Chemical mechanical polishing pad with internal channels
US-2016101500-A1 · Apr 14, 2016 · US
Polishing pad and polishing method
US9956669B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9956669-B2 |
| Application number | US-201414774681-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 27, 2014 |
| Priority date | Mar 12, 2013 |
| Publication date | May 1, 2018 |
| Grant date | May 1, 2018 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polishing pad comprising a polishing member having a polishing surface, wherein the polishing member comprises a material having dilatancy characteristics, the material forming the polishing surface. 2. The polishing pad according to claim 1 , wherein the material having the dilatancy characteristics comprises a resin having dilatancy characteristics, or an inorganic particle composition having dilatancy characteristics which comprises inorganic particles and medium liquid. 3. The polishing pad according to claim 2 , wherein the polishing member comprises a sheet-like fiber base material, and the sheet-like fiber base material is impregnated with the material having the dilatancy characteristics. 4. The polishing pad according to claim 2 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics fills an interior of the recess part. 5. The polishing pad according to claim 1 , wherein the material having the dilatancy characteristics comprises a resin having the dilatancy characteristics and further comprises inorganic particles. 6. The polishing pad according to claim 5 , wherein the resin having the dilatancy characteristics comprises a silicone resin having dilatancy characteristics. 7. The polishing pad according to claim 5 , wherein the polishing member comprises a sheet-like fiber base material, and the sheet-like fiber base material is impregnated with the material having the dilatancy characteristics. 8. The polishing pad according to claim 5 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics fills an interior of the recess part. 9. The polishing pad according to claim 1 , wherein the material having the dilatancy characteristics comprises a silicone resin having dilatancy characteristics. 10. The polishing pad according to claim 9 , wherein the polishing member comprises a sheet-like fiber base material, and the sheet-like fiber base material is impregnated with the material having the dilatancy characteristics. 11. The polishing pad according to claim 9 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics fills an interior of the recess part. 12. The polishing pad according to claim 1 , wherein the polishing member comprises a sheet-like fiber base material, and the sheet-like fiber base material is impregnated with the material having the dilatancy characteristics. 13. The polishing pad according to claim 12 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics fills an interior of the recess part. 14. The polishing pad according to claim 1 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics fills an interior of the recess part. 15. A polishing method comprising a step of polishing an object to be polished using a polishing surface of a polishing pad of a polishing pad, wherein the polishing member comprises a material having dilatancy characteristics, the material forming the polishing surface of the polishing member. 16. The polishing method of claim 15 , wherein the material having the dilatancy characteristics comprises a resin having dilatancy characteristics, or an inorganic particle composition having dilatancy characteristics which comprises inorganic particles and medium liquid. 17. The polishing method of claim 15 , wherein the material having the dilatancy characteristics comprises a resin having the dilatancy characteristics and further comprises inorganic particles. 18. The polishing method of claim 15 , wherein the material having the dilatancy characteristics comprises a silicon resin having the dilatancy characteristics. 19. The polishing method of claim 15 , wherein the polishing member comprises a sheet-like fiber base material, and the sheet-like fiber base material is impregnated with the material having the dilatancy characteristics. 20. The polishing method of claim 15 , wherein the polishing member comprises a base material having a recess part, and the material having the dilatancy characteristics fills an interior of the recess part.
Assignees
Inventors
Classifications
Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title
- B24D13/00Primary
Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor · CPC title
characterised by the composition or properties of the pad materials · CPC title
characterised by a multi-layered structure · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9956669B2 cover?
- The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
- Who is the assignee on this patent?
- Univ Kyushu Nat Univ Corp, Fujibo Holdings Inc
- What technology area does this patent fall under?
- Primary CPC classification B24D13/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).