Decorated rigid panel

US9956704B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9956704-B2
Application numberUS-201313837143-A
CountryUS
Kind codeB2
Filing dateMar 15, 2013
Priority dateApr 19, 2012
Publication dateMay 1, 2018
Grant dateMay 1, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A panel includes a thermoset material, and an image comprising sublimation ink. The sublimation ink is absorbed in the thermoset material. The rigid component may be a rigid structure formed by the thermoset material. The panel may be for a bath or shower enclosure.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming a decorated compression molded component, the method comprising: forming a substrate of uncured thermoset material; folding the substrate over itself several times to define a multi-layer charge of the uncured thermoset material; inserting the multi-layer charge between an upper tool and a lower tool; pressing the multi-layer charge by the upper tool and the lower tool while heating the multi-layer charge by the upper and lower tools to shape and cure the multi-layer charge into a rigid, cured compression molded component having a length and width greater than a length and width of the charge; separating the upper tool from the cured component and placing a carrier with a transfer image between the compression molded component and the separated upper tool, the transfer image being formed of a sublimation ink; and transferring at least a portion of the sublimation ink to the compression molded component by pressing the carrier against the compression molded component by the upper and lower tools at a pressure above approximately 100 psi while applying heat, by the upper and lower tools and by heat from the cured compression molded component, to the sublimation ink to between approximately 300 degrees Fahrenheit and approximately 360 degrees Fahrenheit so as to cause the sublimation ink to sublimate and become absorbed into the compression molded component, thereby forming a transferred image therein, wherein during said transferring of at least a portion of the sublimation ink to the compression molded component, the upper tool is heated to a temperature that is higher than a temperature to which the lower tool is heated. 2. The method of claim 1 , wherein said transferring of the at least a portion of the sublimation ink includes heating the sublimation ink to between approximately 315 degrees Fahrenheit and approximately 345 degrees Fahrenheit. 3. The method of claim 1 , wherein said transferring of the at least a portion of the sublimation ink includes pressing the carrier against the compression molded component at a pressure between approximately 200 psi and approximately 600 psi. 4. The method of claim 1 , further comprising removing the compression molded component from between the upper tool and the lower tool, wherein said placing of the carrier occurs prior to said removing of the compression molded component. 5. The method of claim 1 , wherein during said pressing of the charge, the upper tool has a temperature of between approximately 300 degrees Fahrenheit and approximately 360 degrees Fahrenheit. 6. The method of claim 5 , wherein during said pressing of the charge, the upper tool has a temperature of between approximately 315 degrees Fahrenheit and approximately 345 degrees Fahrenheit. 7. The method of claim 5 , wherein during said pressing of the charge, the lower tool has a temperature that is between approximately 15 degrees Fahrenheit and 45 degrees Fahrenheit less than the temperature of the upper tool. 8. The method of claim 1 , wherein the compression molded component is a wall panel for a shower enclosure. 9. A method of forming a decorated compression molded component, the method comprising: forming a substrate of uncured thermoset material; folding the substrate over itself several times to define a multi-layer charge of the uncured thermoset material; inserting the multi-layer charge between an upper tool and a lower tool; pressing the multi-layer charge by the upper tool and the lower tool while heating the multi-layer charge by the upper and lower tools to shape and cure the multi-layer charge into a rigid, cured compression molded component having a length and width greater than a length and width of the charge; separating the upper tool from the cured component and inserting a carrier with an image between the compression molded component and the separated upper tool, the image being formed with a sublimation ink; pressing the carrier against the compression molded component by the upper and lower tools while applying heat, by the upper and lower tools and by heat from the cured compression molded component, to the sublimation ink so as to cause the sublimation ink to sublimate and become sufficiently absorbed in the thermoset material to form an image in the compression molded component; and removing the image-containing compression molded component from between the upper tool and the lower tool, wherein during said pressing of the multi-layer charge and during said pressing of the carrier, the upper tool is heated to a temperature that is higher than a temperature to which the lower tool is heated. 10. The method of claim 9 , wherein during said pressing of the multi-layer charge, the upper tool heats the upper surface of the charge to a temperature that is more than approximately 15 degrees Fahrenheit higher than a temperature to which the lower tool heats the lower surface of the charge. 11. The method of claim 9 , wherein the compression molded component is a wall panel for a shower enclosure. 12. The method of claim 9 , wherein forming the substrate comprises: providing a first layer of a homogeneous paste material; depositing glass fibers over the first layer of the homogeneous paste material; and applying a second layer of the homogeneous paste material over the glass fibers.

Assignees

Inventors

Classifications

  • Screens or {collapsible} cabinets {for showers or baths (A47K3/283 takes precedence)} · CPC title

  • produced by processes involving moulding · CPC title

  • selectively heating a part of the mould to achieve partial heating, differential heating · CPC title

  • characterised by aspects not provided for in groups B41M5/385 - B41M5/395 · CPC title

  • Making multilayered or multicoloured articles {(B29C43/14 takes precedence)} · CPC title

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Frequently asked questions

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What does patent US9956704B2 cover?
A panel includes a thermoset material, and an image comprising sublimation ink. The sublimation ink is absorbed in the thermoset material. The rigid component may be a rigid structure formed by the thermoset material. The panel may be for a bath or shower enclosure.
Who is the assignee on this patent?
Grunwald Steven, Kyle Jonathan, Hill Robert D, and 1 more
What technology area does this patent fall under?
Primary CPC classification B29C43/145. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).