Common mode filter

Patent metadata

Field	Value
Publication number	US-9954510-B2
Application number	US-201514952478-A
Country	US
Kind code	B2
Filing date	Nov 25, 2015
Priority date	Nov 28, 2014
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A common mode filter includes a coil part in which a plurality of insulating layers having coils formed on one surfaces thereof and containing fillers are stacked; a first cover part disposed beneath the coil part; and a second cover part disposed on the coil part, wherein surface reforming layers improving close adhesion between the insulating layers are formed on at least one surfaces of the insulating layers.

First claim

What is claimed is:

1. A common mode filter comprising:
a coil part in which a plurality of insulating layers containing fillers and having coils formed on respective surfaces thereof are stacked;
a first cover part disposed beneath the coil part; and
a second cover part disposed on the coil part,
wherein surface reforming layers improving close adhesion between the plurality of insulating layers are formed on at least one of the surfaces of the plurality of insulating layers,
wherein a plurality of anchors accommodating resins of adjacent plurality of insulating layers therein in a process of bonding the adjacent plurality of insulating layers to each other to improve adhesion therebetween are disposed on one surface of each one of the surface reforming layers.

2. The common mode filter of claim 1 , wherein the each one of the surface reforming layers contains a smaller amount of fillers than that of each one of the plurality of insulating layers or does not contain the fillers.

3. The common mode filter of claim 1 , wherein the second cover part includes:
a ground electrode disposed on the coil part;
a plurality of connection electrodes disposed on the coil part and electrically connected to the coils; and
an ESD preventing layer disposed between the plurality of connection electrodes and the ground electrode.

4. The common mode filter of claim 1 , wherein each one of the surface reforming layers has a thickness of 1.5 μm to 3.0 μm.

5. The common mode filter of claim 1 , wherein the first and second cover parts contain a magnetic resin composite containing magnetic particles.

6. The common mode filter of claim 5 , wherein the magnetic resin composite has a magnetic permeability of 20 or more.

7. The common mode filter of claim 1 , further comprising an electrostatic discharge (ESD) preventing part disposed beneath the second cover part,
wherein the ESD preventing part includes first and second ESD electrodes spaced apart from each other and an ESD preventing layer formed between the first and second ESD electrodes.

8. A common mode filter comprising:
a coil part in which a plurality of insulating layers containing fillers and having coils formed on respective surfaces thereof are stacked;
surface reforming layers formed on at least one of the surfaces of the plurality of insulating layers;
a first cover part disposed beneath the coil part; and
a second cover part disposed on the coil part,
wherein the first and second cover parts contain a magnetic resin composite containing magnetic particles, and
wherein a plurality of anchors accommodating resins of adjacent plurality of insulating layers therein in a process of bonding the adjacent plurality of insulating layers to each other to improve adhesion therebetween are disposed on one surface of each one of the surface reforming layers.

9. The common mode filter of claim 8 , wherein the magnetic resin composite has a magnetic permeability of 20 or more.

Assignees

• Samsung Electro Mech

Inventors

• Park Seung Wook
• Sim Won Chul

Classifications

• H03H7/427 Primary

  Common-mode filters (H02J3/01 and H02M1/126 takes precedence) · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title

• H01F27/2823

  Wires (H01F27/2866 takes precedence) · CPC title

• H01F17/0033

  with the coil helically wound around a magnetic core · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title