Method for manufacturing a capacitive transducer

Patent metadata

Field	Value
Publication number	US-9955949-B2
Application number	US-201414463420-A
Country	US
Kind code	B2
Filing date	Aug 19, 2014
Priority date	Aug 23, 2013
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

A method for manufacturing a capacitive transducer is provided having a structure in which a vibrating film is supported to be able to vibrate. The method includes forming a sacrificial layer on a first electrode; forming a layer on the sacrificial layer, the layer forming at least part of the vibrating film; removing the sacrificial layer, including forming etching holes to communicate with the sacrificial layer; forming a sealing layer for sealing the etching holes; and etching at least part of the sealing layer. Before forming the sealing layer, an etching stop layer is formed on the layer forming at least part of the vibrating film. In the step of etching at least part of the sealing layer, the sealing layer is removed until the etching stop layer is reached.

First claim

What is claimed is:

1. A method for manufacturing a capacitive transducer including a cell having a structure in which a vibrating film including a second electrode disposed across a gap from a first electrode is supported to be able to vibrate, the method comprising the steps of:
forming an insulating layer on the first electrode;
forming a sacrificial layer on the insulating layer;
forming a layer on the sacrificial layer, the layer forming at least part of the vibrating film;
forming an etching hole to communicate with the sacrificial layer;
removing the sacrificial layer;
forming a sealing layer for sealing the etching hole; and
etching at least part of the sealing layer,
wherein before the step of removing the sacrificial layer, an etching stop layer is formed on the layer forming at least part of the vibrating film; and
in the step of etching at least part of the sealing layer, the at least part of the sealing layer is removed until the etching stop layer is reached.

2. The method according to claim 1 , wherein the vibrating film includes a first membrane and a second membrane disposed with the second electrode interposed therebetween; and
the step of forming the layer forming at least part of the vibrating film includes forming a first insulating layer including the first membrane on the sacrificial layer, forming a metal layer including the second electrode, and forming a second insulating layer including the second membrane.

3. The method according to claim 2 , wherein in the step of forming the layer forming at least part of the vibrating film, the center plane of the layer having the highest stress among the first insulating layer, the second insulating layer, and the metal layer is made closer to the gap than a center plane of the vibrating film is to the gap.

4. The method according to claim 1 , wherein the vibrating film is formed to have a tensile stress, and the etching stop layer is formed to have a compressive stress.

5. The method according to claim 1 , wherein the step of etching part of the sealing layer is followed by removing the etching stop layer.

6. The method according to claim 1 , wherein the etching stop layer is not removed.

7. The method according to claim 1 , wherein in the step of forming the sealing layer for sealing the etching hole, the sealing layer is formed by plasma-enhanced chemical vapor deposition.

8. The method according to claim 1 , wherein an insulating film is formed as the layer forming at least part of the vibrating film; and
in the step of etching part of the sealing layer, at least part of the portion of the sealing layer overlapping the gap in orthogonal projection of the sealing layer onto the first electrode, is removed until the etching stop layer is reached,
the method further comprising the step of forming, in the at least part of the portion overlapping the gap, the second electrode on the etching stop layer or on the insulating film.

9. The method according to claim 8 , wherein at least part of the portion of the etching stop layer overlapping the gap in orthogonal projection of the etching stop layer onto the first electrode is removed.

10. The method according to claim 8 , wherein the etching stop layer is an insulating layer.

11. The method according to claim 8 , wherein the insulating film and the sealing layer are made of silicon nitride, and the etching stop layer is made of silicon oxide.

12. The method according to claim 1 , wherein the etching hole are formed to extend through the etching stop layer.

13. The method according to claim 1 , wherein a material used to form the sealing layer is the same as a material used to form the vibrating film.

14. The method according to claim 1 , wherein the step of etching at least part of the sealing layer, the sealing layer on the etching stop layer is completely etched away.

15. The method according to claim 1 , wherein the etching hole passes through the etching stop layer and the layer forming at least part of the vibrating film.

Assignees

• Canon Kk

Inventors

• Torashima Kazutoshi
• Akiyama Takahiro
• Hasegawa Kenji
• Kato Kazuhiko

Classifications

• B81B2201/0271

  Resonators; ultrasonic resonators · CPC title

• H02N1/08

  with conductive charge carrier, i.e. capacitor machines · CPC title

• B06B1/0292 Primary

  Electrostatic transducers, e.g. electret-type · CPC title

• A61B5/0095

  by applying light and detecting acoustic waves, i.e. photoacoustic measurements · CPC title

• A61B8/4494 Primary

  characterised by the arrangement of the transducer elements · CPC title