Organic light emitting diode with a plurality composite electrode having different thicknesses

Patent metadata

Field	Value
Publication number	US-9954035-B2
Application number	US-201615226309-A
Country	US
Kind code	B2
Filing date	Aug 2, 2016
Priority date	Feb 24, 2016
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

An organic light-emitting diode (OLED) array substrate, a display device and a manufacturing method thereof are disclosed. The array substrate includes: a substrate and pixel units disposed on the substrate. Each pixel unit includes a plurality of subpixel units; each subpixel unit includes a composite electrode, an organic material functional layer and a first electrode sequentially disposed on the substrate; thicknesses of the composite electrodes of different subpixel units are different; and the composite electrode, the organic material functional layer and the first electrode in a same subpixel unit constitute a microcavity structure.

First claim

The invention claimed is:

1. An organic light-emitting diode (OLED) array substrate, comprising:
a substrate and pixel units disposed on the substrate, wherein
each pixel unit comprises a plurality of subpixel units; each subpixel unit comprises a composite electrode, an organic material functional layer and a first electrode sequentially disposed on the substrate; thicknesses of composite electrodes of the subpixel units are different; and
the composite electrode, the organic material functional layer and the first electrode in a same subpixel unit constitute a microcavity structure;
the plurality of subpixel units comprise a red (R) subpixel unit, a green (G) subpixel unit, and a blue (B) subpixel unit;
the composite electrode of the R subpixel unit comprises an R second electrode, an R first microcavity adjustment layer, an R second microcavity adjustment layer and an R reflecting layer sequentially disposed on the substrate;
the composite electrode of the G subpixel unit comprises a G second electrode, a G second microcavity adjustment layer and a G reflecting layer sequentially disposed on the substrate;
the composite electrode of the B subpixel unit comprises a B second electrode and a B reflecting layer sequentially disposed on the substrate; and
the first electrode is a transflective layer.

2. The array substrate according to claim 1 , wherein
the composite electrode of the R subpixel unit comprises an R second electrode, an R first microcavity adjustment layer, an R second microcavity adjustment layer and an R transflective layer sequentially disposed on the substrate;
the composite electrode of the G subpixel unit comprises a G second electrode, a G second microcavity adjustment layer and a G transflective layer sequentially disposed on the substrate;
the composite electrode of the B subpixel unit comprises a B second electrode and a B transflective layer sequentially disposed on the substrate; and
the first electrode is a reflecting layer.

3. The array substrate according to claim 2 , wherein each subpixel unit further comprises a connecting layer; and the connecting layer is bonded to the substrate.

4. The array substrate according to claim 2 , wherein a material of the first microcavity adjustment layer comprises a metal oxide, and a material of the second microcavity adjustment layer comprises an inorganic passivation layer material.

5. The array substrate according to claim 1 , wherein each subpixel unit further comprises a connecting layer; and the connecting layer is bonded to the substrate.

6. The array substrate according to claim 5 , wherein a material of the connecting layer comprises metal oxide.

7. The array substrate according to claim 1 , wherein a material of the first microcavity adjustment layer comprises a metal oxide, and a material of the second microcavity adjustment layer comprises an inorganic passivation layer material.

8. The array substrate according to claim 1 , further comprising: a pixel define layer (PDL) disposed on the substrate and configured to separate any two adjacent subpixel units.

9. A display device, comprising an organic light-emitting diode (OLED) array substrate according to claim 1 .

10. A manufacturing method of an organic light-emitting diode (OLED) array substrate, comprising:
forming a plurality of subpixel units on a substrate, wherein,
each subpixel unit comprises a composite electrode formed on the substrate, an organic material functional layer formed on the composite electrode, and a first electrode formed on the organic material functional layer; thicknesses of composite electrodes of the subpixel units are different; and
the composite electrode, the organic material functional layer and the first electrode in a same subpixel unit constitute a microcavity structure;
the plurality of subpixel units comprise a red (R) subpixel unit, a green (G) subpixel unit, and a blue (B) subpixel unit;
the substrate comprises a first region for accommodating the R subpixel unit, a second region for accommodating the G subpixel unit and a third region for accommodating the B subpixel unit;
forming the composite electrodes on the substrate includes:
forming a reflecting layer on the substrate, forming a second microcavity adjustment layer on the reflecting layer, and forming a first microcavity adjustment layer on the second microcavity adjustment layer;
etching the first microcavity adjustment layer located in the second region and the third region, and exposing the second microcavity adjustment layer located in the second region and the third region;
etching the second microcavity adjustment layer located in the third region, and exposing the reflecting layer located in the third region; and
forming a second electrode on the first microcavity adjustment layer located in the first region, on the second microcavity adjustment layers located in the second region, and on the reflecting layers located in the third region; and
the first electrode is a transflective layer.

11. The manufacturing method according to claim 10 , before forming the reflecting layer on the substrate, further comprising: forming a connecting layer on the substrate.

12. The manufacturing method according to claim 10 , wherein the substrate comprises a first region for accommodating the R subpixel unit, a second region for accommodating the G subpixel unit and a third region for accommodating the B subpixel unit;
forming the composite electrodes on the substrate includes:
forming a transflective layer on the substrate, forming a second microcavity adjustment layer on the transflective layer, and forming a first microcavity adjustment layer on the second microcavity adjustment layer;
etching the first microcavity adjustment layer located in the second region and the third region, and exposing the second microcavity adjustment layer located in the second region and the third region;
etching the second microcavity adjustment layer located in the third region, and exposing the transflective layer located in the third region; and
forming a second electrode on the first microcavity adjustment layer located in the first region, on the second microcavity adjustment layer located in the second region, and on the transflective layer located in the third region; and

the first electrode is a reflecting layer.

13. The manufacturing method according to claim 12 , before forming the transflective layer on the substrate, further comprising: forming a connecting layer on the substrate.

14. The manufacturing method according to claim 11 , wherein a material of the connecting layer comprises a metal oxide.

15. The manufacturing method according to claim 10 , wherein a material of the first microcavity adjustment layer comprises a metal oxide, and a material of the second microcavity adjustment layer comprises an inorganic passivation layer material.

16. The manufacturing method according to claim 10 , before forming the organic material functional layer on the composite electrode, further comprising:
separating any two adjacent subpixel units by etching, and exposing the substrate; and

forming a pixel define layer (PDL) on the exposed substrate.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Yang Yifan

Classifications

• H01L51/5206

  Electricity · mapped topic

• H01L27/3246

  Electricity · mapped topic

• H01L51/5265

  Electricity · mapped topic

• H01L51/5218

  Electricity · mapped topic

• H01L2227/323

  Electricity · mapped topic