Multilayer ceramic capacitor and method for manufacturing same

US9959973B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9959973-B2
Application numberUS-201514853088-A
CountryUS
Kind codeB2
Filing dateSep 14, 2015
Priority dateSep 19, 2014
Publication dateMay 1, 2018
Grant dateMay 1, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer ceramic capacitor that includes a layered body in which dielectric layers and internal electrode layers are layered alternately, an external electrode on a surface of the layered body and a plating layer on a surface of the external electrode. The external electrode contains Cu, and a protective layer containing Cu 2 O is provided at a joining portion between the external electrode and the plating layer. When heat is applied to the layered body after the external electrode is removed, a ratio of an arithmetic mean value Xa of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 350° C. with respect to an arithmetic mean value Y of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 230° C. and lower than or equal to 250° C. (Xa/Y) is less than or equal to 0.66.

First claim

Opening claim text (preview).

What is claimed is: 1. A multilayer ceramic capacitor, comprising: a layered body in which dielectric layers made of a ceramic dielectric material and internal electrode layers having a base metal as a main component thereof are layered alternately; and an external electrode having an external electrode main body on a surface of said layered body and conductively connected to said internal electrodes drawn out to the surface of said layered body, and a plating layer on a surface of said external electrode main body, said external electrode main body containing Cu; and a protective layer containing Cu 2 O at a joining portion between said external electrode main body and said plating layer, wherein, when heat is applied to said layered body after said external electrode is removed therefrom, and a quantity of hydrogen generated from said layered body is measured, a ratio of an arithmetic mean value Xa of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 350° C. with respect to an arithmetic mean value Y of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 230° C. and lower than or equal to 250° C. (Xa/Y) is less than or equal to 0.66. 2. The multilayer ceramic capacitor according to claim 1 , wherein said plating layer is a composite plating layer including an Ni-plating layer and an Sn-plating layer on said Ni-plating layer. 3. The multilayer ceramic capacitor according to claim 2 , wherein said protective layer further contains CuO. 4. The multilayer ceramic capacitor according to claim 1 , wherein said protective layer further contains CuO. 5. The multilayer ceramic capacitor according to claim 1 , wherein, when said heat is applied to said layered body after said external electrode is removed therefrom, and said quantity of the hydrogen generated from said layered body is measured, a ratio of an arithmetic mean value Xb of a quantity of hydrogen generated per unit temperature in a range of higher than or equal to 490° C. and lower than or equal to 510° C. with respect to Y (Xb/Y) is less than or equal to 0.66. 6. The multilayer ceramic capacitor according to claim 1 , wherein, when said heat is applied to said layered body after said external electrode is removed therefrom, and said quantity of the hydrogen generated from said layered body is measured, a ratio of an arithmetic mean value Xc of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 400° C. and lower than or equal to 420° C. with respect to Y (Xc/Y) is less than or equal to 0.66. 7. A multilayer ceramic capacitor, comprising: a layered body in which dielectric layers made of a ceramic dielectric material and internal electrode layers having a base metal as a main component thereof are layered alternately; and an external electrode having an external electrode main body on a surface of said layered body and conductively connected to said internal electrodes drawn out to the surface of said layered body, and a plating layer on a surface of said external electrode main body, said external electrode main body containing Cu; and a protective layer containing Cu 2 O at a joining portion between said external electrode main body and said plating layer, wherein, when heat is applied to said layered body after said external electrode is removed therefrom, and a quantity of hydrogen generated from said layered body is measured, a ratio of a maximum value Xp of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 350° C. with respect to an arithmetic mean value Y of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 230° C. and lower than or equal to 250° C. (Xp/Y) is less than or equal to 0.66. 8. The multilayer ceramic capacitor according to claim 7 , wherein said plating layer is a composite plating layer including an Ni-plating layer and an Sn-plating layer on said Ni-plating layer. 9. The multilayer ceramic capacitor according to claim 8 , wherein said protective layer further contains CuO. 10. The multilayer ceramic capacitor according to claim 7 , wherein said protective layer further contains CuO. 11. A method for manufacturing a multilayer ceramic capacitor, the method comprising: forming a layered body in which dielectric layers made of a ceramic dielectric material and internal electrode layers having a base metal as a main component are layered alternately; forming an external electrode main body on a surface of said layered body so as to be conductively connected to said internal electrodes drawn out to the surface of said layered body; forming a plating layer on a surface of said external electrode main body by electroplating to form a ceramic element main body; and heat-treating the ceramic element body under a temperature condition higher than or equal to 150° C. so as to emit hydrogen taken into said ceramic element body during said electroplating to an outside of the ceramic element main body. 12. The method for manufacturing a multilayer ceramic capacitor according to claim 11 , wherein said external electrode main body contains Cu, and the method further comprises performing an oxidation treatment to said external electrode main body containing Cu. 13. The method for manufacturing a multilayer ceramic capacitor according to claim 12 , wherein said oxidation treatment is performed under a condition in which a protective layer containing Cu 2 O or a protective layer containing Cu 2 O and CuO is formed on a surface of said external electrode main body. 14. The method for manufacturing a multilayer ceramic capacitor according to claim 11 , wherein said step of forming said plating layer includes forming an Ni-plating layer on a surface of said external electrode main body by electroplating, and forming an Sn-plating layer on a surface of said Ni-plating layer by electroplating after said heat treatment.

Assignees

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Classifications

  • based on alkaline earth titanates · CPC title

  • Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • H01G4/2325Primary

    characterised by the material of the terminals · CPC title

  • Fried electrodes · CPC title

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What does patent US9959973B2 cover?
A multilayer ceramic capacitor that includes a layered body in which dielectric layers and internal electrode layers are layered alternately, an external electrode on a surface of the layered body and a plating layer on a surface of the external electrode. The external electrode contains Cu, and a protective layer containing Cu 2 O is provided at a joining portion between the external electrode…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H01G4/2325. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).