Solid state drive apparatus

Patent metadata

Field	Value
Publication number	US-9958914-B2
Application number	US-201615188424-A
Country	US
Kind code	B2
Filing date	Jun 21, 2016
Priority date	Aug 25, 2015
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.

First claim

What is claimed is:

1. A solid state drive apparatus comprising:
a housing comprising an upper housing and a lower housing;
a heat dissipation member in the housing and comprising an isolation barrier separating first and second accommodation spaces within the housing and a plurality of fin portions that extend from the isolation barrier into the second accommodation space, wherein the isolation barrier thermally contacts and abuts the upper housing and the lower housing;
a substrate in the first accommodation space;
a solid-state drive circuit on the substrate; and
a connector mechanically attached at an edge of the substrate, electrically coupled to the solid-state drive circuit and externally accessible at a side of the housing,
where the housing has a plurality of holes therein supporting air flow through the second accommodation space.

2. The solid state drive apparatus of claim 1 , wherein the plurality of fin portions of the heat dissipation member extend from the isolation barrier towards a lateral side of the housing that is around the second accommodation space.

3. The solid state drive apparatus of claim 1 , wherein the isolation barrier and the plurality of fin portions comprise a monolithic body.

4. The solid state drive apparatus of claim 1 , wherein the substrate comprises a printed circuit board (PCB) including a heat-conducting wiring and
wherein the heat-conducting wiring of the substrate is in direct thermal contact with the isolation barrier.

5. The solid state drive apparatus of claim 4 , wherein the heat-conducting wiring of the substrate is electrically grounded.

6. The solid state drive apparatus of claim 1 , wherein the connector is disposed on an opposite side of the substrate from the heat dissipation member.

7. The solid state drive apparatus of claim 1 , wherein the heat dissipation member is adjacent to a portion of the substrate on which a controller chip of the solid-state drive circuit is located.

8. The solid state drive apparatus of claim 7 , wherein the isolation barrier comprises a first isolation barrier and a second isolation barrier extending in different directions from one another and connected to each other,
wherein the second accommodation space is arranged at an acute angle between the first and second isolation barrier, and
wherein each of the plurality of fin portions is connected to the first and second isolation barriers.

9. The solid state drive apparatus of claim 1 , wherein the solid-state drive circuit comprises at least one non-volatile memory chip that is thermally coupled to the housing via a thermal interface material (TIM).

10. A solid state drive apparatus comprising: a substrate;
a plurality of semiconductor chips including a controller chip and at least one non-volatile memory chip on the substrate;
a heat dissipation member comprising an isolation barrier, the isolation barrier isolation barrier thermally contacts and abuts an upper portion of the housing and a lower portion of the housing, the isolation barrier facing a first end of the substrate and a plurality of fin portions extending from the isolation barrier in a direction away from the substrate;
the housing enclosing the substrate and the heat dissipation member; and
a connector attached at a second end of the substrate, electrically coupled to the plurality of semiconductor chips and externally accessible at a side of the housing.

11. The solid state drive apparatus of claim 10 , wherein each of the plurality of fin portions has a planar shape and is parallel to a main surface of the substrate.

12. The solid state drive apparatus of claim 10 , wherein each of the plurality of fin portions has a planar shape and is perpendicular to a main surface of the substrate.

13. The solid state drive apparatus of claim 10 , wherein each of the plurality of fin portions has a planar shape and is oblique to a main surface of the substrate.

14. The solid state drive apparatus of claim 11 , wherein a plurality of through air holes are provided in a side of the housing adjacent to the plurality of fin portions.

15. The solid state drive apparatus of claim 14 , wherein the side of the housing comprises a lateral side of the housing that is perpendicular to a main surface of the substrate.

16. The solid state drive apparatus of claim 14 , wherein the side of the housing is parallel to a main surface of the substrate.

17. The solid state drive apparatus of claim 10 , wherein each of the plurality of semiconductor chips thermally contacts the housing with a thermal interface material (TIM) therebetween.

18. A solid state drive apparatus, comprising: a housing including a first compartment, a second compartment, an upper housing and a lower housing; a printed circuit board in the first compartment; a solid-state drive circuit on the printed circuit board; a connector attached to the printed circuit board and externally accessible at a side of the housing, an isolation barrier between the first compartment and the second compartment thermally contacting and abutting the upper housing and the lower housing, wherein the isolation barrier blocks aft flow between the first compartment and the second compartment; a heat dissipation member comprising a plurality of fins in the second compartment and thermally coupled through the isolation barrier to the printed circuit board in the first compartment; and a plurality of through air holes in a side of the housing adjacent the second compartment, the plurality of through air holes permitting airflow through the second compartment.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Jung-Hoon

Classifications

• G06F1/20 Primary

  Cooling means · CPC title