Light-emitting apparatus

Patent metadata

Field	Value
Publication number	US-9960332-B2
Application number	US-201615240684-A
Country	US
Kind code	B2
Filing date	Aug 18, 2016
Priority date	Jun 24, 2008
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

First claim

The invention claimed is:

1. A light-emitting apparatus comprising:
a package including a first surface having a depressed portion, and a second surface opposite to said first surface;
a first external terminal and a second external terminal which are provided on said second surface, said first external terminal and said second external terminal being exposed;
a metal layer formed on said depressed portion;
a metal via being in contact with an underside of said metal layer, a thickness of said metal via being larger than that of said metal layer;
an LED chip electrically connected to said external terminals and provided above a top surface of said metal layer; and
a luminescent material-containing resin covering said LED chip,
wherein said first external terminal has a first horizontal portion extending along said second surface, and said first horizontal portion overlaps said metal layer in a direction perpendicular to said second surface such that said first horizontal portion is opposite to said metal layer.

2. The light-emitting apparatus of claim 1 , wherein said package is made of ceramic.

3. The light-emitting apparatus of claim 1 , wherein a length of said metal layer under said LED chip is longer than a length of said LED chip in a direction in which said first external terminal and said second external terminal are aligned.

4. The light-emitting apparatus of claim 1 , wherein said second external terminal has a second horizontal portion extending along said second surface.

5. The light-emitting apparatus of claim 4 ,
wherein said second horizontal portion overlaps said metal layer in a direction perpendicular to said second surface such that said second horizontal portion is opposite to said metal layer.

6. The light-emitting apparatus of claim 1 , wherein said package has a rectangular shape.

7. A light-emitting apparatus comprising:
a package including a first surface having a depressed portion, and a second surface opposite to said first surface;
a first external terminal and a second external terminal which are provided on said second surface, said first external terminal and said second external terminal being exposed;
a metal layer formed on said depressed portion;
a metal via being provided at a position lower than a position of said metal layer, said metal layer and said metal via being part of a continuous metal portion, a thickness of said metal via being larger than that of said metal layer;
an LED chip electrically connected to said external terminals and provided above a top surface of said metal layer; and
a luminescent material-containing resin covering said LED chip,
wherein said first external terminal has a first horizontal portion extending along said second surface, and said first horizontal portion overlaps said metal layer in a direction perpendicular to said second surface such that said first horizontal portion is opposite to said metal layer.

8. The light-emitting apparatus of claim 7 , wherein said package is made of ceramic.

9. The light-emitting apparatus of claim 7 , wherein a length of said metal layer under said LED chip is longer than a length of said LED chip in a direction in which said first external terminal and said second external terminal are aligned.

10. The light-emitting apparatus of claim 7 , wherein said second external terminal has a second horizontal portion extending along said second surface.

11. The light-emitting apparatus of claim 10 , wherein-said second horizontal portion overlaps said metal layer in a direction perpendicular to said second surface such that said second horizontal portion is opposite to said metal layer.

12. The light-emitting apparatus of claim 7 , wherein said package has a rectangular shape.

Assignees

• Sharp Kk

Inventors

• Konishi Masahiro
• Kondo Masaki
• Horio Takaaki
• Matsuo Takanobu
• Hata Toshio
• Ohta Kiyohisa

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/0198

  batch processes · CPC title