Modal analysis
US-9459346-B2 · Oct 4, 2016 · US
US9955536B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9955536-B2 |
| Application number | US-201313841674-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2013 |
| Priority date | Mar 15, 2013 |
| Publication date | Apr 24, 2018 |
| Grant date | Apr 24, 2018 |
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Aspects of the present invention relate to systems and methods for customizing microwave energy distribution within a chamber to accommodate various load characteristics. Aspects of the present invention customized configurations of ports, deflectors, waveguides, conducting rods, and slots to shape and distribute energy.
Opening claim text (preview).
Having thus described the invention, what is claimed is: 1. A chamber that retains a molded part for treatment with microwave energy, the chamber comprising: a top panel constructed of a conducting material, the top panel having a first thickness and a plurality of openings extending through the top panel, wherein at least one of the plurality of openings is entirely filled with a solid dielectric material; a bottom panel oriented parallel to the top panel, the bottom panel disposed at a first height from the top panel and comprising a plurality of openings; at least one perimeter wall that extends from the top panel to the bottom panel and encloses an interior volume within the at least one perimeter wall, the top panel, and the bottom panel when the at least one perimeter wall, the top panel, and the bottom panel are assembled; at least one dielectric configured to at least partially fill the interior volume within the at least one perimeter wall, the top panel, and the bottom panel when the perimeter wall, the top panel, and the bottom panel are assembled; at least one cavity within the at least one dielectric that may retain a molded part for treatment with microwave energy, the at least one cavity conformed to contact the dielectric to the molded part; wherein the assembled chamber comprising the top panel, bottom panel, the at least one perimeter wall with a retention mechanism engaged to retain the at least one dielectric and molded part retained by the cavity at a predetermined pressure, may be placed within an applicator chamber to receive microwave energy through the plurality of openings of the top panel, the applicator chamber being at least large enough to create standing waves of microwave energy; and wherein an edge of at least one of the plurality of openings of the top panel is vertically aligned with a corresponding edge of at least one of the plurality of openings of the bottom panel. 2. The chamber of claim 1 , wherein the plurality of openings in the top panel comprise a plurality of parallel slots. 3. The chamber of claim 2 , wherein each of the plurality of parallel slots has a first width at a surface of the top panel that faces away from the interior and a second width at a surface of the top panel that faces toward the interior. 4. The chamber of claim 3 , wherein the first width is greater than the second width. 5. The chamber of claim 3 , wherein the first width is less than the second width. 6. The chamber of claim 1 , wherein the bottom panel and the at least one perimeter wall are formed from a conducting material. 7. The chamber of claim 1 , wherein the plurality of openings of the top panel are offset from the plurality of openings of the bottom panel. 8. A chamber that retains a molded part for treatment with microwave energy, the chamber comprising: a top panel constructed of a conducting material, the top panel having a first thickness and a plurality of openings extending through the top panel, each of the plurality of openings is entirely filled with one or more solid dielectric materials; a bottom panel oriented parallel to the top panel, the bottom panel disposed at a first height from the top panel and comprising a plurality of openings; at least one perimeter wall that extends from the top panel to the bottom panel and encloses an interior volume within the at least one perimeter wall, the top panel, and the bottom panel when the at least one perimeter wall, the top panel, and the bottom panel are assembled; at least one dielectric configured to at least partially fill the interior volume within the at least one perimeter wall, the top panel, and the bottom panel when the perimeter wall, the top panel, and the bottom panel are assembled; at least one cavity within the at least one dielectric that may retain a molded part for treatment with microwave energy, the at least one cavity conformed to contact the dielectric to the molded part; wherein the assembled chamber comprising the top panel, the bottom panel, the at least one perimeter wall with a retention mechanism engaged to retain the at least one dielectric and the molded part retained by the cavity at a predetermined pressure, may be placed within an applicator chamber to receive microwave energy through the plurality of openings of the top panel, the applicator chamber being at least large enough to create standing waves of microwave energy; and wherein an edge of at least one of the plurality of openings of the top panel is vertically aligned with a corresponding edge of at least one of the plurality of openings of the bottom panel. 9. The chamber of claim 8 , wherein each of the plurality of openings comprise a top portion at a surface of the top panel that faces away from the interior and a bottom portion at a surface of the top panel that faces toward the interior, the top portion being a first distance from the bottom portion. 10. The chamber of claim 9 , wherein at least one of the plurality of openings is entirely filled with a first material of the one or more solid dielectric materials, and wherein at least one of the plurality of openings is entirely filled with a second material of the one or more solid dielectric materials. 11. The chamber of claim 10 , wherein the first material comprises a dielectric constant less than a dielectric constant of the second material. 12. The chamber of claim 8 , wherein the bottom panel and the at least one perimeter wall are formed from a conducting material. 13. The chamber of claim 12 , wherein the at least one perimeter wall further comprise a plurality of openings. 14. The chamber of claim 8 , wherein one or more dielectric constants of each of the one or more solid dielectric materials fully contained within each of the plurality of openings are less than the at least one dielectric. 15. The chamber of claim 8 , wherein one or more dielectric constants of each of the one or more solid dielectric materials fully contained within each of the plurality of openings are less than a dielectric of the cavity. 16. The chamber of claim 8 , wherein one or more dielectric constants of each of the one or more solid dielectric materials comprised by each of the plurality of openings are less than a dielectric of the molded part.
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