Light emitting device and optical device

Patent metadata

Field	Value
Publication number	US-9954143-B2
Application number	US-201514924415-A
Country	US
Kind code	B2
Filing date	Oct 27, 2015
Priority date	Nov 19, 2010
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.

First claim

What is claimed is:

1. A light emitting device, comprising:
a substrate including a top surface;
first and second electrodes formed on the substrate;
an LED chip mounted on the first electrode, the LED chip including a top surface;
a metal wire having a first end connected to a top surface of the LED chip and a second end connected to the second electrode;
a lens including a lens part and a base part, the base part being fixed to the top surface of the substrate,
wherein the base part at least partially surrounds the lens part from a top view perspective,
the LED chip and the metal wire are accommodated in a space of a cavity formed by the base part;
the top surface of the LED chip is higher than a portion of the base part; and
a vent hole, wherein the cavity of the light emitting device communicates with an exterior space via the vent hole such that air inside the cavity can flow to the exterior space of the light emitting device via the vent hole.

2. The light emitting device according to claim 1 ,
wherein the vent hole is disposed between the substrate and the base part of the lens.

3. The light emitting device according to claim 1 ,
wherein the base part includes a bottom surface and is provided with a recess that recesses from the bottom surface, the recess defines a part of the cavity, and the LED chip is disposed in the recess.

Assignees

• Rohm Co Ltd

Inventors

• Tanuma Yuki

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title