distribution component, and a reactant distribution component. The polishing head is configured to perform chemical-mechanical planarization on an article. The polishing pad is configured to support the article. The slurry distribution component is configured to provide a slurry on the polishing pad. The reactant distribution component is configured to provide an oxidizer material on the polishing pad to generate a plurality of radicals to react with the article.

First claim

What is claimed is:

1. A system for performing chemical-mechanical planarization (CMP) on an article, the system comprising:
a polishing head configured to hold the article;
a polishing pad;
a slurry distribution component configured to provide a slurry on the polishing pad;
a catalyst material; and
a reactant distribution component, independent of the slurry distribution component, having a single housing including an oxidizer conduit and a catalyst conduit, the reactant distribution component configured to provide an oxidizer material comprising a liquid, via the oxidizer conduit, on the polishing pad to generate a plurality of radicals to react with the article and separately providing the catalyst material, via the catalyst conduit, on the polishing pad to assist in generating the plurality of radicals, the oxidizer conduit and the catalyst conduit each being a separate conduit within the reactant distribution component delivering the oxidizer material and the catalyst material separately to the article.

2. The system of claim 1 , further comprising the oxidizer material, wherein the oxidizer material and the catalyst material are independent of the slurry.

3. The system of claim 2 , wherein conduit and the catalyst conduit define a distance therebetween less than a distance between the slurry distribution component and the reactant distribution component.

4. The system of claim 2 , wherein the oxidizer material includes hydrogen peroxide.

5. The system of claim 2 , wherein the plurality of radicals include hydroxyl radicals.

6. The system of claim 2 , wherein the plurality of radicals react with a polymer material in the article and wherein separate delivery of the oxidizer material and the catalyst material via the oxidizer conduit and the catalyst conduit, respectively, facilitates generation of the plurality of radicals at the article.

7. The system of claim 1 , wherein the polishing head is further configured to remove products generated from the reaction between the radicals and the article.

8. The system of claim 1 , further comprising a controller coupled to a device selected from the group consisting of the polishing head, the slurry distribution component, and the reactant distribution component and configured to control operation of the device.

9. The system of claim 1 , further comprising the slurry being provided by the slurry distribution component on the polishing pad.

10. The system of claim 1 , wherein the catalyst material includes an iron-based material.

11. A system for performing chemical-mechanical planarization (CMP) on an article, the system comprising:
a polishing head configured to hold the article;
a polishing pad;
a slurry distribution component configured to provide a slurry on the polishing pad;
a catalyst material;
a reactant distribution component configured to provide an oxidizer material comprising a liquid, via an oxidizer conduit, on the polishing pad to generate a plurality of radicals to react with the article, the reactant distribution component separately providing the catalyst material, via an catalyst conduit, on the polishing pad to assist in generating the plurality of radicals, the oxidizer conduit and the catalyst conduit each being a separate conduit within the reactant distribution component delivering the oxidizer material and the catalyst material separately to the article; and
an ultraviolet light source adjacent to the reactant distribution component configured to emit an incident light on the oxidizer material.

12. The system of claim 11 , further comprising the oxidizer material, wherein the reactant distribution component includes an oxidizer distribution component providing the oxidizer material on the polishing pad.

13. The system of claim 12 , wherein the reactant distribution component further includes a catalyst distribution component through which the catalyst material is provided on the polishing pad and the oxidizer distribution component and the catalyst distribution component define a distance therebetween less than a distance between the slurry distribution component and the reactant distribution component.

14. The system of claim 12 , wherein the oxidizer material includes hydrogen peroxide.

15. The system of claim 12 , wherein the plurality of radicals include hydroxyl radicals and react with a polymer material in the article and wherein separate delivery of the oxidizer material and the catalyst material via the oxidizer conduit and the catalyst conduit, respectively, facilitates generation of the plurality of radicals at the article.

16. The system of claim 11 , wherein the polishing head is further configured to remove products generated from the reaction between the radicals and the article.

17. The system of claim 11 , further comprising a controller coupled to a device selected from the group consisting of the polishing head, the slurry distribution component, and the reactant distribution component and configured to control operation of the device.

18. The system of claim 11 , further comprising the slurry being provided by the slurry distribution component on the polishing pad.

19. The system of claim 11 , wherein the catalyst material includes an iron-based material.

20. A system for performing chemical-mechanical planarization (CMP) on an article, the system comprising:
a polishing head configured to hold the article;
a polishing pad;
a slurry distribution component configured to provide a slurry on the polishing pad;
a catalyst material;
a reactant distribution component, independent of the slurry distribution component, having a single housing including an oxidizer conduit and a catalyst conduit, the reactant distribution component configured to provide an oxidizer material comprising a liquid, via the oxidizer conduit, on the polishing pad to generate a plurality of radicals to react with the article and separately providing the catalyst material, via the catalyst conduit, on the polishing pad to assist in generating the plurality of radicals, the oxidizer conduit and the catalyst conduit each being a separate conduit within the reactant distribution component delivering the oxidizer material and the catalyst material separately to the article; and
an ultraviolet light source adjacent to the reactant distribution component configured to emit an incident light on the oxidizer material.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lee Shen-Nan
• Tsai Teng-Chun
• Lu Yung-Cheng

Classifications

• H10P95/04

  Planarisation of conductive or resistive materials · CPC title

• H10P90/129

  by polishing · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P52/403

  of conductive or resistive materials · CPC title