Wafer scale thermoelectric energy harvester having trenches for capture of eutectic material

Patent metadata

Field	Value
Publication number	US-9960336-B2
Application number	US-201514936510-A
Country	US
Kind code	B2
Filing date	Nov 9, 2015
Priority date	Jan 8, 2013
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate. In other embodiments, one or more substrates may have trenches formed therein to capture eutectic material that facilitates bonds between components from each of the substrates and prevent inadvertent short circuits that may occur between components of the circuit system.

First claim

What is claimed is:

1. A thermoelectric harvester, comprising:
a first substrate having thereon a plurality of thermoelectric legs; and
a second substrate having a plurality of mounting regions bonded with the plurality of thermoelectric legs by respective instances of a eutectic material, and a plurality of trenches in proximity to the plurality of mounting regions and configured to impede flow of adjacent instances of the eutectic material.

2. The thermoelectric harvester of claim 1 , wherein the plurality of thermoelectric legs have columnar shapes.

3. The thermoelectric harvester of claim 1 , wherein the plurality of thermoelectric legs have pyramidal shapes.

4. The thermoelectric harvester of claim 1 , wherein a first thermoelectric leg of the plurality of thermoelectric legs is formed of a single thermoelectric material.

5. The thermoelectric harvester of claim 1 , wherein a first thermoelectric leg of the plurality of thermoelectric legs is formed of a pair of thermoelectric materials of different types.

6. The thermoelectric harvester of claim 1 , wherein a first trench of the plurality of trenches circumscribes a respective mounting region.

7. The thermoelectric harvester of claim 1 , wherein a first trench of the plurality of trenches partially circumscribes a respective mounting region.

8. The thermoelectric harvester of claim 1 , wherein the second substrate is formed of a thermal conductor having an electrical insulator layer overlaying the thermal conductor, and the plurality of mounting regions are on the electrical insulator layer.

9. The thermoelectric harvester of claim 1 , wherein a first mounting region of the plurality of mounting regions has a wetting material thereon.

10. The thermoelectric harvester of claim 9 , wherein a trench of the plurality of trenches nearest the first mounting region has the wetting material thereon.

11. The thermoelectric harvester of claim 1 , wherein
the plurality of thermoelectric legs is a first plurality of thermoelectric legs, the plurality of mounting regions is a first plurality of mounting regions, and the plurality of trenches is a first plurality of trenches,
the second substrate has thereon a second plurality of thermoelectric legs; and
the first substrate has thereon a second plurality of mounting regions bonded with the second plurality of thermoelectric legs by respective instances of the eutectic material, and a second plurality of trenches formed in proximity to the second plurality of mounting regions and configured to impede flow of adjacent instances of the eutectic material.

12. A thermoelectric harvester, comprising:
a first substrate;
a plurality of thermoelectric elements on the first substrate; and
a second substrate having a plurality of mounting regions bonded with the plurality of thermoelectric elements by respective instances of a eutectic material, and a plurality of trenches in proximity to the plurality of mounting regions configured to impede flow of adjacent instances of the eutectic material.

13. The thermoelectric harvester of claim 12 , wherein the plurality of thermoelectric elements have columnar shapes.

14. The thermoelectric harvester of claim 12 , wherein the plurality of thermoelectric elements have pyramidal shapes.

15. The thermoelectric harvester of claim 12 , wherein a first thermoelectric element of the plurality of thermoelectric elements is formed of a single thermoelectric material.

16. The thermoelectric harvester of claim 12 , wherein a first thermoelectric element of the plurality of thermoelectric elements is formed of a pair of thermoelectric materials having complementary thermoelectric responses to a common thermal gradient.

17. A thermoelectric harvester, comprising:
a first substrate;
a second substrate having a plurality of mounting regions and a plurality of trenches in proximity to the mounting regions; and
a plurality of thermoelectric elements between the first and second substrates, each of the plurality of thermoelectric elements bonded with a respective mounting region by a respective instance of a eutectic material, wherein the plurality of trenches are positioned as barriers to flow of the eutectic material.

18. The thermoelectric harvester of claim 17 , wherein a first trench of the plurality of the trenches circumscribes a respective mounting region.

19. The thermoelectric harvester of claim 17 , wherein a first trench of the plurality of trenches partially circumscribes a respective mounting region.

20. The thermoelectric harvester of claim 17 , wherein each mounting region is adjacent to at least one of the plurality of trenches.

21. The thermoelectric harvester of claim 17 , wherein the plurality of thermoelectric elements have slanted profiles.

Assignees

• Analog Devices Inc

Inventors

• Cornett Jane
• Chen Baoxing
• Lane William Allan
• Mcguinness Patrick M
• Berney Helen

Classifications

• H01L35/32 Primary

  Electricity · mapped topic

• H01L35/34

  Electricity · mapped topic

• H10N10/17 Primary

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

• H10N10/01 Primary

  Manufacture or treatment · CPC title