Stripping method of flexible substrate

Patent metadata

Field	Value
Publication number	US-9960374-B1
Application number	US-201615100317-A
Country	US
Kind code	B1
Filing date	May 13, 2016
Priority date	Apr 12, 2016
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

The present invention provides a stripping method of a flexible substrate, comprising: providing a porous metal substrate; forming a buffer layer on the porous metal substrate; forming a flexible substrate on the buffer layer; putting the flexible substrate in the electrolytic tank so that the part of the porous metal substrate is immersed in the electrolyte, and the porous metal substrate is employed to be a cathode electrified to electrolyze water in the electrolyte, and the porous metal substrate will releases the hydrogen, and the flexible substrate and the buffer layer are stripped from the porous metal substrate with the acting force of the hydrogen to obtain the flexible substrate with the buffer layer at the bottom. The method is high efficient and without damaging to promote the production yield of the flexible substrate.

First claim

What is claimed is:

1. A stripping method of a flexible substrate, comprising steps of:
step 1 , providing a porous metal substrate, and the porous metal substrate is a metal substrate comprising a plurality of holes inside, and a buffer layer is formed on the porous metal substrate;
step 2 , forming a flexible substrate on the buffer layer;
step 3 , providing an electrolytic device, and the electrolytic device comprises an electrolytic tank and an anode located in the electrolytic tank;
step 4 , loading electrolyte in the electrolytic tank of the electrolytic device;
a multiple layer plate comprising the flexible substrate, the buffer layer and the porous metal substrate which is manufactured in the step 2 is put in the electrolytic tank in a manner that the porous metal substrate faces downward to make the porous metal substrate contact with the electrolyte, and the porous metal substrate is employed to be a cathode, and a power source is applied between the porous metal substrate and the anode to electrolyze water in the electrolyte, and the water near the porous metal substrate and in the holes inside the porous metal substrate is electrolyzed to generate hydrogen, and the hydrogen applies an acting force to the buffer layer to strip the buffer layer from the porous metal substrate to obtain the flexible substrate with the buffer layer at the bottom.

2. The stripping method of the flexible substrate according to claim 1 , wherein material of the porous metal substrate is iron, nickel or copper.

3. The stripping method of the flexible substrate according to claim 1 , wherein material of the buffer layer is a silicon oxide layer, a silicon nitride layer or a composite layer superimposed with the silicon oxide layer and the silicon nitride layer.

4. The stripping method of the flexible substrate according to claim 3 , wherein in the step 1 , chemical vapor deposition is employed to form the buffer layer.

5. The stripping method of the flexible substrate according to claim 1 , wherein material of the flexible substrate is organic polymer.

6. The stripping method of the flexible substrate according to claim 5 , wherein the organic polymer is polyimide.

7. The stripping method of the flexible substrate according to claim 1 , wherein the step 2 further comprises: manufacturing an element on the flexible substrate.

8. The stripping method of the flexible substrate according to claim 1 , wherein material of the anode of the electrolytic device is carbon, platinum or gold.

9. The stripping method of the flexible substrate according to claim 1 , wherein in the step 4 , one side of the porous metal substrate away from the flexible substrate is immersed in the electrolyte, and one side close to the flexible substrate is exposed outside the electrolyte.

10. The stripping method of the flexible substrate according to claim 1 , wherein in the step 4 , the electrolyte is sulfuric acid solution, sodium hydroxide solution, sodium sulfate solution, potassium nitrate solution or water.

11. A stripping method of a flexible substrate, comprising steps of:
step 1 , providing a porous metal substrate, and the porous metal substrate is a metal substrate comprising a plurality of holes inside, and a buffer layer is formed on the porous metal substrate;
step 2 , forming a flexible substrate on the buffer layer;
step 3 , providing an electrolytic device, and the electrolytic device comprises an electrolytic tank and an anode located in the electrolytic tank;
step 4 , loading electrolyte in the electrolytic tank of the electrolytic device;
a multiple layer plate comprising the flexible substrate, the buffer layer and the porous metal substrate which is manufactured in the step 2 is put in the electrolytic tank in a manner that the porous metal substrate faces downward to make the porous metal substrate contact with the electrolyte, and the porous metal substrate is employed to be a cathode, and a power source is applied between the porous metal substrate and the anode to electrolyze water in the electrolyte, and the water near the porous metal substrate and in the holes inside the porous metal substrate is electrolyzed to generate hydrogen, and the hydrogen applies an acting force to the buffer layer to strip the buffer layer from the porous metal substrate to obtain the flexible substrate with the buffer layer at the bottom;
wherein material of the porous metal substrate is iron, nickel or copper;
wherein material of the buffer layer is a silicon oxide layer, a silicon nitride layer or a composite layer superimposed with the silicon oxide layer and the silicon nitride layer;
wherein in the step 1 , chemical vapor deposition is employed to form the buffer layer;
wherein material of the flexible substrate is organic polymer.

12. The stripping method of the flexible substrate according to claim 11 , wherein the organic polymer is polyimide.

13. The stripping method of the flexible substrate according to claim 11 , wherein the step 2 further comprises: manufacturing an element on the flexible substrate.

14. The stripping method of the flexible substrate according to claim 11 , wherein material of the anode of the electrolytic device is carbon, platinum or gold.

15. The stripping method of the flexible substrate according to claim 11 , wherein in the step 4 , one side of the porous metal substrate away from the flexible substrate is immersed in the electrolyte, and one side close to the flexible substrate is exposed outside the electrolyte.

16. The stripping method of the flexible substrate according to claim 11 , wherein in the step 4 , the electrolyte is sulfuric acid solution, sodium hydroxide solution, sodium sulfate solution, potassium nitrate solution or water.

Assignees

• Wuhan China Star Optoelectronics Technology Co Ltd

Inventors

• Fang Hong

Classifications

• H10P72/7424

  used as a support during the manufacture of self-supporting substrates · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10D84/01 Primary

  Manufacture or treatment · CPC title

• Y02E10/549

  Organic PV cells · CPC title