Photoresist layer outgassing prevention
US-2024282577-A1 · Aug 22, 2024 · US
US9961776B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9961776-B2 |
| Application number | US-201214366250-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2012 |
| Priority date | Dec 19, 2011 |
| Publication date | May 1, 2018 |
| Grant date | May 1, 2018 |
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Official abstract text for this publication.
The present invention provides a photo-curable composition that requires a small mold-releasing force in a method of producing a cured product and also provides a method of producing a cured product with a small mold-releasing force. The method of producing a cured product includes applying a photo-curable composition onto a base material; pressing a mold to the photo-curable composition to form a pattern in the photo-curable composition; irradiating the photo-curable composition provided with the pattern with first light to generate a cured product having the pattern; and releasing the mold from the cured product, wherein a gas-generating region is formed from a gas-generating agent between the cured product and the mold; the gas-generating region is irradiated with second light to generate a gas in the gas-generating region; and the mold is released from the cured product after the generation of the gas or simultaneously with the generation of the gas.
Opening claim text (preview).
The invention claimed is: 1. A method of producing a circuit board, comprising: applying a photo-curable composition onto a substrate to be processed; pressing a mold to the photo-curable composition to form a pattern in the photo-curable composition; irradiating the photo-curable composition provided with the pattern with first light to generate a cured product having the pattern; forming a gas-generating region from a gas-generating agent between the cured product and the mold; irradiating the gas-generating region with second light to generate a gas in the gas-generating region; releasing the mold from the cured product after the generation of the gas or simultaneously with the generation of the gas; and forming a circuit structure on the substrate to be processed on the basis of the pattern of the cured product, wherein the gas-generating agent is a surfactant having a functional group for generating a gas. 2. The method of producing a circuit board according to claim 1 , wherein the circuit board is a semiconductor device. 3. A method of producing a cured product having a pattern of protrusions and depressions, comprising: applying a photo-curable composition onto a base material; bringing a mold having protrusions and depressions on its surface into contact with the photo-curable composition to form a pattern reversely corresponding to the protrusions and depressions of the mold in the photo-curable composition; irradiating the photo-curable composition provided with the pattern with first light to generate a cured product having the pattern; and releasing the mold from the cured product, wherein a gas-generating region is formed from a gas-generating agent between the cured product and the mold; the gas-generating region is irradiated with second light to generate a gas in the gas-generating region; the mold is released from the cured product after the generation of the gas or simultaneously with the generation of the gas; and the gas-generating agent is a fluorine-containing surfactant having a functional group for generating a gas. 4. The method of producing a cured product according to claim 3 , wherein the first light and the second light are different types from each other. 5. The method of producing a cured product according to claim 3 , wherein the irradiation with second light is performed after the irradiation with first light. 6. The method of producing a cured product according to claim 3 , wherein the mold is released from the cured product with a weaker peeling force than that necessary for releasing the mold from the cured product when the gas-generating region is not present. 7. A method of forming a pattern of protrusions and depressions in a cured product, comprising applying a photo-curable composition onto a base material; bringing a mold having protrusions and depressions on its surface into contact with the photo-curable composition to form a pattern reversely corresponding to the protrusions and depressions of the mold in the photo-curable composition; irradiating the photo-curable composition provided with the pattern with first light to generate a cured product having the pattern; and releasing the mold from the cured product, wherein a gas-generating region is formed from a gas-generating agent between the cured product and the mold; the gas-generating region is irradiated with second light to generate a gas in the gas-generating region; the mold is released from the cured product after the generation of the gas or simultaneously with the generation of the gas; and the gas-generating agent is a surfactant having a functional group for generating a gas, and the gas-generating region comprises a photocatalyst.
characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title
Patterning and lithography · CPC title
Electricity · mapped topic
Apparatus or processes for manufacturing printed circuits · CPC title
Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title
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