Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US9954146B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9954146-B2 |
| Application number | US-201514850168-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 10, 2015 |
| Priority date | Mar 15, 2013 |
| Publication date | Apr 24, 2018 |
| Grant date | Apr 24, 2018 |
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The present invention provides a red-light emitting phosphor having high luminous efficacy and also a manufacturing method thereof. The phosphor is a red-light emitting phosphor mainly comprising potassium fluorosilicate and having a basic surface composition represented by the formula (A): K a SiF b . The disclosed phosphor is characterized by being activated by manganese and also characterized in that the amount of manganese on the surface is not more than 0.2 mol % based on the total amount of all the elements on the surface. This phosphor can be manufactured by washing with a weak acid a product obtained by placing a silicon source to react in contact with a reaction solution containing potassium permanganate.
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The invention claimed is: 1. A red-light emitting phosphor particle, comprising potassium fluorosilicate and having a composition represented by the formula (A) at a surface thereof: K a SiF b (A), where 1.5≤a≤2.5 and 5.5≤b≤6.5, wherein the red-light emitting phosphor particle is activated by manganese, the composition as a whole is represented by the formula (B): K c (Si 1-x ,Mn x )F d (B), where 1.5≤c≤2.5, 5.5≤d≤6.5 and 0<x≤0.06 a total of an amount of manganese present on a superficial face of the red-light emitting phosphor particle and an area under the superficial face reachable by the X-ray photoelectron spectroscopy with the following conditions is not more than 0.2 mol % based on the total amount of all elements on the surface: X-ray source: AlKα line, power: 40 W, measuring area: Φ 200 μm, pass energy: wide scan: 187.85 eV (1.60 eV/step) narrow scan: 58.70 eV (0.125 ev/step), charge neutralization gun: e − in use with Art, and takeoff angle: 45°, the amounts of oxygen and fluorine in the red-light emitting phosphor particle satisfy [oxygen content]/[(fluorine content)+(oxygen content)]<0.05, and the red-light emitting phosphor particle has an internal quantum efficiency η′ of 60% or more, where the internal quantum efficiency if is calculated by the formula (II): internal quantum efficiency ( η ′ ) = ( ∫ λ · [ P ( λ ) ] d λ ) ( ∫ λ · [ E ( λ ) - R ( λ ) ] d λ ) ( II ) wherein E(λ) is the whole spectrum of light emitted by an excitation light source onto the red-light emitting phosphor particle in terms of number of photons, R(λ) is the spectrum of light emitted by the excitation light source and reflected by the red-light emitting phosphor particle in terms of the number of photons, and P(λ) is the emission spectrum of the red-light emitting phosphor particle in terms of the number of photons. 2. The red-light emitting phosphor particle according to claim 1 , having a light absorptivity of 10% or less in the wavelength range of from 600 nm to 650 nm. 3. A method for manufacturing the red-light emitting phosphor particle according to claim 2 , comprising: immersing a silicon source in a reaction solution comprising potassium permanganate and hydrogen fluoride such that the silicon source is reacted with the reaction solution and that a crystal is formed; separating the crystal from the reaction solution; washing the crystal with a weak acid after the separating; and subjecting the crystal to rinse treatment after the washing. 4. A light-emitting device, comprising: a light-emitting element radiating light in the wavelength range of from 440 nm to 470 nm; and a phosphor layer comprising the red-light emitting phosphor particle according to claim 2 . 5. The light-emitting device according to claim 4 , wherein the phosphor layer further comprises an orange- or red-light emitting phosphor particle. 6. A method for manufacturing the red-light emitting phosphor particle according to claim 1 , comprising: immersing a silicon source in a reaction solution comprising potassium permanganate and hydrogen fluoride such that the silicon source is reacted with the reaction solution and that a crystal is formed; separating the crystal from the reaction solution; washing the crystal with a weak acid after the separating; and subjecting the crystal to rinse treatment after the washing, wherein the reaction solution comprises potassium permanganate and hydrogen fluoride in a molar ratio of from 1/200 to 1/40. 7. The method according to claim 6 , wherein, in the immersing, the silicon source is immersed in the reaction solution for 20 minutes to 80 minutes. 8. The method according to claim 6 , wherein the weak acid is at least one selected from the group consisting of hydrofluoric acid, acetic acid, carbonic acid and phosphoric acid. 9. The method according to claim 6 , wherein the silicon source is at least one selected from the group consisting of single crystal silicon, polycrystal silicon, amorphous silicon, crystalline silicon dioxide and amorphous
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