Fluid ejection apparatus with single-side thermal sensor

Patent metadata

Field	Value
Publication number	US-9956771-B2
Application number	US-201715705608-A
Country	US
Kind code	B2
Filing date	Sep 15, 2017
Priority date	Nov 26, 2013
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

An example provides a fluid ejection apparatus including a fluid feed slot to supply a fluid to a plurality of drop ejectors, a first rib at a first side of the fluid feed slot and supporting drop ejection circuitry to control ejection of drops of the fluid from the plurality of drop ejectors, and a second rib at a second side, opposite the first side, of the fluid feed slot supporting a thermal sensor to facilitate determination of a temperature of the first rib and the second rib.

First claim

What is claimed is:

1. A fluid ejection printhead comprising:
a fluid feed structure to supply a fluid to a plurality of drop ejectors;
a first rib at a first side of the fluid feed structure and supporting drop ejection circuitry to control ejection of drops of the fluid from the plurality of drop ejectors; and
a second rib at a second side, opposite the first side, of the fluid feed structure and supporting a thermal sensor to facilitate determination of a temperature of the first rib;
wherein the fluid feed structure is disposed between the first rib and the second rib; and
wherein the thermal sensor comprises a thermal sense resistor.

2. The fluid ejection printhead of claim 1 , wherein the fluid feed structure comprises a fluid feed slot.

3. The fluid ejection printhead of claim 1 , wherein the first rib is wider than the second rib.

4. The fluid ejection printhead of claim 1 , wherein the plurality of drop ejectors comprise a first plurality of drop ejectors over the first rib and a second plurality of drop ejectors over the second rib.

5. The fluid ejection printhead of claim 4 , wherein the drop ejection circuitry is to control ejection of drops from the first plurality of drop ejectors and the second plurality of drop ejectors.

6. The fluid ejection printhead of claim 1 , wherein the plurality of drop ejectors comprises a plurality of columns of the drop ejectors, and wherein a first column of the drop ejectors is disposed over the first rib and a second column of drop ejectors is disposed over the second rib.

7. The fluid ejection printhead of claim 1 , wherein the thermal sense resistor comprises a serpentine-shaped structure having a plurality of elongate portions extending along a length of the second rib and a plurality of transition regions extending along a width of the second rib.

8. The fluid ejection printhead of claim 1 , wherein the first rib is devoid of thermal sensors.

9. The fluid ejection printhead of claim 1 , further comprising a substrate including the first rib, wherein the fluid feed slot is off centered in the substrate.

10. A fluid ejection printhead comprising:
a substrate in which a printhead die is embedded; and
a fluid feed slot to supply fluid to a plurality of drop ejectors of the printhead die
the printhead die further comprising:
a first rib at a first side of the fluid feed slot and supporting drop ejection circuitry to control ejection of drops of the fluid from the plurality of drop ejectors; and
a second rib at a second side, opposite the first side, of the fluid feed slot and supporting a thermal sensor to facilitate determination of a temperature of the first rib;
wherein the thermal sensor comprises a thermal sense resistor; and
wherein the plurality of drop ejectors comprises a plurality of columns of the drop ejectors, and wherein a first column of the drop ejectors is disposed over the first rib and a second column of drop ejectors is disposed over the second rib.

11. The fluid ejection printhead of claim 10 , wherein the first rib is devoid of thermal sensors.

12. The fluid ejection printhead of claim 10 , wherein the first rib is wider than the second rib.

13. The fluid ejection printhead of claim 10 , wherein the drop ejection circuitry is to control ejection of drops from the first column of drop ejectors and the second column of drop ejectors.

14. The fluid ejection printhead of claim 10 , wherein the thermal sensor comprises a thermal sense resistor.

15. The fluid ejection printhead of claim 14 , wherein the thermal sense resistor comprises a serpentine-shaped structure having a plurality of elongate portions extending along a length of the second rib and a plurality of transition regions extending along a width of the second rib.

16. The fluid ejection printhead of claim 10 , wherein the fluid feed slot is off centered in the substrate.

17. A fluid ejection printhead comprising:
a fluid feed structure to supply a fluid to a plurality of drop ejectors;
a first rib at a first side of the fluid feed structure and supporting drop ejection circuitry to control ejection of drops of the fluid from the plurality of drop ejectors; and
a second rib at a second side, opposite the first side, of the fluid feed structure and supporting a thermal sensor to facilitate determination of a temperature of the first rib;
wherein the fluid feed structure is disposed between the first rib and the second rib;
wherein the thermal sensor comprises a thermal sense resistor; and
wherein the first rib is devoid of thermal sensors.

18. The fluid ejection printhead of claim 17 , wherein the first rib is wider than the second rib.

19. The fluid ejection printhead of claim 17 , wherein the plurality of drop ejectors comprise a first plurality of drop ejectors over the first rib and a second plurality of drop ejectors over the second rib.

20. The fluid ejection printhead of claim 19 , wherein the drop ejection circuitry is to control ejection of drops from the first plurality of drop ejectors and the second plurality of drop ejectors.

Assignees

• Hewlett Packard Development Co

Inventors

• Maxfield David

Classifications

• B41J2/04586

  controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type · CPC title

• B41J2/04563 Primary

  detecting head temperature; Ink temperature · CPC title

• B41J2/04501

  Control methods or devices therefor, e.g. driver circuits, control circuits · CPC title

• B41J2/14153 Primary

  Structures including a sensor · CPC title

• B41J2/04585

  controlling heads based on thermal bent actuators · CPC title