Conductive barrier direct hybrid bonding

Patent metadata

Field	Value
Publication number	US-9953941-B2
Application number	US-201514835379-A
Country	US
Kind code	B2
Filing date	Aug 25, 2015
Priority date	Aug 25, 2015
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads capped by a second conductive barrier, aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads capped by conductive barriers formed by contact bonding of the first non-metallic region to the second non-metallic region.

First claim

The invention claimed is:

1. A method of forming a direct hybrid bond surface, comprising:
forming a first plurality of metallic contact structures in an upper surface of a first substrate, where a top surface of said first plurality of metallic contact structures is below said upper surface;
forming a first layer of conductive barrier material over said upper surface and said first plurality of metallic contact structures, said first layer of conductive barrier material comprising a first exposed portion over said upper surface; and
removing said first exposed portion of said first layer of conductive barrier material from said upper surface to leave a second exposed portion of said first layer of conductive barrier material on said first plurality of metallic contact structures and being configured to form the direct hybrid bond surface, said second exposed portion of said first layer of conductive barrier material comprising an exposed top surface disposed below said upper surface.

2. The method according to claim 1 , wherein the exposed top surface of said conductive barrier material on said plurality of metallic contact structures is below said upper surface of said substrate by less than 20 nm after said removing.

3. The method according to claim 1 , wherein the exposed top surface of said conductive barrier material on said plurality of metallic contact structures is below said upper surface of said substrate in a range of about 1-10 nm after said removing.

4. The method according to claim 1 , comprising:
forming said top surface of said metallic contact structures below said upper surface by about 5-40 nm, wherein the exposed top surface of said conductive barrier material on said plurality of metallic contact structures is 1-10 nm below said upper surface after said removing.

5. The method according to claim 1 , comprising:
forming a second layer of conductive barrier material on a bottom and sides of said metallic contact structures.

6. The method according to claim 5 , comprising:
forming said first and second layers of conductive barrier material to completely surround said metallic contact structures.

7. The method according to claim 1 , comprising:
forming said metallic contact structures in a dielectric layer on said substrate.

8. A method of bonding substrates, comprising:
forming first and second pluralities of metallic contact structures in respective upper surfaces of first and second substrates, where a first top surface of said first plurality of metallic contact structures is below said upper surface of said first substrate and a second top surface of said second plurality of metallic contact structures is below said upper surface of said second substrate;
forming respective first layers of conductive barrier material over said respective upper surfaces and said first and second pluralities of metallic contact structures and said first and second substrates, said respective first layers of conductive barrier material comprising respective first exposed portions over said respective upper surfaces of said first and second substrates;
removing said first exposed portions of said first layers of conductive barrier material from said upper surfaces of said first and second substrates to leave respective second exposed portions of said conductive barrier material on said first and second pluralities of metallic contact structures, said second exposed portions of said first layers of conductive barrier material comprising exposed top surfaces disposed below said respective upper surfaces;
directly bonding the upper surface of said first substrate to the upper surface of said second substrate; and
directly bonding the remaining portion of said conductive barrier material on said first plurality of metallic contact structures to the respective remaining portion of said conductive material on said second plurality of metallic contact structures.

9. The method according to claim 8 , comprising:
forming said first and second top surfaces below said upper surfaces of said first and second substrates, respectively, by about 5-40 nm, wherein a top surface of said conductive barrier material on said first and second pluralities of metallic contact structures is 1-10 nm below said first and second upper surfaces, respectively, after said removing.

10. The method according to claim 8 , comprising:
forming respective second layers of conductive barrier material on a bottom and sides of said first and second pluralities of metallic contact structures.

11. The method according to claim 10 , comprising:
forming said first and second layers of conductive barrier material to completely surround said metallic contact structures.

12. The method according to claim 8 , comprising:
forming said first and second pluralities of metallic contact structures in respective dielectric layers on said first and second substrates.

13. The method according to claim 8 , comprising:
removing said first layer of conductive barrier material such that a top surface of said conductive barrier material on said pluralities of metallic contact structures being below said upper surface of said first and second substrates, respectively, by less than 20 nm.

14. The method according to claim 8 , comprising:
removing said respective first layers of conductive barrier material such that a top surface of said conductive barrier material on said first and second pluralities of metallic contact structures is below said upper surface of said first and second substrates, respectively, in a range of about 1-10 nm.

15. The method according to claim 1 , wherein forming the first layer of conductive barrier material over said upper surface comprises covering an entirety of said upper surface.

Assignees

• Invensas Bonding Tech Inc

Inventors

• Enquist Paul M

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H10W72/953

  not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title