Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method

Patent metadata

Field	Value
Publication number	US-9960139-B2
Application number	US-201314428582-A
Country	US
Kind code	B2
Filing date	Sep 17, 2013
Priority date	Sep 18, 2012
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

First claim

The invention claimed is:

1. An anisotropic conductive film, comprising:
a first insulating adhesive layer; and
a conductive particle-containing layer laminated on the first insulating adhesive layer and having conductive particles each contained independently in an insulating adhesive,
wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and
the air bubbles are contained in accordance with the conductive particles.

2. The anisotropic conductive film according to claim 1 , wherein, the conductive particle-containing layer has the conductive particles regularly arranged in a single layer.

3. The anisotropic conductive film according to claim 1 , wherein a part of the conductive particles is exposed at an interface surface between the conductive particle-containing layer and the first insulating adhesive layer.

4. The anisotropic conductive film according to claim 1 , wherein the conductive particle-containing layer is a photo-curable adhesive layer.

5. The anisotropic conductive film according to claim 1 , wherein the air bubbles have a size of less than 5 μm.

6. The anisotropic conductive film according to claim 1 , wherein, in the conductive particle-containing layer, a portion containing the conductive particle has a larger thickness than a portion between the conductive particles.

7. The anisotropic conductive film according to claim 6 , wherein the air bubbles are contained in depression portions formed between the conductive particles.

8. The anisotropic conductive film according to claim 1 , further comprising a second insulating adhesive layer,
wherein the conductive particles are sandwiched between the first insulating adhesive layer and the second insulating adhesive layer.

9. The anisotropic conductive film according to claim 8 , wherein the curing system of the first and second insulating adhesive layers is one of a cationic curing system, an anionic curing system and a radical curing system.

10. The anisotropic conductive film according to claim 8 , wherein a liquid composition is provided in any one of a portion between the first insulating adhesive layer and the conductive particle and a portion between the second insulating adhesive layer and the conductive particle.

11. The anisotropic conductive film according to claim 10 , wherein the liquid composition is contained in the air bubbles.

12. The anisotropic conductive film according to claim 1 , wherein, in the conductive particle-containing layer, a portion thereof below the conductive particles has a lower degree of cure than other portions thereof.

13. The anisotropic conductive film according to claim 1 , wherein the conductive particles are regularly arranged, and the air bubbles are regularly contained in accordance with the conductive particles.

14. The anisotropic conductive film according to claim 13 , wherein the conductive particles are arranged regularly as viewed from a planar perspective.

15. The anisotropic conductive film according to claim 1 , wherein the conductive particles and the air bubbles are present on one surface.

16. The anisotropic conductive film according to claim 13 , wherein the conductive particles are regularly arranged in a single layer and the air bubbles are present in an intermediate region between adjacent conductive particles.

17. The anisotropic conductive film according to claim 13 , wherein the conductive particle-containing layer has the conductive particles regularly arranged in a single layer and the air bubbles are present in a vicinity of adjacent conductive particles.

18. The anisotropic conductive film according to claim 1 , wherein the air bubbles include air bubbles having a maximum 5 length of less than 1 μm.

19. The anisotropic conductive film according to claim 18 , wherein the air bubbles form a group.

20. A method for producing an anisotropic conductive film, comprising:
arranging conductive particles in cavities of a mold to laminate a photo-curable adhesive layer of an adhesive film onto a surface of the mold, said surface having the conductive particles each arranged independently thereon, said adhesive layer being supported on a peeling substrate;
compressing the adhesive layer against the mold from an upper surface of the peeling substrate to push the adhesive layer into the cavity;
peeling the adhesive film from the mold to make a part of the conductive particle exposed at a surface of the adhesive layer and adhered thereto and form a conductive particle-containing layer having a projection-and-depression pattern molded according to the mold;
irradiating a front surface of the conductive particle-containing layer with light, said front surface having the projection-and-depression pattern to cure the front surface;
laminating a first insulating adhesive layer onto the front surface of the conductive particle-containing layer to make air bubbles contained between the conductive particle-containing layer and the first insulating adhesive layer,
wherein the air bubbles are contained in accordance with the conductive particles.

21. The method for producing an anisotropic conductive film according to claim 20 , wherein, on the surface of the adhesive layer, the conductive particles are regularly arranged in a single layer.

22. The method for producing an anisotropic conductive film according to claim 20 , wherein a trace amount of a liquid composition is coated to or sprayed on the surface of the mold, said surface having the conductive particles arranged thereon and being in a state before being laminated with the adhesive film, or the front surface of the conductive particle-containing layer, said front surface being in a state before being laminated with the first insulating adhesive layer.

23. A method for producing a connection body, the connection body being obtained by anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component by using the anisotropic conductive film according to claim 1 , the method comprising:
temporarily adhering the first insulating adhesive layer of the anisotropic conductive film onto the first electronic component;
temporarily mounting the second electronic component on a second insulating adhesive layer; and
bonding by thermocompression or light irradiation from above the second electronic component.

24. The method for producing a connection body according to claim 23 ,
wherein one surface of the conductive particle-containing layer, the one surface being in contact with the first insulating adhesive layer, is provided with a projection-and-depression pattern, and
wherein the anisotropic conductive film is temporarily stuck to the first electronic component with projection portions turned toward the first electronic component, the projection portions containing the conductive particles.

25. A connection method for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component by using the anisotropic conductive film according to claim 1 , the method comprising:
temporarily sticking the first insulating adhesive layer of the anisotropic conductive film onto the first electronic component;
temporarily mounting the second electronic component on a second insulating adhesive layer; and
bonding by thermocompression or light irradiation from

Assignees

• Dexerials Corp

Inventors

• Sato Kouichi
• Akutsu Yasushi

Classifications

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/074

  of anisotropic conductive adhesives · CPC title