Method for heating a metal member, method for bonding heated metal members, and apparatus for heating a metal member

US9960144B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9960144-B2
Application numberUS-201615292598-A
CountryUS
Kind codeB2
Filing dateOct 13, 2016
Priority dateOct 15, 2015
Publication dateMay 1, 2018
Grant dateMay 1, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.

First claim

Opening claim text (preview).

What is claimed is: 1. A heating method for heating a metal member by irradiation with a heating laser light, comprising: an oxide film forming step of forming an oxide film with a predetermined thickness on a surface of the metal member; and a heating step of irradiating the metal member with the heating laser light through the oxide film and causing the metal member to absorb the heating laser light with absorption corresponding to the predetermined thickness of the oxide film to heat the metal member to a predetermined temperature; wherein the absorption has such characteristics that, in a relationship with a thickness of the oxide film, the absorption has a periodic profile with maximal and minimal values appearing alternately as the thickness increases, and that the absorption is the lowest when the thickness of the oxide film is zero, and the predetermined thickness of the oxide film that is formed with a thickness larger than zero in the oxide film forming step is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the absorption having the periodic profile, the first maximal thickness corresponds to a first maximal value of the absorption, or the maximal value of the absorption that first appears after the thickness of the oxide film increases from zero, the second maximal thickness corresponds to a second maximal value of the absorption, or the maximal value of the absorption that appears subsequent to the first maximal value, and the second minimal thickness corresponds to a second minimal value of the absorption, or the minimal value of the absorption that appears between the second maximal value and a third maximal value, or the maximal value of the absorption that appears subsequent to the second maximal value. 2. The heating method according to claim 1 , wherein the predetermined thickness of the oxide film is set in a second range or a third range, the second range is a range that includes the first maximal thickness and that is smaller than a first minimal thickness corresponding to a first minimal value, or the minimal value of the absorption that appears between the first maximal value and the second maximal value of the absorption, and the third range is a range that includes the second maximal thickness and that is larger than the first minimal thickness and smaller than the second minimal thickness. 3. The heating method according to claim 1 , wherein the metal member is made of copper, and when the thickness of the oxide film is measured by sequential electrochemical reduction analysis, the predetermined thickness of the oxide film is set in the first range of 35 nm to 360 nm. 4. The heating method according to claim 2 , wherein the metal member is made of copper, and when the thickness of the oxide film is measured by sequential electrochemical reduction analysis, the predetermined thickness of the oxide film is set in the second range of 35 nm to 135 nm or the third range of 165 nm to 360 nm. 5. The heating method according to claim 1 , wherein in the oxide film forming step, the oxide film is formed by irradiating the surface of the metal member with an oxide film formation laser light under predetermined irradiation conditions. 6. The heating method according to claim 5 , wherein in the oxide film forming step, the surface of the metal member is irradiated with the oxide film formation laser light to form a hole at an irradiated position. 7. The heating method according to claim 5 , wherein the oxide film formation laser light and the heating laser light are the same kind of laser light. 8. The heating method according to claim 5 , wherein both the oxide film formation laser light and the heating laser light are a continuous wave. 9. The heating method according to claim 5 , wherein the oxide film formation laser light is a pulse wave, and the heating laser light is a continuous wave. 10. The heating method according to claim 5 , wherein the oxide film forming step includes a temperature measuring step of measuring a temperature of the surface of the metal member when the surface is irradiated with the oxide film formation laser light, an irradiation time measuring step of measuring an irradiation time of the surface with the oxide film formation laser light, a thickness calculating step of calculating the thickness of the oxide film formed on the surface of the metal member as an estimated thickness based on the measured surface temperature and the measured irradiation time, and a thickness determining step of determining if the estimated thickness of the oxide film calculated in the thickness calculating step has reached the predetermined thickness, and the heating step includes a switching step of switching laser light emission from the oxide film formation laser light to the heating laser light if it is determined in the thickness determining step that the estimated thickness has reached the predetermined thickness, and a heating laser light emitting step of irradiating the surface of the metal member with the heating laser light through the oxide film to heat the metal member to the predetermined temperature. 11. The heating method according to claim 5 , wherein the oxide film forming step includes a temperature measuring step of measuring a temperature of the surface of the metal member when the surface is irradiated with the oxide film formation laser light, an irradiation time measuring step of measuring an irradiation time of the surface with the oxide film formation laser light, a thickness calculating step of calculating the thickness of the oxide film formed on the surface of the metal member as an estimated thickness based on the measured surface temperature and the measured irradiation time, a thickness determining step of determining if the estimated thickness of the oxide film calculated in the thickness calculating step has reached the predetermined thickness, an actual absorption measurement laser light emitting step of irradiating the surface of the metal member with actual absorption measurement laser light through the oxide film whose estimated thickness has been determined to have reached the predetermined thickness in the thickness determining step, a reflected laser light output measuring step of measuring output of reflected laser light, or the actual absorption measurement laser light emitted in the actual absorption measurement laser light emitting step and reflected by the surface, an actual absorption calculating step of calculating actual absorption of the heating laser light by the surface of the metal member that has the oxide film formed thereon, based on a magnitude of the output of the reflected laser light measured in the reflected laser light output measuring step, and an oxide film formation laser light irradiation condition changing step of changing the predetermined irradiation conditions with the oxide film formation laser light based on the estimated thickness, the actual absorption, and the relationship between the thickness of the oxide film and the absorption having the periodic profile. 12. The heating method according to claim 11 , wherein the oxide film forming step includes an estimated absorption calculating step of calculating estimated absorption of the heating laser light that corresponds to the estimated thickness of the oxide film that has been determined to have reached the predetermined thickness in the thickness determining step, based on the relationship between the thickness of the oxide film and the absorption having the periodic p

Assignees

Inventors

Classifications

  • Applying EM radiation, e.g. induction heating or using a laser · CPC title

  • comprising metals or metalloids, e.g. silver · CPC title

  • being semiconducting · CPC title

  • Printed circuits · CPC title

  • Non-ferrous metals or alloys · CPC title

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What does patent US9960144B2 cover?
A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the…
Who is the assignee on this patent?
Jtekt Corp
What technology area does this patent fall under?
Primary CPC classification H10W72/075. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).